Irradiation mask

Claim 1

A method of producing a radiation reflective mask comprising the steps of: providing a substrate, wherein said substrate is transparent to radiation of a selected range of wavelengths; forming a metallic layer over an upper surface of said substrate, wherein said metallic layer is reflective of said selected wavelengths of radiation; forming at least one pair of dielectric layers over an upper surface of said metallic layer, wherein said pair of dielectric layers are arranged to reflect incident radiation at said selected wavelengths; patterning said metallic layer to form apertures therein, wherein said apertures render portions of said mask transparent to said selected wavelengths of radiation; and patterning said dielectric layers to form apertures therein, wherein said apertures render portions of said mask transparent to said selected wavelengths of radiation.

Claim 2

A method of producing a radiation reflective mask comprising the steps of: providing a substrate, wherein said substrate is transparent to radiation of a selected range of wavelengths; forming a metallic layer over an upper surface of said substrate, wherein said metallic layer is reflective of said selected wavelengths of radiation; forming at least one pair of dielectric layers over an upper surface of said metallic layer, wherein said pair of dielectric layers are arranged to reflect incident radiation at said selected wavelengths; patterning said metallic layer to form apertures therein, wherein said apertures render portions of said mask transparent to said selected wavelengths of radiation; and patterning said dielectric layers to form apertures therein, wherein said apertures render portions of said mask transparent to said selected wavelengths of radiation.

Claim 8

A method of producing a radiation reflective mask comprising the steps of: providing a quartz substrate, wherein said substrate is transparent to laser radiation of a selected wavelength; forming an aluminum layer over an upper surface of said substrate, wherein said aluminum layer is reflective of said selected wavelength of laser radiation; forming a pair of dielectric layers over an upper surface of said metallic layer, wherein said pair of dielectric layers are arranged to establish a destructive interference pattern with respect to incident laser radiation at said selected wavelength, wherein said pair of dielectric layers include a low index of refraction silicon dioxide layer formed over said upper surface of said metallic layer and a high index of refraction silicon nitride layer formed over said silicon dioxide layer; and patterning said pair of dielectric layers and said aluminum metallic layer to form a series of apertures in said mask, wherein each of said apertures extend through said pair of dielectric layers and said aluminum metallic layer, and wherein said apertures render portions of said mask transparent to said selected wavelength of laser radiation.

Claim 9

A method of producing a radiation reflective mask comprising the steps of: providing a quartz substrate, wherein said substrate is transparent to laser radiation of a selected wavelength; forming an aluminum layer over an upper surface of said substrate, wherein said aluminum layer is reflective of said selected wavelength of laser radiation; forming a pair of dielectric layers over an upper surface of said metallic layer, wherein said pair of dielectric layers are arranged to establish a destructive interference pattern with respect to incident laser radiation at said selected wavelength, wherein said pair of dielectric layers include a low index of refraction silicon dioxide layer formed over said upper surface of said metallic layer and a high index of refraction silicon nitride layer formed over said silicon dioxide layer; and patterning said pair of dielectric layers and said aluminum metallic layer to form a series of apertures in said mask, wherein each of said apertures extend through said pair of dielectric layers and said aluminum metallic layer, and wherein said apertures render portions of said mask transparent to said selected wavelength of laser radiation.

Claim 11

A method of producing a laser ablation mask comprising the steps of: providing a quartz substrate, wherein said substrate is transparent to laser radiation of a selected wavelength; forming an aluminum layer on an upper surface of said substrate, wherein said aluminum layer is reflective of said laser radiation, and wherein said aluminum layer is less than about 3 microns in thickness; forming a pair of dielectric layers on an upper surface of said aluminum layer to define an uppermost surface of said mask, wherein said pair of dielectric layers are arranged to establish a destructive interference pattern with respect to incident laser radiation at said selected wavelength, wherein said pair of dielectric layers include a low index of refraction silicon dioxide layer formed on said upper surface of said aluminum layer and a high index of refraction silicon nitride layer formed on said silicon dioxide layer, and wherein the thickness of said silicon dioxide layer is about 40 nm and the thickness of said silicon nitride layer is about 45 nm; forming a resist layer on said pair of dielectric layers; patterning said resist layer to form a series of apertures therein; etching said pair of dielectric layers and said aluminum layer through said series of apertures in said resist layer to form a series of apertures in said mask, wherein each of said apertures extend through said pair of dielectric layers, and said aluminum layer, and wherein said apertures render portions of said mask transparent to said laser radiation; and removing said patterned resist layer.

Claim 12

A method of producing a laser ablation mask comprising the steps of: providing a quartz substrate, wherein said substrate is transparent to laser radiation of a selected wavelength; forming an aluminum layer on an upper surface of said substrate, wherein said aluminum layer is reflective of said laser radiation, and wherein said aluminum layer is less than about 3 microns in thickness; forming a pair of dielectric layers on an upper surface of said aluminum layer to define an uppermost surface of said mask, wherein said pair of dielectric layers are arranged to establish a destructive interference pattern with respect to incident laser radiation at said selected wavelength, wherein said pair of dielectric layers include a low index of refraction silicon dioxide layer formed on said upper surface of said aluminum layer and a high index of refraction silicon nitride layer formed on said silicon dioxide layer, and wherein the thickness of said silicon dioxide layer is about 40 nm and the thickness of said silicon nitride layer is about 45 nm; forming a resist layer on said pair of dielectric layers; patterning said resist layer to form a series of apertures therein; etching said pair of dielectric layers and said aluminum layer through said series of apertures in said resist layer to form a series of apertures in said mask, wherein each of said apertures extend through said pair of dielectric layers, and said aluminum layer, and wherein said apertures render portions of said mask transparent to said laser radiation; and removing said patterned resist layer.

Claim 21

A method of selectively irradiating a workpiece comprising the steps of: providing a workpiece; providing a source of radiation and directing radiation from said source in the direction of said workpiece; and positioning a radiation reflective mask between said source and said workpiece in the path of said radiation to define an incident radiation side of said mask and an output radiation side of said mask, wherein said mask comprises a substrate defining an incident radiation surface and an output radiation surface, wherein said substrate is transparent to said incident radiation, a patterned metallic layer defining an incident radiation surface and an output radiation surface and formed over said incident radiation surface of said substrate, wherein said patterned metallic layer includes land portions that are reflective of said incident radiation and aperture portions that are transparent to said incident radiation, and at least one pair of dielectric layers formed over said incident radiation surface of said patterned metallic layer, wherein said pair of dielectric layers include land portions that are reflective of incident radiation at said selected wavelengths and aperture portions that are transparent to incident radiation at said selected wavelengths, and wherein said aperture portions of said pair of dielectric layers lie in at least partial registration with said aperture portions of said metallic layer.

Claim 22

A method of selectively irradiating a workpiece comprising the steps of: providing a workpiece; providing a source of radiation and directing radiation from said source in the direction of said workpiece; and positioning a radiation reflective mask between said source and said workpiece in the path of said radiation to define an incident radiation side of said mask and an output radiation side of said mask, wherein said mask comprises a substrate defining an incident radiation surface and an output radiation surface, wherein said substrate is transparent to said incident radiation, a patterned metallic layer defining an incident radiation surface and an output radiation surface and formed over said incident radiation surface of said substrate, wherein said patterned metallic layer includes land portions that are reflective of said incident radiation and aperture portions that are transparent to said incident radiation, and at least one pair of dielectric layers formed over said incident radiation surface of said patterned metallic layer, wherein said pair of dielectric layers include land portions that are reflective of incident radiation at said selected wavelengths and aperture portions that are transparent to incident radiation at said selected wavelengths, and wherein said aperture portions of said pair of dielectric layers lie in at least partial registration with said aperture portions of said metallic layer.

Claim 29

A method of selectively ablating a workpiece with a laser beam comprising the steps of: providing a workpiece; providing a laser source and directing laser radiation from said laser source in the direction of said workpiece, wherein said laser radiation is characterized by an intensity sufficient to ablate said workpiece; and positioning a radiation reflective mask between said source and said workpiece in the path of said laser radiation to define an incident radiation side of said mask and an output radiation side of said mask, wherein said mask comprises a quartz substrate defining an incident radiation surface and an output radiation surface, wherein said quartz substrate is transparent to said incident laser radiation, a patterned aluminum layer defining an incident radiation surface and an output radiation surface and formed on said incident radiation surface of said quartz substrate, wherein said patterned aluminum layer includes land portions that are reflective of said incident laser radiation and aperture portions that are transparent to said incident laser radiation, and a pair of dielectric layers formed on said incident radiation surface of said patterned aluminum layer, wherein said pair of dielectric layers include land portions that are reflective of incident laser radiation at said selected wavelengths and aperture portions that are transparent to incident laser radiation at said selected wavelengths, wherein said pair of dielectric layers include a low index of refraction silicon dioxide layer formed on said upper surface of said patterned aluminum layer and a high index of refraction silicon nitride layer formed on said silicon dioxide layer, and wherein said aperture portions of said pair of dielectric layers lie in at least partial registration with said aperture portions of said patterned aluminum layer.

Claim 30

A method of selectively ablating a workpiece with a laser beam comprising the steps of: providing a workpiece; providing a laser source and directing laser radiation from said laser source in the direction of said workpiece, wherein said laser radiation is characterized by an intensity sufficient to ablate said workpiece; and positioning a radiation reflective mask between said source and said workpiece in the path of said laser radiation to define an incident radiation side of said mask and an output radiation side of said mask, wherein said mask comprises a quartz substrate defining an incident radiation surface and an output radiation surface, wherein said quartz substrate is transparent to said incident laser radiation, a patterned aluminum layer defining an incident radiation surface and an output radiation surface and formed on said incident radiation surface of said quartz substrate, wherein said patterned aluminum layer includes land portions that are reflective of said incident laser radiation and aperture portions that are transparent to said incident laser radiation, and a pair of dielectric layers formed on said incident radiation surface of said patterned aluminum layer, wherein said pair of dielectric layers include land portions that are reflective of incident laser radiation at said selected wavelengths and aperture portions that are transparent to incident laser radiation at said selected wavelengths, wherein said pair of dielectric layers include a low index of refraction silicon dioxide layer formed on said upper surface of said patterned aluminum layer and a high index of refraction silicon nitride layer formed on said silicon dioxide layer, and wherein said aperture portions of said pair of dielectric layers lie in at least partial registration with said aperture portions of said patterned aluminum layer.