US6303877B2
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multilayer thin-film wiring board
Assignee: Fujitsu Ltd
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Filing: 1998-07-02
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Granted: 2001-10-16
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Expires: 2018-07-02
Abstract
Abstract A multilayer thin-film wiring board including a base material provided with a plurality of wiring layers and an insulating layer laminated on the base material, and including a via formed by laminating the wiring layers so as to be provide through the insulating layer. A plurality of branching vias are provided by forming a plurality of branches in one of the wiring layers forming the via, the plurality of branching vias being placed along a direction of extension of the base material. The plurality of branching vias are joined to the one of the plurality of wiring layers which is placed at a position closest to the base material.
Inventors
- 👤 Kiyokazu Moriizumi
- 👤 Shunichi Kikuchi
- 👤 Naomi Fukunaga
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 21:41
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/115; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/62; H10W70/63; H10W70/635; H10W90/00; H10W90/701; H05K1/111; H05K1/112; H05K1/113; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/096; H05K2201/09654; H05K2201/0979; H05K3/00; H05K3/46; H05K3/4644; H05K3/467; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
157 words
A multilayer thin-film wiring board comprising a base material provided with a plurality of wiring layers and an insulating layer laminated on said base material, one of said wiring layers overlaying said base material being a ground layer, and comprising an interlayer connection via having a structure such that said wiring layers are laminated so as to be provided through said insulating layer, said plurality of wiring layers being insulated from each other by said insulating layer except at said interlayer connection via, wherein one of the wiring layers placed at a position closest to said ground layer is provided with a plurality of branches forming a plurality of branching vias, said plurality of branching vias extending said interlayer connection via and being placed along a direction of extension of said base material, and wherein said plurality of branching vias are joined to said ground layer and are insulated from an adjacent one of said wiring layers.
Claim 2
Dependent Claim
157 words
A multilayer thin-film wiring board comprising a base material provided with a plurality of wiring layers and an insulating layer laminated on said base material, one of said wiring layers overlaying said base material being a ground layer, and comprising an interlayer connection via having a structure such that said wiring layers are laminated so as to be provided through said insulating layer, said plurality of wiring layers being insulated from each other by said insulating layer except at said interlayer connection via, wherein one of the wiring layers placed at a position closest to said ground layer is provided with a plurality of branches forming a plurality of branching vias, said plurality of branching vias extending said interlayer connection via and being placed along a direction of extension of said base material, and wherein said plurality of branching vias are joined to said ground layer and are insulated from an adjacent one of said wiring layers.
Claim 3
Dependent Claim
29 words
The multilayer thin-film wiring board as claimed in claim 1 , wherein said interlayer connection via is, along with said plurality of branching vias, joined to said ground layer.
Claim 4
Dependent Claim
34 words
The multilayer thin-film wiring board as claimed in claim 1 , wherein said interlayer connection via is joined to an external connection terminal at an end part which is opposite to said base material.
Claim 5
Dependent Claim
121 words
A multilayer thin-film wiring board comprising a base material provided with a plurality of wiring layers and an insulating layer laminated on said base material, the wiring layer overlaying and arranged adjacent said base material being a ground layer, and comprising an interlayer connection via having a structure such that said wiring layers are laminated so as to be provided through said insulating layer, wherein one of the wiring layers placed at a position closest to said ground layer is provided with a plurality of branches forming a plurality of branching vias, said plurality of branching vias being placed along a direction of extension of said base material, and wherein said plurality of branching vias are joined to said ground layer.
Claim 6
Dependent Claim
121 words
A multilayer thin-film wiring board comprising a base material provided with a plurality of wiring layers and an insulating layer laminated on said base material, the wiring layer overlaying and arranged adjacent said base material being a ground layer, and comprising an interlayer connection via having a structure such that said wiring layers are laminated so as to be provided through said insulating layer, wherein one of the wiring layers placed at a position closest to said ground layer is provided with a plurality of branches forming a plurality of branching vias, said plurality of branching vias being placed along a direction of extension of said base material, and wherein said plurality of branching vias are joined to said ground layer.
References Cited (Backward Citations)
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JPH03286590A
Cited
JPH0423495A
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JPH05183271A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-10-15 | 2005-04-16 | 2005-10-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-10-15 | 2009-04-16 | 2009-10-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-10-15 | 2013-04-16 | 2013-10-16 | $7700.00 | Window Closed / Lapsed |