US6320762B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Fixed conductive pin for printed wiring substrate electronics case and method of manufacture therefor
Assignee: Lineage Overseas Corp
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Filing: 1999-04-09
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Granted: 2001-11-20
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Expires: 2019-04-09
Abstract
Abstract An electronics case, a method of manufacturing the same and a power module incorporating the case. In one embodiment, the case includes: (1) an enclosure including a metal substrate that forms walls of the enclosure and a dielectric material located on inner surfaces of the walls that insulate the substrate from electronics components located within the enclosure and (2) an electrically conductive pin, affixed to a sidewall of the enclosure substrate and extending to without the enclosure, that allows the substrate to be electrically coupled to a structure supporting the case for EMI (electromagnetic interference) shielding or case-grounding purposes.
Inventors
- 👤 Shiaw-Jong S. Chen
- 👤 Roger J. Hooey
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 03:55
CPC Classifications
H; H05; H05K; H05K9/00; H05K9/0007; H05K9/002; H05K9/0022; H05K9/0024; H05K9/0026; H05K1/00; H05K1/02; H05K1/0213; H05K1/0216; H05K1/0218; H05K1/14; H05K1/141; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3447
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
73 words
An electronics case, comprising: an enclosure including a metal substrate that forms walls of said enclosure and a dielectric material located on inner surfaces of said walls that insulate said substrate from electronics components located within said enclosure; and an electrically conductive pin connected to said components and extending from inside to without said enclosure, said pin allowing said components and said substrate to be electrically coupled to a structure supporting said case.
Claim 2
Dependent Claim
73 words
An electronics case, comprising: an enclosure including a metal substrate that forms walls of said enclosure and a dielectric material located on inner surfaces of said walls that insulate said substrate from electronics components located within said enclosure; and an electrically conductive pin connected to said components and extending from inside to without said enclosure, said pin allowing said components and said substrate to be electrically coupled to a structure supporting said case.
Claim 3
Dependent Claim
17 words
The case as recited in claim 1 wherein a rivet joint affixes said pin to said sidewall.
Claim 4
Dependent Claim
24 words
The case as recited in claim 1 further comprising a plurality of electrically conductive traces located on said material and insulated from said substrate.
Claim 5
Dependent Claim
23 words
The case as recited in claim 1 wherein said pin passes through an interior of said enclosure before extending to without said enclosure.
Claim 6
Dependent Claim
16 words
The case as recited in claim 1 wherein said components are components of a power converter.
Claim 7
Dependent Claim
17 words
The case as recited in claim 1 further comprising an encapsulant at least partially occupying said enclosure.
Claim 8
Dependent Claim
21 words
The case as recited in claim 1 wherein said structure is a printed circuit board having electrically conductive traces located thereon.
Claim 9
Independent Claim
74 words
A method of manufacturing an electronics case, comprising: forming walls of an enclosure with a metal substrate; depositing a dielectric material on inner surfaces of said walls to provide insulation for electronics components to be located within said enclosure; and connecting an electrically conductive pin to said components, said pin extending from inside to without said enclosure and allowing said components and said substrate to be electrically coupled to a structure supporting said case.
Claim 10
Independent Claim
74 words
A method of manufacturing an electronics case, comprising: forming walls of an enclosure with a metal substrate; depositing a dielectric material on inner surfaces of said walls to provide insulation for electronics components to be located within said enclosure; and connecting an electrically conductive pin to said components, said pin extending from inside to without said enclosure and allowing said components and said substrate to be electrically coupled to a structure supporting said case.
Claim 11
Dependent Claim
17 words
The method as recited in claim 8 wherein said affixing comprises riveting said pin to said sidewall.
Claim 12
Dependent Claim
27 words
The method as recited in claim 8 further comprising forming a plurality of electrically conductive traces on said material, said plurality of traces insulated from said substrate.
Claim 13
Dependent Claim
23 words
The method as recited in claim 8 wherein said pin passes through an interior of said enclosure before extending to without said enclosure.
Claim 14
Dependent Claim
16 words
The method as recited in claim 8 wherein said components are components of a power converter.
Claim 15
Dependent Claim
18 words
The method as recited in claim 8 further comprising at least partially filling said enclosure with an encapsulant.
Claim 16
Dependent Claim
21 words
The method as recited in claim 8 wherein said structure is a printed circuit board having electrically conductive traces located thereon.
Claim 17
Dependent Claim
80 words
A power module, comprising: an enclosure including a metal substrate that forms walls of said enclosure and a dielectric material located on inner surfaces of said walls; power converter components coupled to said material, said material insulating said substrate from said power converter components; and an electrically conductive pin connected to said components and extending to from inside without said enclosure, said pin allowing said components and said substrate to be electrically coupled to a structure supporting said power module.
Claim 18
Dependent Claim
80 words
A power module, comprising: an enclosure including a metal substrate that forms walls of said enclosure and a dielectric material located on inner surfaces of said walls; power converter components coupled to said material, said material insulating said substrate from said power converter components; and an electrically conductive pin connected to said components and extending to from inside without said enclosure, said pin allowing said components and said substrate to be electrically coupled to a structure supporting said power module.
Claim 19
Dependent Claim
18 words
The power module as recited in claim 15 wherein a rivet joint affixes said pin to said sidewall.
Claim 20
Dependent Claim
25 words
The power module as recited in claim 15 further comprising a plurality of electrically conductive traces located on said material and insulated from said substrate.
Claim 21
Dependent Claim
24 words
The power module as recited in claim 15 wherein said pin passes through an interior of said enclosure before extending to without said enclosure.
Claim 22
Dependent Claim
17 words
The power module as recited in claim 15 wherein said components are components of a power converter.
Claim 23
Dependent Claim
18 words
The power module as recited in claim 15 further comprising an encapsulant at least partially occupying said enclosure.
Claim 24
Dependent Claim
22 words
The power module as recited in claim 15 wherein said structure is a printed circuit board having electrically conductive traces located thereon.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-11-19 | 2005-05-21 | 2005-11-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-11-19 | 2009-05-21 | 2009-11-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-11-19 | 2013-05-21 | 2013-11-20 | $7700.00 | Window Closed / Lapsed |