US6143356A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Diffusion barrier and adhesive for PARMOD™ application to rigid printed wiring boards
Assignee: Parelec Inc
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Filing: 1999-08-06
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Granted: 2000-11-07
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Expires: 2019-08-06
Abstract
Abstract PARMOD™ materials comprised of a metal powder or metal powder mixture of specified characteristics and a Reactive Organic Medium, are easily printed or deposited on electronic components, such as a Printed Wiring Board substrate, and cured at low temperatures to form a highly conductive, well bonded, well consolidated pure metal component. The adhesion of PARMOD™ conductors on an electronic component is enhanced by printing the PARMOD™ on a polyimide coating which has been applied to the electronic component.
Inventors
- 👤 Gregory A. Jablonski
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 02:48
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/02; C23C18/08; H; H05; H05K; H05K3/00; H05K3/38; H05K3/386; H05K1/00; H05K1/02; H05K1/09; H05K1/092; H05K1/095; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/015; H05K2201/0154; H05K2201/0162
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
126 words
A method for producing solid pure metal conductors on a substrate comprising the steps of: A) applying a conductor precursor in the desired pattern on to the substrate, said substrate having a coating layer of a diffusion and adhesive barrier whereby the coating layer of a diffusion and adhesive barrier is selected from the group consisting of low T g polyimides, silicones, fluorocarbons, soluble polyimides, polyimide amides, polyamic acids, or combinations thereof; B) heating the substrate in an oven to a critical temperature less than about 450° C. for a time less than about ten minutes; wherein said applied conductor precursor pattern is converted into a well-consolidated, well-bonded pure metal conductor wherein said conductor precursor is comprised of a reactive organic medium a metal powder mixture.
Claim 2
Independent Claim
126 words
A method for producing solid pure metal conductors on a substrate comprising the steps of: A) applying a conductor precursor in the desired pattern on to the substrate, said substrate having a coating layer of a diffusion and adhesive barrier whereby the coating layer of a diffusion and adhesive barrier is selected from the group consisting of low T g polyimides, silicones, fluorocarbons, soluble polyimides, polyimide amides, polyamic acids, or combinations thereof; B) heating the substrate in an oven to a critical temperature less than about 450° C. for a time less than about ten minutes; wherein said applied conductor precursor pattern is converted into a well-consolidated, well-bonded pure metal conductor wherein said conductor precursor is comprised of a reactive organic medium a metal powder mixture.
Claim 3
Dependent Claim
26 words
The method of claim 1 wherein said soluble polyimide is comprised of a polymer of 3,4'-oxydianiline and a mixture of 4,4'-oxydiphthallic dianhydride and 3,4,3',4'-biphenyl tetracarboxylic dianhydride.
Claim 4
Dependent Claim
16 words
The method of claim 1 wherein said diffusion and adhesive barrier is comprised of FEP polytetrafluoroethylene.
Claim 5
Dependent Claim
29 words
The method of claim 1 wherein said diffusion and adhesive barrier applied to the substrate by brushing, spraying, roll coating, dipping, doctor blading, spin coating, curtain coating or laminating.
Claim 6
Dependent Claim
47 words
The method of claim 1 in which said conductor precursor is applied to said substrate by a technology selected from the group consisting of: screen printing, stencil printing, gravure printing, impression printing, offset printing, lithographic printing, dispensing, doctor blading, ink jet printing, xerographic copying and electrostatic printing.
Claim 7
Dependent Claim
40 words
The method of claim 1 in which said conductor precursor is a copper-based composition and in which the oven atmosphere is nitrogen with less than 100 parts per million by volume of oxygen preferably less than 20 parts per million.
Claim 8
Dependent Claim
41 words
The method of claim 6 in which water vapor is added to the nitrogen to the extent of approximately 5 mole percent during the period in which said conductor precursor is being heated but not before or after the heating phase.
Claim 9
Dependent Claim
21 words
The method of claim 1 in which the substrate contains a polymer which is sensitive to temperatures above about 450° C.
Claim 10
Dependent Claim
21 words
The method of claim 1 in which the substrate contains a semiconductor which is sensitive to temperatures above about 450° C.
Claim 11
Dependent Claim
25 words
The method of claim 1 in which said conductor precursor is applied to metal conductors and dielectric insulators to make electrical connections between the conductors.
Claim 12
Dependent Claim
53 words
The method of claim 1 in which said conductor precursor are applied in step A) to a continuous web of thin substrate material and cured in step B) as a continuous web in an oven, further comprising the step of: C) cutting said continuous web of thin substrate material into a final product.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-11-07 | 2004-05-08 | 2004-11-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-11-07 | 2008-05-08 | 2008-11-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-11-07 | 2012-05-08 | 2012-11-07 | $7700.00 | Window Closed / Lapsed |