Abstract A manufacturing method and structure of white-light emitting diode. The chip is placed in a diode bowl doped with fluorescent glue. The bowl is then placed in a baking oven. After the baking, gold wire is respectively attached to diode pins on the bird's-eye side of the chip where not doped with fluorescent glue. Finally, the chip is masked with white light insulation glue for baking once more. It facilitates manufacturing process, increases output and improves production QC. Furthermore, the chip does not required conductive silver glue to be baked together in the bowl, so the conductive silver glue will not affect its light emission. The direct emission of color light is effectively prevented since the section not doped with fluorescent glue on the bird's-eye side is masked with white light insulation glue, in turn, light-emitting effect and brightness of white light becomes more stable.
A method of manufacturing a white-light emitting comprising the following steps: a) doping a fluorescent glue in a bowl of a diode; b) securing a light-emitting chip in said fluorescent glue; c) baking said light-emitting chip and said diode in an oven to cure said fluorescent glue, thereby ensuring anchoring of said light-emitting chip in said diode; d) connecting said light-emitting chip to two pins of said diode with gold wire; and e) using white-light insulation glue to mask connection points of said gold wire and said light-emitting chip.
Claim 2
Independent Claim
89 words
A method of manufacturing a white-light emitting comprising the following steps: a) doping a fluorescent glue in a bowl of a diode; b) securing a light-emitting chip in said fluorescent glue; c) baking said light-emitting chip and said diode in an oven to cure said fluorescent glue, thereby ensuring anchoring of said light-emitting chip in said diode; d) connecting said light-emitting chip to two pins of said diode with gold wire; and e) using white-light insulation glue to mask connection points of said gold wire and said light-emitting chip.
Claim 3
Dependent Claim
26 words
The method of claim 1 , wherein: said light-emitting chip and said diode with said fluorescent glue therein are baked in said oven for one hour.
Claim 4
Dependent Claim
19 words
The method of claim 1 , wherein: said white-light insulation glue is baked in said oven for one hour.
Claim 5
Dependent Claim
21 words
The method of claim 1 , wherein: an external see-through cover is added to cover said light-emitting chip and said diode.