US6181864B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Optical fiber array module using soldering and fabrication method thereof
Assignee: Samsung Electronics Co Ltd
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Filing: 1998-08-13
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Granted: 2001-01-30
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Expires: 2018-08-13
Abstract
Abstract A fiber array module using soldering, and a fabrication method thereof, in which the method includes the steps of: forming holes into which optical fibers can be inserted, in a silicon wafer substrate or a ceramic substrate at predetermined intervals, forming a metal layer on the walls of the holes and the entire surface of the substrate, to allow walls of the holes and an entire surface of the substrate to be plated with a solder alloy material; plating the walls of the holes and the entire surface of the substrate with the solder alloy material; inserting metal-coated optical fibers into the holes plated with the solder alloy material; positioning the optical fibers at the centers of the holes using the surface tension of the solder alloy material, by heating the resultant structure; fixing the optical fibers, inserted into the holes of the substrate, to the substrate by pouring epoxy curable by heat or ultraviolet light thereon, to fabricate a fiber array module capable of being accurately attached to an optical waveguide device, and polishing an end of the optical fiber module formed of optical fibers protruding through the holes, to provide optical luminance. Accordingly, the environmental characteristics and reliability of a device package are improved upon the connection of the optical fibers. Also, the fiber array module is simply manufactured, and the ends of loaded optical fibers are easily polished, thus fabricating an inexpensive connection module. Furthermore, the optical fibers are accurately arrayed by self-alignment using the surface tension of the solder material.
Inventors
- 👤 Woo-Hyuk Jang
- 👤 Byong-Gwon Yoo
- 👤 Hyung-jae Lee
- 👤 Tae-Hyung Rhee
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 09:02
CPC Classifications
G; G02; G02B; G02B6/00; G02B6/24; G02B6/26; G02B6/34; G02B6/36; G02B6/38; G02B6/3807; G02B6/3833; G02B6/3855; G02B6/3834
Claims Analysis
Total Claims: 34
Claim 1
Independent Claim
200 words
A method of manufacturing an optical fiber array module using soldering, comprising the steps of: forming holes into which optical fibers can be inserted, in one of either a silicon wafer substrate or a ceramic substrate at predetermined intervals; forming a metal layer on walls of the holes and an entire surface of the substrate, to facilitate the walls of the holes and the entire surface of the substrate to be plated with a solder alloy material; plating the walls of the holes and the entire surface of the substrate with the solder alloy material; inserting metal-coated optical fibers into the holes plated with the solder alloy material; positioning the optical fibers at the centers of the holes using the surface tension of the solder alloy material, by heating the resultant structure of the substrate and optical fibers; fixing the optical fibers, inserted into the holes of the substrate, to the substrate by pouring an epoxy curable by heat or ultraviolet light thereon, to fabricate a fiber array module capable of being accurately attached to an optical waveguide device; and polishing an end of the optical fiber module formed of optical fibers protruding through the holes, to provide optical luminance.
Claim 2
Independent Claim
200 words
A method of manufacturing an optical fiber array module using soldering, comprising the steps of: forming holes into which optical fibers can be inserted, in one of either a silicon wafer substrate or a ceramic substrate at predetermined intervals; forming a metal layer on walls of the holes and an entire surface of the substrate, to facilitate the walls of the holes and the entire surface of the substrate to be plated with a solder alloy material; plating the walls of the holes and the entire surface of the substrate with the solder alloy material; inserting metal-coated optical fibers into the holes plated with the solder alloy material; positioning the optical fibers at the centers of the holes using the surface tension of the solder alloy material, by heating the resultant structure of the substrate and optical fibers; fixing the optical fibers, inserted into the holes of the substrate, to the substrate by pouring an epoxy curable by heat or ultraviolet light thereon, to fabricate a fiber array module capable of being accurately attached to an optical waveguide device; and polishing an end of the optical fiber module formed of optical fibers protruding through the holes, to provide optical luminance.
Claim 3
Dependent Claim
42 words
The method of manufacturing a fiber array module using soldering as claimed in claim 1 , the holes in the substrate being formed by a method selected from the group consisting of mechanical processing, laser processing, semiconductor exposure and etching, and dry-etching.
Claim 4
Dependent Claim
25 words
The method of manufacturing a fiber array module using, soldering as claimed in claim 1 , the metal of the metal layer comprising chrome/gold (Cr/Au).
Claim 5
Dependent Claim
25 words
The method of manufacturing a fiber array module using soldering as claimed in claim 3 , the chrome/gold (Cr/Au) layer being formed by vacuum deposition.
Claim 6
Dependent Claim
41 words
The method of manufacturing a fiber array module using soldering as claimed in claim 1 , the walls of the holes and the entire substrate being plated with the solder alloy material by one of either electrolytic plating or electroless plating.
Claim 7
Dependent Claim
46 words
The method of manufacturing a fiber array module using soldering as claimed in claim 1 , the optical fibers inserted into the holes in the substrate being prepared by peeling all coatings off the optical fibers and depositing metal on cladding layers of the optical fibers.
Claim 8
Dependent Claim
40 words
The method of manufacturing a fiber array module using soldering as claimed in claim 6 , the metal deposited on the optical fibers comprising a metal selected from the group consisting of chrome/gold (Cr/Au), titanium/gold (Ti/Au), and titanium nitride/gold (TiN/Au).
Claim 9
Dependent Claim
39 words
The method of manufacturing a fiber array module using soldering as claimed in claim 1 , the optical fibers inserted into the holes in the substrate being prepared by depositing metal on external glass layers of the optical fibers.
Claim 10
Dependent Claim
40 words
The method of manufacturing a fiber array module using, soldering as claimed in claim 7 , the metal deposited on the optical fibers comprising a metal selected from the group consisting of chrome/gold (Cr/Au), titanium/gold (Ti/Au), and titanium nitride/gold (TiN/Au).
Claim 11
Dependent Claim
30 words
The method of manufacturing a fiber array module using soldering as claimed in claim 1 , the optical fibers inserted into the holes in the substrate comprising copper coated fibers.
Claim 12
Dependent Claim
28 words
The method of manufacturing a fiber array module using soldering as claimed in claim 1 , the solder alloy material being heated to at least its melting point.
Claim 13
Dependent Claim
30 words
The method of manufacturing a fiber array module using soldering as claimed in claim 1 , the holes in the substrate being perpendicular to a surface of an arranging device.
Claim 14
Dependent Claim
38 words
The method of manufacturing a fiber array module using soldering as claimed in claim 1 , the holes in the substrate being at an angle of 0.1° to 20° with respect to a surface of an arranging device.
Claim 15
Dependent Claim
39 words
The method of manufacturing a fiber array module using soldering as claimed in claim 1 , the holes in the substrate each have a cross-sectional shape selected from the group consisting of a rectangle, a circle, and a polygon.
Claim 16
Dependent Claim
41 words
The method of manufacturing a fiber array module using soldering as claimed in claim 1 , the optical fibers inserted into the holes in the substrate comprising fibers selected from the group consisting of single-core fibers, multi-core fibers, and ribbon fibers.
Claim 17
Independent Claim
162 words
A method of manufacturing a fiber array module using soldering, comprising the steps of: forming holes into which arrayed optical fibers can be inserted, in a metal substrate at predetermined intervals; processing walls of the holes in the metal substrate; plating the walls of the holes and an entire surface of the substrate with the solder alloy material; inserting metal-coated fibers into the holes plated with the solder alloy material; positioning the optical fibers at the centers of the holes using the surface tension of the solder alloy material, by heating the resultant structure of the substrate and optical fibers; fixing the optical fibers, inserted into the holes of the substrate, to the substrate by pouring an epoxy curable by heat or ultraviolet light thereon, to fabricate a fiber array module capable of being accurately attached to an optical waveguide device; and polishing an end of the optical fiber module formed of optical fibers protruding through the holes, to provide optical luminance.
Claim 18
Independent Claim
162 words
A method of manufacturing a fiber array module using soldering, comprising the steps of: forming holes into which arrayed optical fibers can be inserted, in a metal substrate at predetermined intervals; processing walls of the holes in the metal substrate; plating the walls of the holes and an entire surface of the substrate with the solder alloy material; inserting metal-coated fibers into the holes plated with the solder alloy material; positioning the optical fibers at the centers of the holes using the surface tension of the solder alloy material, by heating the resultant structure of the substrate and optical fibers; fixing the optical fibers, inserted into the holes of the substrate, to the substrate by pouring an epoxy curable by heat or ultraviolet light thereon, to fabricate a fiber array module capable of being accurately attached to an optical waveguide device; and polishing an end of the optical fiber module formed of optical fibers protruding through the holes, to provide optical luminance.
Claim 19
Dependent Claim
42 words
The method of manufacturing a fiber array module using soldering as claimed in claim 16 , the holes in the substrate being formed by a method selected from the group consisting of mechanical processing, laser processing, semiconductor exposure and etching, and dry-etching.
Claim 20
Dependent Claim
41 words
The method of manufacturing a fiber array module using soldering as claimed in claim 16 , the walls of the holes and the entire substrate being plated with the solder alloy material by one of either electrolytic plating or electroless plating.
Claim 21
Dependent Claim
40 words
The method of manufacturing a fiber array module using soldering as claimed in claim 18 , the metal deposited on the optical fibers comprising a metal selected from the group consisting of chrome/gold (Cr/Au), titanium/gold (Ti/Au), and titanium nitride/gold (TiN/Au).
Claim 22
Dependent Claim
46 words
The method of manufacturing a fiber array module using soldering as claimed in claim 16 , the optical fibers inserted into the holes in the substrate being prepared by peeling all coatings off the optical fibers and depositing metal on cladding layers of the optical fibers.
Claim 23
Dependent Claim
40 words
The method of manufacturing a fiber array module using soldering as claimed in claim 20 , the metal deposited on the optical fibers comprising a metal selected from the group consisting of chrome/gold (Cr/Au), titanium/gold (Ti/Au), and titanium nitride/gold (TiN/Au).
Claim 24
Dependent Claim
39 words
The method of manufacturing a fiber array module using soldering as claimed in claim 16 , the optical fibers inserted into the holes in the substrate being obtained by depositing metal on external glass layers of the optical fibers.
Claim 25
Dependent Claim
30 words
The method of manufacturing a fiber array module using soldering as claimed in claim 16 , the optical fibers inserted into the holes in the substrate comprising copper coated fibers.
Claim 26
Dependent Claim
30 words
The method of manufacturing a fiber array module using soldering as claimed in claim 16 , the holes in the substrate being perpendicular to a surface of an arranging device.
Claim 27
Dependent Claim
38 words
The method of manufacturing a fiber array module using soldering as claimed in claim 16 , the holes in the substrate being at an angle of 0.1° to 20° with respect to a surface of an arranging device.
Claim 28
Dependent Claim
41 words
The method of manufacturing a fiber array module using soldering as claimed in claim 16 , the optical fibers inserted into the holes in the substrate comprising fibers selected from the group consisting of single-core fibers, multi-core fibers, and ribbon fibers.
Claim 29
Dependent Claim
104 words
A fiber array module manufactured using soldering, comprising: a metal substrate having holes into which optical fibers can be inserted, walls of the holes and an entire surface of the metal substrate being plated with a metal material; arrayed optical fibers inserted into the holes in the metal substrate and prepared by depositing metal layers on cladding layers or external glass layers exposed by removing all coatings from the optical fibers; and a fixing unit for fixing the arrayed optical fibers to the metal substrate, after the arrayed optical fibers have been inserted into the holes in the metal substrate and aligned by heat.
Claim 30
Dependent Claim
104 words
A fiber array module manufactured using soldering, comprising: a metal substrate having holes into which optical fibers can be inserted, walls of the holes and an entire surface of the metal substrate being plated with a metal material; arrayed optical fibers inserted into the holes in the metal substrate and prepared by depositing metal layers on cladding layers or external glass layers exposed by removing all coatings from the optical fibers; and a fixing unit for fixing the arrayed optical fibers to the metal substrate, after the arrayed optical fibers have been inserted into the holes in the metal substrate and aligned by heat.
Claim 31
Dependent Claim
27 words
The fiber array module using soldering as claimed in claim 27 , the fixing unit fixing the optical fiber array to the substrate using a molding compound.
Claim 32
Dependent Claim
74 words
An optical fiber array module, comprising: a substrate having a hole of polygonal cross-section for receiving an optical fiber, said hole having walls; a solder material plated on the surface of the substrate and the walls of said hole; an optical fiber centered in said hole, said optical fiber comprising: a cladding layer; a metal coating surrounding the cladding layer, said metal coating contacting said solder material tangentially near the walls of the hole.
Claim 33
Dependent Claim
74 words
An optical fiber array module, comprising: a substrate having a hole of polygonal cross-section for receiving an optical fiber, said hole having walls; a solder material plated on the surface of the substrate and the walls of said hole; an optical fiber centered in said hole, said optical fiber comprising: a cladding layer; a metal coating surrounding the cladding layer, said metal coating contacting said solder material tangentially near the walls of the hole.
Claim 34
Dependent Claim
15 words
The optical fiber array module of claim 29 , said hole having a square cross-section.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-01-30 | 2004-07-31 | 2005-01-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-01-30 | 2008-07-31 | 2009-01-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-01-30 | 2012-07-31 | 2013-01-30 | $7700.00 | Window Closed / Lapsed |