Modular Microelectronic connector and method for manufacturing same

Claim 2

A microelectronic connector, comprising: a connector body having a first cavity and second cavity, said first cavity adapted to receive at least part of a plug having a plurality of electrical contacts; a plurality of first crimp leads, each having a first and second end, said first end of said first crimp leads being positioned at least partly within said second cavity, said second end of said first crimp leads being disposed at least partly within said first cavity; a plurality of second crimp leads, each having a first and second end, said first end of said second crimp leads being positioned at least partly within said second cavity, said second end of said second crimp leads adapted for electrical connection to an external device; and an electrical component disposed at least partly within said second cavity, said electrical component having at least one electrical conductor, said at least one conductor being electrically connected to at least one of said first crimp leads and at least one of said second crimp leads such that an electrical signal may be transferred from said electrical contacts of said plug to said external device through said electrical component.

Claim 3

The microelectronic connector of claim 1 , wherein said electrical component is a choke coil.

Claim 4

The microelectronic connector of claim 1 , wherein said first and second crimp leads are comprised of a ductile material.

Claim 5

The microelectronic connector of claim 3 , wherein said first and second crimp leads further include at least one crimp element proximate to said first end to permit crimping of said conductors to respective ones of said crimp leads.

Claim 6

The microelectronic connector of claim 1 , wherein said at least one crimp element comprises a plurality of flutes, at least two of which may be forced into physical contact with each other in order to crimp at least one of said conductors.

Claim 7

The microelectronic connector of claim 1 , wherein said microelectronic connector is an RJ 45 type connector, and said plug is a modular plug.

Claim 8

The microelectronic connector of claim 1 , wherein said electrical component and at least a portion of said first and second crimp leads are encapsulated within said cavity using a sealant.

Claim 9

The microelectronic connector of claim 7 , wherein said sealant is an epoxy.

Claim 10

The microelectronic connector of claim 3 , wherein said connector body is comprised of a polymer and formed using injection molding techniques.

Claim 11

The microelectronic connector of claim 3 , wherein said external device is a printed circuit board.

Claim 12

The microelectronic connector of claim 1 , wherein said connector body further includes at least one aperture adapted to receive a mounting element attached to an external device, said aperture and mounting element cooperating to retain said connector body in a substantially fixed relationship with respect to said external device.

Claim 13

The microelectronic connector of claim 4 , wherein said connector body further includes at least one aperture adapted to receive a mounting element attached to an external device, said aperture and mounting element cooperating to retain said connector body in a substantially fixed relationship with respect to said external device.

Claim 14

The microelectronic connector of claim 12 , wherein said mounting element is a pin.

Claim 15

A microelectronic connector, comprising: a connector body having a first cavity and second cavity, said first cavity adapted to receive at least part of a modular plug having a plurality of electrical contacts; an electrical component disposed in said second cavity, said component having at least one electrical conductor; a plurality of first crimp leads, at least one of which is electrically connected to said at least one conductor of said electrical component, said plurality of first crimp leads being positioned at least partly within said second cavity; a plurality of first electrical leads disposed at least in part within said first cavity, said first leads being connected so as to form an electrical connection between at least one of said electrical contacts of said modular plug and at least one of said first crimp leads; a plurality of second crimp leads, at least one of which is electrically connected to said at least one conductor of said electrical component, said plurality of second crimp leads being positioned at least partly within said second cavity; and a plurality of second electrical leads, at least one of which is electrically connected to said at least one second crimp lead so as to connect said microelectronic connector to an external device.

Claim 16

A microelectronic connector, comprising: a connector body having a first cavity and second cavity, said first cavity adapted to receive at least part of a modular plug having a plurality of electrical contacts; an electrical component disposed in said second cavity, said component having at least one electrical conductor; a plurality of first crimp leads, at least one of which is electrically connected to said at least one conductor of said electrical component, said plurality of first crimp leads being positioned at least partly within said second cavity; a plurality of first electrical leads disposed at least in part within said first cavity, said first leads being connected so as to form an electrical connection between at least one of said electrical contacts of said modular plug and at least one of said first crimp leads; a plurality of second crimp leads, at least one of which is electrically connected to said at least one conductor of said electrical component, said plurality of second crimp leads being positioned at least partly within said second cavity; and a plurality of second electrical leads, at least one of which is electrically connected to said at least one second crimp lead so as to connect said microelectronic connector to an external device.

Claim 17

A modular microelectronic connector assembly, comprising: a connector body having a first and second cavity, said first cavity being adapted to receive at least part of a modular plug; an electrical component disposed in said second cavity, said component having a plurality of conductors; a plurality of electrical contacts disposed at least partly within said first cavity and connected to said electrical component via at least one of said conductors; a connector carrier having a plurality of mounting elements mounted thereon; and at least one aperture in said connector body for receiving at least one of said mounting elements, wherein a plurality of said connector bodies may be mounted to said carrier simultaneously.

Claim 18

A modular microelectronic connector assembly, comprising: a connector body having a first and second cavity, said first cavity being adapted to receive at least part of a modular plug; an electrical component disposed in said second cavity, said component having a plurality of conductors; a plurality of electrical contacts disposed at least partly within said first cavity and connected to said electrical component via at least one of said conductors; a connector carrier having a plurality of mounting elements mounted thereon; and at least one aperture in said connector body for receiving at least one of said mounting elements, wherein a plurality of said connector bodies may be mounted to said carrier simultaneously.

Claim 19

The modular microelectronic connector assembly of claim 15 , wherein said mounting elements are pins.

Claim 20

The modular microelectronic connector assembly of claim 15 , wherein said electrical contacts are connected to said conductors of said electrical component using a plurality of crimp leads which are crimped about said conductors.

Claim 21

The modular microelectronic connector assembly of claim 17 , wherein said crimp leads are comprised of a ductile material, and are crimped about said conductors of said electrical component.

Claim 22

A circuit board assembly having a plurality of microelectronic connectors mounted thereon, comprising: a circuit board having a plurality of electrical contacts; a connector carrier attached to said circuit board, said carrier including a plurality of mounting elements; a plurality of microelectronic connectors, each of said connectors including; a connector body having at least one cavity formed therein, said at least one cavity being adapted to receive a modular plug having a plurality of contacts; at least one electrical component having at least one conductor disposed within said at least one cavity; a plurality of first electrical leads connecting said at least one conductor of said electrical component to at least one of said contacts of said modular plug; a plurality of second electrical leads connecting said at least one conductor of said electrical component to said board; and at least one aperture adapted to receive respective ones of said mounting elements of said carrier; wherein said connectors are mounted on said carrier such that at least one of said second electrical leads of each connector forms an electrical connection with a respective one of said contacts of said circuit board.

Claim 23

A circuit board assembly having a plurality of microelectronic connectors mounted thereon, comprising: a circuit board having a plurality of electrical contacts; a connector carrier attached to said circuit board, said carrier including a plurality of mounting elements; a plurality of microelectronic connectors, each of said connectors including; a connector body having at least one cavity formed therein, said at least one cavity being adapted to receive a modular plug having a plurality of contacts; at least one electrical component having at least one conductor disposed within said at least one cavity; a plurality of first electrical leads connecting said at least one conductor of said electrical component to at least one of said contacts of said modular plug; a plurality of second electrical leads connecting said at least one conductor of said electrical component to said board; and at least one aperture adapted to receive respective ones of said mounting elements of said carrier; wherein said connectors are mounted on said carrier such that at least one of said second electrical leads of each connector forms an electrical connection with a respective one of said contacts of said circuit board.

Claim 24

The circuit board assembly of claim 19 , wherein at least one of said first and second leads comprise crimp leads.

Claim 27

The method of claim 21 , wherein said method further includes the act of applying a sealant to said electrical component so as to maintain said component and said connector body in a fixed relationship.

Claim 28

The method of claim 22 , wherein the act of forming an electrical connection between said crimp leads and said conductors further includes the act of crimping the crimp leads to the conductors.

Claim 31

An electric connector, comprising: a connector body having a first and a second cavity, said connector body being of unitary construction, said first cavity being adapted to receive at least part of a modular plug having electrical contacts; an electrical component disposed in said second cavity, said component having a plurality of conductors; a plurality of first electrical leads disposed within said first cavity, said first electrical leads being connected to said electrical component and said electrical contacts of said modular plug; and a plurality of second electrical leads connected to said electrical component, said second leads adapted to connect said electrical connector to an external device; wherein said electrical component and at least a portion of said first and second electrical leads are encapsulated within said cavity using a sealant.

Claim 32

An electric connector, comprising: a connector body having a first and a second cavity, said connector body being of unitary construction, said first cavity being adapted to receive at least part of a modular plug having electrical contacts; an electrical component disposed in said second cavity, said component having a plurality of conductors; a plurality of first electrical leads disposed within said first cavity, said first electrical leads being connected to said electrical component and said electrical contacts of said modular plug; and a plurality of second electrical leads connected to said electrical component, said second leads adapted to connect said electrical connector to an external device; wherein said electrical component and at least a portion of said first and second electrical leads are encapsulated within said cavity using a sealant.

Claim 33

A microelectronic connector, comprising: a connector body having a first and a second cavity, said connector body being of unitary construction, said first cavity being adapted to receive at least part of a modular plug having electrical contacts; means for conditioning an electrical signal, said means for conditioning being disposed in said second cavity; first means for conducting an electrical signal, said first means disposed at least partly within said first cavity and electrically connected to said means for conditioning and connectable to said electrical contacts of said modular plug; second means for conducting an electrical signal, said second means being electrically connected to said means for conditioning, said second means adapted to connect said microelectronic connector to an external device; and means for maintaining said means for conditioning and said first means for conducting in a fixed position relative to said connector body, said means for maintaining at least partly filling said second cavity.

Claim 34

A microelectronic connector, comprising: a connector body having a first and a second cavity, said connector body being of unitary construction, said first cavity being adapted to receive at least part of a modular plug having electrical contacts; means for conditioning an electrical signal, said means for conditioning being disposed in said second cavity; first means for conducting an electrical signal, said first means disposed at least partly within said first cavity and electrically connected to said means for conditioning and connectable to said electrical contacts of said modular plug; second means for conducting an electrical signal, said second means being electrically connected to said means for conditioning, said second means adapted to connect said microelectronic connector to an external device; and means for maintaining said means for conditioning and said first means for conducting in a fixed position relative to said connector body, said means for maintaining at least partly filling said second cavity.

Claim 35

The microelectronic connector of claim 26 , wherein said means for conditioning an electrical signal comprises an electrical component having a plurality of conductors.

Claim 36

The microelectronic connector of claim 27 , wherein said electrical component comprises a toroidal choke coil.

Claim 37

The microelectronic connector of claim 26 , wherein said first means for conducting an electrical signal comprises a plurality of crimp leads.

Claim 38

The microelectronic connector of claim 26 , wherein said means for maintaining said means for conditioning and said first means for conducting in relative position to said connector body comprises an epoxy fill.

Claim 39

A modular microelectronic connector assembly having independently removable connectors, comprising: a plurality of microelectronic connectors, each of said connectors having; a connector body having a first and second cavity, said first cavity being adapted to receive at least part of a modular plug having contacts disposed therein; an electrical component disposed in said second cavity, said component having a plurality of conductors; a plurality of electrical contacts disposed within said first cavity and connected to said electrical component via at least one of said conductors, said electrical contacts being capable of mating with said contacts of said modular plug when said modular plug is received within said first cavity; a connector carrier having a plurality of mounting elements mounted thereon; and at least one aperture in each of said connector bodies for receiving at least one of said mounting elements, wherein said microelectronic connectors are mounted on said carrier in a predetermined configuration, and are independently removable from said carrier.

Claim 40

A modular microelectronic connector assembly having independently removable connectors, comprising: a plurality of microelectronic connectors, each of said connectors having; a connector body having a first and second cavity, said first cavity being adapted to receive at least part of a modular plug having contacts disposed therein; an electrical component disposed in said second cavity, said component having a plurality of conductors; a plurality of electrical contacts disposed within said first cavity and connected to said electrical component via at least one of said conductors, said electrical contacts being capable of mating with said contacts of said modular plug when said modular plug is received within said first cavity; a connector carrier having a plurality of mounting elements mounted thereon; and at least one aperture in each of said connector bodies for receiving at least one of said mounting elements, wherein said microelectronic connectors are mounted on said carrier in a predetermined configuration, and are independently removable from said carrier.

Claim 41

The connector assembly of claim 31 , wherein said electrical contacts disposed within said first cavity include at least one crimp lead.