Electron beam process during dual damascene processing

Claim 2

A process for producing a microelectronic device which comprises: (a) applying a dielectric layer onto a substrate; (b) overall exposing the dielectric layer to electron beam irradiation under conditions sufficient to cure an upper portion of the dielectric layer and render the upper portion a polish stop layer while not substantially curing a lower portion of the dielectric layer; (c) imagewise patterning the dielectric layer to form vias in the dielectric layer extending to the substrate; (d) depositing a metal into the vias and onto a top surface of the dielectric layer; (e) removing the metal from the top surface of the dielectric layer.

Claim 3

The process of claim 1 wherein the removing of metal from the top surface of the dielectric layer is conducted by chemical mechanical polishing or etching back the metal on the top surface until the polish stop layer is reached.

Claim 4

The process of claim 1 wherein the dielectric layer comprises a silicon containing polymer an alkoxysilane polymer, a silsesquioxane polymer, a siloxane polymer, a poly(arylene ether), a fluorinated poly(arylene ether), a nanoporous silica or combinations thereof.

Claim 5

The process of claim 1 wherein the substrate comprises gallium arsenide (GaAs), germanium, silicon, silicon germanium, lithium niobate and compositions containing silicon and combinations thereof.

Claim 6

The process of claim 1 wherein the electron beam exposing step is conducted at an energy level ranging from about 1 to about 30 KeV.

Claim 7

The process of claim 1 wherein the electron beam exposing step is conducted at an electron dose ranging from about 50 to about 50,000 μC/cm 2 .

Claim 8

The process of claim 1 wherein the electron beam exposing step is conducted with a wide, large beam of electron beam radiation from a large-area electron beam source.

Claim 9

The process of claim 1 wherein the electron beam exposing step is conducted with a wide, large beam of electron beam radiation from a uniform large-area electron beam source which covers an area of from about 4 square inches to about 256 square inches.

Claim 10

The process of claim 1 , wherein the metal is selected from the group consisting of aluminum, aluminum alloys, copper, copper alloys, tantalum, tungsten and titanium.

Claim 11

A process for producing a microelectronic device which comprises: (a) applying a first dielectric layer onto a substrate; (b) applying a second dielectric layer onto the first dielectric layer; (c) overall exposing the second dielectric layer to electron beam irradiation under conditions sufficient to cure the second dielectric layer and render the second dielectric layer a polish stop layer while not substantially curing the first dielectric layer; (d) imagewise patterning the first and second dielectric layers to form vias in the first and second dielectric layers extending to the substrate; (e) depositing a metal into the vias and onto a top surface of the second dielectric layer; (f) removing the metal from the top surface of the second dielectric layer.

Claim 12

A process for producing a microelectronic device which comprises: (a) applying a first dielectric layer onto a substrate; (b) applying a second dielectric layer onto the first dielectric layer; (c) overall exposing the second dielectric layer to electron beam irradiation under conditions sufficient to cure the second dielectric layer and render the second dielectric layer a polish stop layer while not substantially curing the first dielectric layer; (d) imagewise patterning the first and second dielectric layers to form vias in the first and second dielectric layers extending to the substrate; (e) depositing a metal into the vias and onto a top surface of the second dielectric layer; (f) removing the metal from the top surface of the second dielectric layer.

Claim 13

The process of claim 10 wherein the removing of metal from the top surface of the second dielectric layer is conducted by chemical mechanical polishing or etching back the metal on the top surface until the polish stop layer is reached.

Claim 14

The process of claim 10 wherein each dielectric layer comprises a silicon containing polymer an alkoxysilane polymer, a silsesquioxane polymer, a siloxane polymer, a poly(arylene ether), a fluorinated poly(arylene ether), a nanoporous silica or combinations thereof.

Claim 15

The process of claim 10 wherein the substrate comprises gallium arsenide (GaAs), germanium, silicon, silicon germanium, lithium niobate and compositions containing silicon and combinations thereof.

Claim 16

The process of claim 10 wherein the electron beam exposing step is conducted at an energy level ranging from about 1 to about 30 KeV.

Claim 17

The process of claim 10 wherein the electron beam exposing step is conducted at an electron dose ranging from about 50 to about 50,000 μC/cm 2 .

Claim 18

The process of claim 10 wherein the electron beam exposing step is conducted with a wide, large beam of electron beam radiation from a large-area electron beam source.

Claim 19

The process of claim 10 wherein the electron beam exposing step is conducted with a wide, large beam of electron beam radiation from a uniform large-area electron beam source which covers an area of from about 4 square inches to about 256 square inches.

Claim 20

The process of claim 10 , wherein the metal is selected from the group consisting of aluminum, aluminum alloys, copper, copper alloys, tantalum, tungsten and titanium.

Claim 21

A process for producing a microelectronic device which comprises: (a) applying a first dielectric layer onto a substrate; (b) overall exposing the first dielectric layer to electron beam irradiation under conditions sufficient to cure an upper portion of the first dielectric layer and render the upper portion of the first dielectric layer an etch stop layer while not substantially curing a lower portion of the first dielectric layer; (c) applying a second dielectric layer onto the first dielectric layer; (d) overall exposing an upper portion of the second dielectric layer to electron beam irradiation under conditions sufficient to cure the upper portion of the second dielectric layer and render the upper portion of the second dielectric layer a polish stop layer while not substantially curing a lower portion of the second dielectric layer; (e) imagewise patterning the second dielectric layer to form trenches in the dielectric layers extending to the first dielectric layer; (f) imagewise patterning the first dielectric layer to form vias in the first dielectric layer extending to the substrate; (g) depositing a metal into the vias, trenches and onto a top surface of the second dielectric layer; (h) removing the metal from the top surface of the second dielectric layer.

Claim 22

A process for producing a microelectronic device which comprises: (a) applying a first dielectric layer onto a substrate; (b) overall exposing the first dielectric layer to electron beam irradiation under conditions sufficient to cure an upper portion of the first dielectric layer and render the upper portion of the first dielectric layer an etch stop layer while not substantially curing a lower portion of the first dielectric layer; (c) applying a second dielectric layer onto the first dielectric layer; (d) overall exposing an upper portion of the second dielectric layer to electron beam irradiation under conditions sufficient to cure the upper portion of the second dielectric layer and render the upper portion of the second dielectric layer a polish stop layer while not substantially curing a lower portion of the second dielectric layer; (e) imagewise patterning the second dielectric layer to form trenches in the dielectric layers extending to the first dielectric layer; (f) imagewise patterning the first dielectric layer to form vias in the first dielectric layer extending to the substrate; (g) depositing a metal into the vias, trenches and onto a top surface of the second dielectric layer; (h) removing the metal from the top surface of the second dielectric layer.

Claim 23

The process of claim 19 wherein the removing of metal from the top surface of the second dielectric layer is conducted by chemical mechanical polishing or etching back the metal on the top surface until the polish stop layer is reached.

Claim 24

The process of claim 19 wherein each dielectric layer comprises a silicon containing polymer an alkoxysilane polymer, a silsesquioxane polymer, a siloxane polymer, a poly(arylene ether), a fluorinated poly(arylene ether), a nanoporous silica or combinations thereof.

Claim 25

The process of claim 19 wherein the substrate comprises gallium arsenide (GaAs), germanium, silicon, silicon germanium, lithium niobate and compositions containing silicon and combinations thereof.

Claim 26

The process of claim 19 wherein the electron beam exposing step is conducted at an energy level ranging from about 1 to about 30 KeV.

Claim 27

The process of claim 19 wherein the electron beam exposing step is conducted at an electron dose ranging from about 50 to about 50,000 μC/cm 2 .

Claim 28

The process of claim 19 wherein the electron beam exposing step is conducted with a wide, large beam of electron beam radiation from a large-area electron beam source.

Claim 29

The process of claim 19 wherein the electron beam exposing step is conducted with a wide, large beam of electron beam radiation from a uniform large-area electron beam source which covers an area of from about 4 square inches to about 256 square inches.

Claim 30

The process of claim 19 , wherein the metal is selected from the group consisting of aluminum, aluminum alloys, copper, copper alloys, tantalum, tungsten and titanium.

Claim 31

A process for producing a microelectronic device which comprises: (a) applying a first dielectric layer onto a substrate; (b) applying a second dielectric layer onto the first dielectric layer; (c) overall exposing the second dielectric layer to electron beam irradiation under conditions sufficient to cure the second dielectric layer and render the second dielectric layer an etch stop layer while not substantially curing the first dielectric layer; (d) applying a third dielectric layer onto the second dielectric layer; (e) applying a fourth dielectric layer onto the third dielectric layer; (f) overall exposing the fourth dielectric layer to electron beam irradiation under conditions sufficient to cure the fourth dielectric layer and render the fourth dielectric layer a polish stop layer while not substantially curing the third dielectric layer; (g) imagewise patterning the third and fourth dielectric layers to form trenches in the third and fourth dielectric layers extending to the second dielectric layer; (h) imagewise patterning the first and second dielectric layers to form vias in the first and second dielectric layers extending to the substrate; (i) depositing a metal into the vias, trenches and onto a top surface of the fourth dielectric layer; (j) removing the metal from the top surface of the fourth dielectric layer.

Claim 32

A process for producing a microelectronic device which comprises: (a) applying a first dielectric layer onto a substrate; (b) applying a second dielectric layer onto the first dielectric layer; (c) overall exposing the second dielectric layer to electron beam irradiation under conditions sufficient to cure the second dielectric layer and render the second dielectric layer an etch stop layer while not substantially curing the first dielectric layer; (d) applying a third dielectric layer onto the second dielectric layer; (e) applying a fourth dielectric layer onto the third dielectric layer; (f) overall exposing the fourth dielectric layer to electron beam irradiation under conditions sufficient to cure the fourth dielectric layer and render the fourth dielectric layer a polish stop layer while not substantially curing the third dielectric layer; (g) imagewise patterning the third and fourth dielectric layers to form trenches in the third and fourth dielectric layers extending to the second dielectric layer; (h) imagewise patterning the first and second dielectric layers to form vias in the first and second dielectric layers extending to the substrate; (i) depositing a metal into the vias, trenches and onto a top surface of the fourth dielectric layer; (j) removing the metal from the top surface of the fourth dielectric layer.

Claim 33

The process of claim 28 wherein the removing of metal from the top surface of the fourth dielectric layer is conducted by chemical mechanical polishing or etching back the metal on the top surface until the polish stop layer is reached.

Claim 34

The process of claim 28 wherein the dielectric layer comprises a silicon containing polymer an alkoxysilane polymer, a silsesquioxane polymer, a siloxane polymer, a poly(arylene ether), a fluorinated poly(arylene ether), a nanoporous silica or combinations thereof.

Claim 35

The process of claim 28 wherein the substrate comprises gallium arsenide (GaAs), germanium, silicon, silicon germanium, lithium niobate and compositions containing silicon and combinations thereof.

Claim 36

The process of claim 28 wherein the electron beam exposing step is conducted at an energy level ranging from about 1 to about 30 KeV.

Claim 37

The process of claim 28 wherein the electron beam exposing step is conducted at an electron dose ranging from about 50 to about 50,000 μC/cm 2 .

Claim 38

The process of claim 28 wherein the electron beam exposing step is conducted with a wide, large beam of electron beam radiation from a large-area electron beam source.

Claim 39

The process of claim 28 wherein the electron beam exposing step is conducted with a wide, large beam of electron beam radiation from a uniform large-area electron beam source which covers an area of from about 4 square inches to about 256 square inches.

Claim 40

The process of claim 28 , wherein the metal is selected from the group consisting of aluminum, aluminum alloys, copper, copper alloys, tantalum, tungsten and titanium.

Claim 41

A process for producing a microelectronic device which comprises: (a) applying a first dielectric layer onto a substrate; (b) overall exposing the first dielectric layer to electron beam irradiation under conditions sufficient to cure an upper portion of the first dielectric layer and render the upper portion of the first dielectric layer an etch stop layer while not substantially curing a lower portion of the first dielectric layer; (c) imagewise patterning the irradiated portion of the first dielectric layer to form vias extending to the lower portion of the first dielectric layer; (d) applying a second dielectric layer onto the first dielectric layer; (e) exposing an upper portion of the second dielectric layer to electron beam irradiation under conditions sufficient to cure the upper portion of the second dielectric layer and render the upper portion of the second dielectric layer a polish stop layer while not substantially curing a lower portion of the second dielectric layer; (f) imagewise patterning the second dielectric layer to form trenches in the second dielectric layers and vias in the first dielectric layer extending to the substrate; (g) depositing a metal into the vias, trenches and onto a top surface of the second dielectric layer; (h) removing the metal from the top surface of the second dielectric layer.

Claim 42

A process for producing a microelectronic device which comprises: (a) applying a first dielectric layer onto a substrate; (b) overall exposing the first dielectric layer to electron beam irradiation under conditions sufficient to cure an upper portion of the first dielectric layer and render the upper portion of the first dielectric layer an etch stop layer while not substantially curing a lower portion of the first dielectric layer; (c) imagewise patterning the irradiated portion of the first dielectric layer to form vias extending to the lower portion of the first dielectric layer; (d) applying a second dielectric layer onto the first dielectric layer; (e) exposing an upper portion of the second dielectric layer to electron beam irradiation under conditions sufficient to cure the upper portion of the second dielectric layer and render the upper portion of the second dielectric layer a polish stop layer while not substantially curing a lower portion of the second dielectric layer; (f) imagewise patterning the second dielectric layer to form trenches in the second dielectric layers and vias in the first dielectric layer extending to the substrate; (g) depositing a metal into the vias, trenches and onto a top surface of the second dielectric layer; (h) removing the metal from the top surface of the second dielectric layer.

Claim 43

A process for producing a microelectronic device which comprises: (a) applying a first dielectric layer onto a substrate; (b) applying a second dielectric layer onto the first dielectric layer; (c) overall exposing the second dielectric layer to electron beam irradiation under conditions sufficient to cure the second dielectric layer and render the second dielectric layer an etch stop layer while not substantially curing the first dielectric layer; (d) imagewise patterning the second dielectric layer to form vias extending to the first dielectric layer; (e) applying a third dielectric layer onto the second dielectric layer; (f) applying a fourth dielectric layer onto the third dielectric layer; (g) overall exposing the fourth dielectric layer to electron beam irradiation under conditions sufficient to cure the fourth dielectric layer and render the fourth dielectric layer a polish stop layer while not substantially curing the third dielectric layer; (h) imagewise patterning the third and fourth dielectric layers to form trenches in the third and fourth dielectric layers and vias in the first and second dielectric layer extending to the substrate; (i) depositing a metal into the vias, trenches and onto a top surface of the fourth dielectric layer; (j) removing the metal from the top surface of the fourth dielectric layer.

Claim 44

A process for producing a microelectronic device which comprises: (a) applying a first dielectric layer onto a substrate; (b) applying a second dielectric layer onto the first dielectric layer; (c) overall exposing the second dielectric layer to electron beam irradiation under conditions sufficient to cure the second dielectric layer and render the second dielectric layer an etch stop layer while not substantially curing the first dielectric layer; (d) imagewise patterning the second dielectric layer to form vias extending to the first dielectric layer; (e) applying a third dielectric layer onto the second dielectric layer; (f) applying a fourth dielectric layer onto the third dielectric layer; (g) overall exposing the fourth dielectric layer to electron beam irradiation under conditions sufficient to cure the fourth dielectric layer and render the fourth dielectric layer a polish stop layer while not substantially curing the third dielectric layer; (h) imagewise patterning the third and fourth dielectric layers to form trenches in the third and fourth dielectric layers and vias in the first and second dielectric layer extending to the substrate; (i) depositing a metal into the vias, trenches and onto a top surface of the fourth dielectric layer; (j) removing the metal from the top surface of the fourth dielectric layer.