US6173576B1
Expired / Lapsed
US
⏱️ 0.0 years remaining
Cooling unit for an integrated circuit package
Assignee: Intel Corp
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Filing: 1999-03-25
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Granted: 2001-01-16
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Expires: 2019-03-25
Abstract
Abstract A cooling unit for an integrated circuit. The cooling unit may include a peltier device that may be coupled to the integrated circuit and a plurality of fins that are thermally coupled to the peltier device. The fins may be separated by at least one channel. The cooling unit may include a fan that generates a flow of fluid through the channel.
Inventors
- 👤 Kenzo Ishida
- 👤 Shuji Inoue
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:48
CPC Classifications
F; F25; F25B; F25B21/00; F25B21/02; F28; F28D; F28D15/00; F28D15/02; H; H10; H10N; H10N10/00; H10N10/10; H10N10/13; H10W; H10W40/00; H10W40/20; H10W40/28; H10W40/40; H10W40/43
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
73 words
A cooling unit for an integrated circuit, comprising: a peltier device that is thermally coupled to the integrated circuit; a first channel adjacent to said peltier device; a plurality of fins that are thermally coupled to said peltier device and which are separated by a second channel; and, a fan that can generate a flow of fluid through said first channel adjacent to said peltier device is thermally coupled to the integrated circuit.
Claim 2
Dependent Claim
73 words
A cooling unit for an integrated circuit, comprising: a peltier device that is thermally coupled to the integrated circuit; a first channel adjacent to said peltier device; a plurality of fins that are thermally coupled to said peltier device and which are separated by a second channel; and, a fan that can generate a flow of fluid through said first channel adjacent to said peltier device is thermally coupled to the integrated circuit.
Claim 3
Dependent Claim
20 words
The cooling unit of claim 1 , further comprising a base plate that is thermally coupled to said peltier device.
Claim 4
Dependent Claim
20 words
The cooling unit of claim 1 , further comprising a heat pipe that is thermally coupled to the integrated circuit.
Claim 5
Dependent Claim
20 words
The cooling unit of claim 2 , further comprising a heat pipe that is thermally coupled to said base plate.
Claim 6
Dependent Claim
29 words
The cooling unit of claim 1 , wherein said fan introduces the flow of fluid in a direction that is essentially perpendicular to a longitudinal axis of said fin.
Claim 7
Dependent Claim
30 words
The cooling unit of claim 1 , wherein said channel is in fluid communication with a main duct and said fan is oriented at an angle within said main duct.
Claim 8
Dependent Claim
22 words
The cooling unit of claim 1 , further comprising a control circuit that is connected to said peltier device and said fan.
Claim 9
Dependent Claim
24 words
The cooling unit of claim 7 , further comprising a temperature sensor that is connected to said control circuit and which senses a temperature.
Claim 10
Dependent Claim
88 words
The cooling unit of claim 8 , wherein said control circuit can switch said peltier device and said fan between an on state and an off state, said control circuit operates said peltier device and said fan in the off state when the temperature is below a first threshold, operates said fan in the on state when the temperature is no less than the first threshold, and operates said fan and said peltier device in the on state when the temperature is no less than a second threshold.
Claim 11
Dependent Claim
77 words
An integrated circuit package assembly, comprising: an integrated circuit; a peltier device that is thermally coupled to said integrated circuit package; a first channel adjacent to said peltier device; a plurality of fins that are thermally coupled to said peltier device and which are separated by a second channel; and, a fan that can generate a flow of fluid through said first channel adjacent to said peltier device that is thermally coupled to said integrated circuit package.
Claim 12
Dependent Claim
77 words
An integrated circuit package assembly, comprising: an integrated circuit; a peltier device that is thermally coupled to said integrated circuit package; a first channel adjacent to said peltier device; a plurality of fins that are thermally coupled to said peltier device and which are separated by a second channel; and, a fan that can generate a flow of fluid through said first channel adjacent to said peltier device that is thermally coupled to said integrated circuit package.
Claim 13
Dependent Claim
23 words
The assembly of claim 10 , further comprising a base plate that is thermally coupled to said peltier device and said integrated circuit.
Claim 14
Dependent Claim
20 words
The assembly of claim 10 , further comprising a heat pipe that can be thermally coupled to said integrated circuit.
Claim 15
Dependent Claim
19 words
The assembly of claim 11 , further comprising a heat pipe that is thermally coupled to said base plate.
Claim 16
Dependent Claim
28 words
The assembly of claim 10 , wherein said fan introduces the flow of fluid in a direction that is essentially perpendicular to a longitudinal axis of said fin.
Claim 17
Dependent Claim
30 words
The cooling unit of claim 10 , wherein said channel is in fluid communication with a main duct and said fan is oriented at an angle within said main duct.
Claim 18
Dependent Claim
21 words
The assembly of claim 10 , further comprising a control circuit that is connected to said peltier device and said fan.
Claim 19
Dependent Claim
22 words
The assembly of claim 16 , further comprising a temperature sensor that is connected to said control circuit and senses a temperature.
Claim 20
Dependent Claim
88 words
The assembly of claim 17 , wherein said control circuit can switch said peltier device and said fan between an on state and an off state, said control circuit operates said peltier device and said fan in the off state when the first temperature is below a first threshold, operates said fan in the on state when the temperature is no less than the first threshold and operates said fan and said peltier device in the on state when the temperature is not less than a second threshold.
Claim 21
Independent Claim
90 words
A method for cooling an integrated circuit, comprising: sensing a temperature; placing a peltier device that is thermally coupled to said integrated circuit and a fan in an off state if the temperature is below a first threshold; generating a flow of fluid adjacent to the peltier device that is thermally coupled to said integrated circuit if the temperature is not less than the first threshold; generating said flow of fluid and operating the peltier device in an on state if the temperature is not less than a second threshold.
Claim 22
Independent Claim
90 words
A method for cooling an integrated circuit, comprising: sensing a temperature; placing a peltier device that is thermally coupled to said integrated circuit and a fan in an off state if the temperature is below a first threshold; generating a flow of fluid adjacent to the peltier device that is thermally coupled to said integrated circuit if the temperature is not less than the first threshold; generating said flow of fluid and operating the peltier device in an on state if the temperature is not less than a second threshold.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2004-01-16 | 2004-07-17 | 2005-01-16 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2008-01-16 | 2008-07-17 | 2009-01-16 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2012-01-16 | 2012-07-17 | 2013-01-16 | $7700.00 | Window Closed / Lapsed |