IC socket having standoffs

Claim 1

A socket for interconnecting a pin grid array package having a plurality of pins to a circuit board, comprising: a base forming an upper surface, a lower surface, and a plurality of slots arranged in rows and columns between the upper and lower surfaces; a cover slidably mounted to the base, the cover comprising a plurality of apertures disposed therethrough for receiving corresponding pins of the pin grid array package and arranged in rows and columns corresponding to the slots of the base; a plurality of contacts received in corresponding slots of the base, each contact having a free end proximate the lower surface of the base; a plurality of solder balls correspondingly affixed to the free ends of the contacts, each solder ball having a solder surface for being soldered to the circuit board; and a pair of standoffs disposed on the lower surface of the base near a respective position where an external force for moving the cover relative to the base is applied, each standoff having a bottom face abutting against the circuit board when the external force is applied; wherein the base comprises a pair of extension plates diagonally extending therefrom, each extension plate forming a V-shaped groove in an upper surface thereof and an opening in communication with the V-shaped groove for receiving an external tool, whereby when the external tool slidably moves the cover relative to the base, the pins are moved into engagement with the contacts.