US6121690A
Expired / Lapsed
US
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Semiconductor device having two pluralities of electrode pads, pads of different pluralities having different widths and respective pads of different pluralities having an aligned transverse edge
Assignee: Lapis Semiconductor Co Ltd
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Filing: 1998-07-07
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Granted: 2000-09-19
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Expires: 2018-07-07
Abstract
Abstract In order to solve the aforementioned problems, a semiconductor device according to the present invention comprises a semiconductor chip, a plurality of first electrode pads respectively placed along a peripheral edge portion of the semiconductor chip and having first and second transverse ends, and a plurality of second electrode pads respectively having transverse ends near from center lines of the semiconductor chip, the transverse ends being respectively placed at the same distances from the center lines as the first transverse ends of the first electrode pads along the peripheral edge portion of the semiconductor chip, and having widths broader than those of the first electrode pads. The width of each second electrode pad is formed to 1.5 to 2 times as long as that of each first electrode pad. Wires for electrically connecting the first and second electrode pads and leads are formed so as to be bonded at substantially the same intervals. The heights of the wires are formed so as to be substantially identical to each other.
Inventors
- 👤 Shigeru Yamada
- 👤 Youichi Kohara
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 20:31
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/90; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/5445; H10W72/5449; H10W72/547; H10W72/551; H10W72/552; H10W72/5522; H10W72/921; H10W72/926; H10W72/931; H10W72/932; H10W72/951; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
141 words
A semiconductor device, comprising: a semiconductor chip; a plurality of first electrode pads respectively placed along a peripheral edge portion of said semiconductor chip, each first electrode pad of the plurality of first electrode pads having first and second transverse ends, with first transverse ends being closer to center lines of said semiconductor chip than second transverse ends; and a plurality of second electrode pads respectively having first and second transverse ends with first transverse ends being closer to center lines of said semiconductor chip than second transverse ends, said first transverse ends of the plurality of second electrode pads being respectively placed at the same distances from the center lines as the first transverse ends of said first electrode pads along the peripheral edge portion of said semiconductor chip, and having widths broader than those of said first electrode pads.
Claim 2
Dependent Claim
141 words
A semiconductor device, comprising: a semiconductor chip; a plurality of first electrode pads respectively placed along a peripheral edge portion of said semiconductor chip, each first electrode pad of the plurality of first electrode pads having first and second transverse ends, with first transverse ends being closer to center lines of said semiconductor chip than second transverse ends; and a plurality of second electrode pads respectively having first and second transverse ends with first transverse ends being closer to center lines of said semiconductor chip than second transverse ends, said first transverse ends of the plurality of second electrode pads being respectively placed at the same distances from the center lines as the first transverse ends of said first electrode pads along the peripheral edge portion of said semiconductor chip, and having widths broader than those of said first electrode pads.
Claim 3
Dependent Claim
31 words
The device of claim 1, wherein the width of said each second electrode pad is formed to 1.5 to 2 times as long as that of said each first electrode pad.
Claim 4
Dependent Claim
25 words
The device of claim 2, wherein wires for electrically connecting said first and second electrode pads and leads are bonded at substantially the same intervals.
Claim 5
Dependent Claim
25 words
The device of claim 1, wherein wires for electrically connecting said first and second electrode pads and leads are bonded at substantially the same intervals.
Claim 6
Dependent Claim
22 words
The device of claim 4, wherein the heights of the wires are formed so as to be substantially identical to each other.
Claim 7
Dependent Claim
140 words
A semiconductor device, comprising: a semiconductor chip; a plurality of first electrode pads respectively placed along a peripheral edge portion of said semiconductor chip, each first electrode pad of the plurality of first electrode pads having first and second transverse ends, with second transverse ends being further from center lines of said semiconductor chip than first transverse ends; and a plurality of second electrode pads respectively having first and second transverse ends_with second transverse ends being further from center lines of said semiconductor chip than first transverse ends, said second transverse ends of the plurality of second electrode pads being respectively placed at the same distances from the center lines as the second transverse ends of said first electrode pads along the peripheral edge portion of said semiconductor chip, and having widths broader than those of said first electrode pads.
Claim 8
Dependent Claim
140 words
A semiconductor device, comprising: a semiconductor chip; a plurality of first electrode pads respectively placed along a peripheral edge portion of said semiconductor chip, each first electrode pad of the plurality of first electrode pads having first and second transverse ends, with second transverse ends being further from center lines of said semiconductor chip than first transverse ends; and a plurality of second electrode pads respectively having first and second transverse ends_with second transverse ends being further from center lines of said semiconductor chip than first transverse ends, said second transverse ends of the plurality of second electrode pads being respectively placed at the same distances from the center lines as the second transverse ends of said first electrode pads along the peripheral edge portion of said semiconductor chip, and having widths broader than those of said first electrode pads.
Claim 9
Dependent Claim
31 words
The device of claim 6, wherein the width of said each second electrode pad is formed to 1.5 to 2 times as long as that of said each first electrode pad.
Claim 10
Dependent Claim
25 words
The device of claim 7, wherein wires for electrically connecting said first and second electrode pads and leads are bonded at substantially the same intervals.
Claim 11
Dependent Claim
25 words
The device of claim 6, wherein wires for electrically connecting said first and second electrode pads and leads are bonded at substantially the same intervals.
Claim 12
Dependent Claim
22 words
The device of claim 9, wherein the heights of the wires are formed so as to be substantially identical to each other.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-09-19 | 2004-03-20 | 2004-09-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-09-19 | 2008-03-20 | 2008-09-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-09-19 | 2012-03-20 | 2012-09-19 | $7700.00 | Window Closed / Lapsed |