EMI shield/ gasket enclosure

Claim 2

An electronic assembly comprising electronic components and an electromagnetic interference and compatibility (EMI/EMC) shielding enclosure for the electronic components, the enclosure comprising a first housing portion, made of a conductive plastic material, having projecting, resilient fingers integral therewith and a conductive second housing portion, the electronic components being located between the first housing portion and the second housing portion, the fingers from the first housing portion surrounding at least a major portion of the electronic components and contacting the second housing portion, wherein the first housing portion further comprises an inner surface and walls substantially along the periphery of the inner surface projecting perpendicularly from the inner surface, each wall having a remote surface remote from the inner surface, the fingers projecting from the remote surface of the walls and wherein for each wall having fingers, the fingers project towards the plane of the inner surface and away from the wall.

Claim 3

The electronic assembly of claim 1 wherein the second housing portion comprises an inside surface having walls extending perpendicularly from the inside surface, the walls being located substantially along the perimeter of the inside surface.

Claim 4

The electronic assembly of claim 2 wherein the walls of the first housing portion are substantially within the perimeter of the walls of the second housing portion and the fingers contact at least some of the walls of the second housing portion.

Claim 5

The electronic assembly of claim 3 wherein the assembly further comprises a substrate, wherein the electronic components are carried on the substrate.

Claim 6

The electronic assembly of claim 4 wherein the substrate is a printed circuit board.

Claim 7

The electronic assembly of claim 5 wherein the remote surfaces of the walls of the first housing portion comprise alignment pins projecting away from the inner surface of the first housing portion; the printed circuit board is provided with alignment holes formed through the printed circuit board and located near the perimeter of the printed circuit board in a configuration adapted to align with the alignment pins; and the inside surface of the second housing portion further comprises indentations formed therein in a configuration adapted to align with the alignment pins.

Claim 8

The electronic assembly of claim 1 wherein each finger on a wall is substantially uniformly spaced from an adjacent finger.

Claim 9

The electronic assembly of claim 1 wherein the first housing portion further comprises an outer surface substantially parallel to the inner surface, and a base portion defined by the inner surface, the outer surface and the walls, wherein the thickness of the fingers is less than the thickness of the base portion.

Claim 10

An electronic assembly comprising electronic components and an electromagnetic interference and compatibility (EMI/EMC) shielding enclosure for the electronic components, the enclosure comprising a first housing portion, made of a conductive plastic material, having projecting, resilient fingers integral therewith and a conductive second housing portion, the electronic components being located between the first housing portion and the second housing portion, the fingers from the first housing portion surrounding at least a major portion of the electronic components and contacting the second housing portion, wherein the first housing portion further comprises an inner surface and walls substantially along the periphery of the inner surface projecting perpendicularly from the inner surface, each wall having a remote surface remote from the inner surface, the fingers projecting from the remote surface of the walls wherein at least one of the walls has fingers projecting towards the plane of the inner surface and away from the wall, and with respect to at least one of the walls, the fingers are connected to the remote surface by a connecting portion and a flat portion, the connecting portion being connected to the remote surface and projecting towards the inner surface, the flat portion extending from the connecting portion and extending away from the wall, the fingers extending from the flat portion away from the inner surface.

Claim 11

An electronic assembly comprising electronic components and an electromagnetic interference and compatibility (EMI/EMC) shielding enclosure for the electronic components, the enclosure comprising a first housing portion, made of a conductive plastic material, having projecting, resilient fingers integral therewith and a conductive second housing portion, the electronic components being located between the first housing portion and the second housing portion, the fingers from the first housing portion surrounding at least a major portion of the electronic components and contacting the second housing portion, wherein the first housing portion further comprises an inner surface and walls substantially along the periphery of the inner surface projecting perpendicularly from the inner surface, each wall having a remote surface remote from the inner surface, the fingers projecting from the remote surface of the walls wherein at least one of the walls has fingers projecting towards the plane of the inner surface and away from the wall, and with respect to at least one of the walls, the fingers are connected to the remote surface by a connecting portion and a flat portion, the connecting portion being connected to the remote surface and projecting towards the inner surface, the flat portion extending from the connecting portion and extending away from the wall, the fingers extending from the flat portion away from the inner surface.

Claim 12

The electronic assembly of claim 9 wherein the second housing portion comprises an inside surface having walls extending perpendicularly from the inside surface, the walls being located substantially along the perimeter of the inside surface.

Claim 13

The electronic assembly of claim 10 wherein the walls of the first housing portion are substantially within the perimeter of the walls of the second housing portion and the fingers contact at least some of the walls of the second housing portion.

Claim 14

The electronic assembly of claim 11 wherein the assembly further comprises a substrate, wherein the electronic components are carried on the substrate.

Claim 15

The electronic assembly of claim 12 wherein the substrate is a printed circuit board.

Claim 16

The electronic assembly of claim 13 wherein the remote surfaces of the walls of the first housing portion comprise alignment pins projecting away from the inner surface of the first housing portion; the printed circuit board is provided with alignment holes formed through the printed circuit board and located near the perimeter of the printed circuit board in a configuration adapted to align with the alignment pins; and the inside surface of the second housing portion further comprises indentations formed therein in a configuration adapted to align with the alignment pins.

Claim 17

The electronic assembly of claim 9 wherein each finger on a wall is substantially uniformly spaced from an adjacent finger.

Claim 18

The electronic assembly of claim 9 wherein the first housing portion further comprises an outer surface substantially parallel to the inner surface, and a base portion defined by the inner surface, the outer surface and the walls, wherein the thickness of the fingers is less than the thickness of the base portion.

Claim 19

An EMI/EMC shielding enclosure for electronic components, the enclosure comprising a first housing portion, made of a conductive plastic material, having projecting, resilient fingers integral therewith and a conductive second housing portion, wherein, when the enclosure is assembled with the electronic components located between the first housing portion and the second housing portion, the fingers from the first housing portion surround at least a major portion of the electronic components and contact the second housing portion, wherein the first housing portion further comprises an inner surface and walls substantially along the periphery of the inner surface projecting perpendicularly from the inner surface, each wall having a remote surface remote from the inner surface, the fingers projecting from the remote surface of the walls and wherein for each wall having fingers, the fingers project towards the plane of the inner surface and away from the wall.

Claim 20

An EMI/EMC shielding enclosure for electronic components, the enclosure comprising a first housing portion, made of a conductive plastic material, having projecting, resilient fingers integral therewith and a conductive second housing portion, wherein, when the enclosure is assembled with the electronic components located between the first housing portion and the second housing portion, the fingers from the first housing portion surround at least a major portion of the electronic components and contact the second housing portion, wherein the first housing portion further comprises an inner surface and walls substantially along the periphery of the inner surface projecting perpendicularly from the inner surface, each wall having a remote surface remote from the inner surface, the fingers projecting from the remote surface of the walls and wherein for each wall having fingers, the fingers project towards the plane of the inner surface and away from the wall.

Claim 21

The enclosure of claim 17 wherein each finger on a wall is substantially uniformly spaced from an adjacent finger.

Claim 22

The enclosure of claim 17 wherein the first housing portion further comprises an outer surface substantially parallel to the inner surface, and a base portion defined by the inner surface, the outer surface and the walls, wherein the thickness of the fingers is less than the thickness of the base portion.

Claim 23

The enclosure of claim 17 wherein the second housing portion comprises an inside surface having walls extending perpendicularly from the inside surface, the walls being located substantially along the perimeter of the inside surface.

Claim 24

The enclosure of claim 20 wherein the walls of the first housing portion are substantially within the perimeter of the walls of the second housing portion and the fingers contact at least some of the walls of the second housing portion.

Claim 25

The enclosure of claim 21 wherein the remote surfaces of the walls of the first housing portion comprise alignment pins projecting away from the inner surface of the first housing portion; the electronic components are carried on a substrate, wherein the substrate is provided with alignment holes formed through the substrate and located near the perimeter of the substrate in a configuration adapted to align with the alignment pins; and the inside surface of the second housing portion further comprises indentations formed therein in a configuration adapted to align with the alignment pins.

Claim 26

An EMI/EMC shielding enclosure for electronic components, the enclosure comprising a first housing portion, made of a conductive plastic material, having projecting, resilient fingers integral therewith and a conductive second housing portion, wherein, when the enclosure is assembled with the electronic components located between the first housing portion and the second housing portion, the fingers from the first housing portion surround at least a major portion of the electronic components and contact the second housing portion, wherein the first housing portion further comprises an inner surface and walls substantially along the periphery of the inner surface projecting perpendicularly from the inner surface, each wall having a remote surface remote from the inner surface, the fingers projecting from the remote surface of the walls and wherein at least one of the walls has fingers projecting towards the plane of the inner surface and away from the wall, and with respect to at least one of the walls, the fingers are connected to the remote surface by a connecting portion and a flat portion, the connecting portion being connected to the remote portion and projecting towards the inner surface, the flat portion extending from the connecting portion and extending away from the wall, the fingers extending from the flat portion away from the inner surface.

Claim 27

An EMI/EMC shielding enclosure for electronic components, the enclosure comprising a first housing portion, made of a conductive plastic material, having projecting, resilient fingers integral therewith and a conductive second housing portion, wherein, when the enclosure is assembled with the electronic components located between the first housing portion and the second housing portion, the fingers from the first housing portion surround at least a major portion of the electronic components and contact the second housing portion, wherein the first housing portion further comprises an inner surface and walls substantially along the periphery of the inner surface projecting perpendicularly from the inner surface, each wall having a remote surface remote from the inner surface, the fingers projecting from the remote surface of the walls and wherein at least one of the walls has fingers projecting towards the plane of the inner surface and away from the wall, and with respect to at least one of the walls, the fingers are connected to the remote surface by a connecting portion and a flat portion, the connecting portion being connected to the remote portion and projecting towards the inner surface, the flat portion extending from the connecting portion and extending away from the wall, the fingers extending from the flat portion away from the inner surface.

Claim 28

The enclosure of claim 23 wherein each finger on a wall is substantially uniformly spaced from an adjacent finger.

Claim 29

The enclosure of claim 23 wherein the first housing portion further comprises an outer surface substantially parallel to the inner surface, and a base portion defined by the inner surface, the outer surface and the walls, wherein the thickness of the fingers is less than the thickness of the base portion.

Claim 30

The enclosure of claim 23 wherein the second housing portion comprises an inside surface having walls extending perpendicularly from the inside surface, the walls being located substantially along the perimeter of the inside surface.

Claim 31

The enclosure of claim 26 wherein the walls of the first housing portion are substantially within the perimeter of the walls of the second housing portion and the fingers contact at least some of the walls of the second housing portion.

Claim 32

The enclosure of claim 27 wherein the remote surfaces of the walls of the first housing portion comprise alignment pins projecting away from the inner surface of the first housing portion; the electronic components are carried on a substrate, wherein the substrate is provided with alignment holes formed through the substrate and located near the perimeter of the substrate in a configuration adapted to align with the alignment pins; and the inside surface of the second housing portion further comprises indentations formed therein in a configuration adapted to align with the alignment pins.