US6239973B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
EMI containment for microprocessor core mounted on a card using surface mounted clips
Assignee: Intel Corp
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Filing: 2000-03-27
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Granted: 2001-05-29
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Expires: 2020-03-27
Abstract
Abstract An electronic cartridge which includes a cover that is electrically coupled to a substrate by a clip. An integrated circuit package is mounted to the substrate and at least partially enclosed by the cover. The clips and cover may be connected to a ground plane of the substrate. The cover and substrate may create a “shield” about the integrated circuit package so that any electromagnetic field that flows from the package is grounded to the substrate.
Inventors
- 👤 Scot W. Taylor
- 👤 Robert Starkston
- 👤 Charles Gealer
- 👤 Michael L. Rutigliano
- 👤 Raymond A. Krick
- 👤 John A. Rabenius
- 👤 Edmond L. Hart
- 👤 Ravi V. Mahajan
- 👤 Farukh Fares
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 06:43
CPC Classifications
H; H05; H05K; H05K9/00; H05K9/0007; H05K9/002; H05K9/0022; H05K9/0024; H05K9/0032; H05K9/0033
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
86 words
An electronic cartridge, comprising: a substrate including a plurality of surface pads situated along each edge of a perimeter of said substrate; an integrated circuit package mounted to said substrate; a connector attached to a bottom side of said substrate; a plurality of electrically conductive covers that fully enclose said integrated circuit package; and, a plurality of clips that electrically and thermally couple said plurality of covers to said substrate, each of said plurality of clips being attached to one of the plurality of surface pads.
Claim 2
Dependent Claim
86 words
An electronic cartridge, comprising: a substrate including a plurality of surface pads situated along each edge of a perimeter of said substrate; an integrated circuit package mounted to said substrate; a connector attached to a bottom side of said substrate; a plurality of electrically conductive covers that fully enclose said integrated circuit package; and, a plurality of clips that electrically and thermally couple said plurality of covers to said substrate, each of said plurality of clips being attached to one of the plurality of surface pads.
Claim 3
Dependent Claim
22 words
The ridge as recited in claim 1 , wherein said clips are deflected by at least one of said plurality of covers.
Claim 4
Dependent Claim
18 words
The cartridge as recited in claim 1 , wherein each of said plurality of clips has a C-shape.
Claim 5
Dependent Claim
26 words
The cartridge as recited in claim 3 , wherein said C-shaped clips have a base section that extends at an oblique angle from a mount section.
Claim 6
Dependent Claim
26 words
The cartridge as recited in claim 4 , wherein said C-shape clips are constructed from an electrically and thermally conductive material such as a copper material.
Claim 7
Dependent Claim
43 words
The cartridge as recited in claim 1 , wherein said plurality of covers comprise at least a top and a bottom cover with said bottom cover having an opening which fits said connector, and said top cover pressed into said plurality of clips.
Claim 8
Dependent Claim
22 words
The electronic cartridge as recited in claim 1 , wherein the connector is a plug-in connector for connection with an in-line connector.
Claim 9
Dependent Claim
29 words
The electronic cartridge as recited in claim 1 , wherein said plurality of surface pads and said plurality of clips are attached to a top surface of said substrate.
Claim 10
Independent Claim
75 words
A method for assembling an electronic cartridge, comprising: providing a substrate including plurality of surface pads situated along each edge of a perimeter of said substrate: mounting an integrated circuit package to said substrate; providing a plurality of electrically conductive covers; and electrically and thermally coupling a plurality of clips to said plurality of covers and to said substrate, each of said plurality of clips is attached to one of said plurality of surface pads.
Claim 11
Independent Claim
75 words
A method for assembling an electronic cartridge, comprising: providing a substrate including plurality of surface pads situated along each edge of a perimeter of said substrate: mounting an integrated circuit package to said substrate; providing a plurality of electrically conductive covers; and electrically and thermally coupling a plurality of clips to said plurality of covers and to said substrate, each of said plurality of clips is attached to one of said plurality of surface pads.
Claim 12
Dependent Claim
24 words
The method as recited in, claim 9 , wherein each of said plurality of clips is attached to a surface pad of said substrate.
Claim 13
Dependent Claim
21 words
The method as recited in claim 9 , wherein said top cover is fastened into the substrate and a bottom cover.
Claim 14
Dependent Claim
28 words
The method as recited in claim 11 , wherein said bottom cover has an opening which fits a plug-in connector attached to a bottom surface of said substrate.
Claim 15
Dependent Claim
55 words
The method as recited in claim 9 further comprising: coupling an electrically conductive top cover of said plurality of electrically conductive covers to at least one of said plurality of clips to allow said top cover to fully enclose said integrated circuit package; and attaching a plug-in connector to a bottom side of said substrate.
Claim 16
Dependent Claim
32 words
The method as recited in claim 13 , the method further comprising coupling an electrically conductive bottom cover to said substrate, said bottom cover having an opening which fits said plug-in connector.
Claim 17
Dependent Claim
22 words
The method as recited in claim 14 , wherein said top cover and said bottom cover fully enclose said integrated circuit package.
Claim 18
Dependent Claim
22 words
The method as recited in claim 13 wherein said plug-in connector includes a connector that makes connection through a plurality of pins.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-05-28 | 2004-11-27 | 2005-05-29 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-05-28 | 2008-11-27 | 2009-05-29 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-05-28 | 2012-11-27 | 2013-05-29 | $7700.00 | Window Closed / Lapsed |