US6115254A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Vertical surface mount apparatus with thermal carrier
Assignee: Micron Technology Inc
•
Filing: 1999-11-16
•
Granted: 2000-09-05
•
Expires: 2019-11-16
Abstract
Abstract A high density vertical surface mount package and thermal carrier therefor including a heat sink.
Inventors
- 👤 Larry D. Kinsman
- 👤 Jerry M. Brooks
- 👤 Walter L. Moden
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 19:34
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/70; H10W40/77; H10W40/778; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09709; H05K2201/10; H05K2201/10431; H05K2201/10439; H05K2201/10454; H05K2201/10613; H05K2201/10621; H05K2201/10659; H05K2201/10696; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 37
Claim 1
Independent Claim
203 words
A semiconductor device chip package assembly for vertically mounting to a surface of a substrate, comprising: a chip package including an encapsulated semiconductor device, said chip package having a first surface, a second surface, a lead edge, a first end surface, a second end surface, and a plurality of lead pins extending along the lead edge for connecting to said surface of said substrate, said plurality of lead pins comprising gull-wing zig-zag lead pins connected to said encapsulated semiconductor device; and a thermal carrier device comprising a thermally conductive member having a pair of insert leads, one insert lead of said pair of insert leads connected to an end of the thermally conductive member extending therefrom for vertically mounting said thermal carrier device to said surface of said substrate, said pair of insert leads offset from said plurality of lead pins of said chip package mounted thereto, said thermal carrier device substantially conforming to a surface area of said first surface of said chip package, said thermal carrier device adhesively connected to said first surface of said chip package and connected by an interference fit by engaging portions of said pair of insert leads thereby providing a heat sink for said chip package.
Claim 2
Dependent Claim
203 words
A semiconductor device chip package assembly for vertically mounting to a surface of a substrate, comprising: a chip package including an encapsulated semiconductor device, said chip package having a first surface, a second surface, a lead edge, a first end surface, a second end surface, and a plurality of lead pins extending along the lead edge for connecting to said surface of said substrate, said plurality of lead pins comprising gull-wing zig-zag lead pins connected to said encapsulated semiconductor device; and a thermal carrier device comprising a thermally conductive member having a pair of insert leads, one insert lead of said pair of insert leads connected to an end of the thermally conductive member extending therefrom for vertically mounting said thermal carrier device to said surface of said substrate, said pair of insert leads offset from said plurality of lead pins of said chip package mounted thereto, said thermal carrier device substantially conforming to a surface area of said first surface of said chip package, said thermal carrier device adhesively connected to said first surface of said chip package and connected by an interference fit by engaging portions of said pair of insert leads thereby providing a heat sink for said chip package.
Claim 3
Dependent Claim
27 words
The semiconductor device chip package assembly of claim 1, wherein the first surface and the second surface of the chip package have substantially the same surface area.
Claim 4
Dependent Claim
67 words
The semiconductor device chip package assembly of claim 1, wherein said thermal carrier device includes a first portion including one of said pair of insert leads and a second portion including another of said pair of insert leads, the first portion and the second portion of said thermal carrier device being located substantially adjacent the first end surface and the second end surface of the chip package.
Claim 5
Dependent Claim
18 words
The semiconductor device chip package assembly of claim 1, wherein said thermal carrier device is comprised of copper.
Claim 6
Dependent Claim
18 words
The semiconductor device chip package assembly of claim 1, wherein said thermal carrier device is comprised of aluminum.
Claim 7
Dependent Claim
24 words
The semiconductor device chip package assembly of claim 1, wherein a portion of said thermal carrier device is coated with a tin/lead alloy metal.
Claim 8
Dependent Claim
24 words
The semiconductor device chip package assembly of claim 1, wherein a portion of said thermal carrier device is coated with a nickel/palladium alloy metal.
Claim 9
Dependent Claim
24 words
The semiconductor device chip package assembly of claim 1, wherein a portion of said thermal carrier device is coated with a nickel/palladium/aluminum alloy metal.
Claim 10
Dependent Claim
24 words
The semiconductor device chip package assembly of claim 1, wherein a portion of said thermal carrier device is coated with a metal for soldering.
Claim 11
Dependent Claim
27 words
The semiconductor device chip package assembly of claim 1, wherein said thermal carrier device has a thickness in the range of 5 mils to about 12 mils.
Claim 12
Dependent Claim
20 words
The semiconductor device chip package assembly of claim 1, wherein said chip package includes a portion thereof made from epoxy.
Claim 13
Dependent Claim
205 words
A semiconductor device chip package assembly for vertically mounting to a surface of a substrate, comprising: a chip package including an encapsulated semiconductor device, said chip package having a first surface, a second surface, a lead edge, a first end surface, a second end surface, and a plurality of lead pins extending along the lead edge for connecting to said surface of said substrate, the plurality of lead pins comprising gull-wing zig-zag lead pins, the first surface and the second surface of the chip package having substantially the same surface area; and a thermal carrier device substantially conforming to the surface area of said first surface of said chip package, said thermal carrier device including a pair of insert leads extending therefrom for substantially vertically mounting said thermal carrier device to said surface of said substrate, each insert lead of said pair of insert leads connected to an end of said thermal carrier device in substantial alignment with said plurality of lead pins of said chip package, said thermal carrier device adhesively connected to said first surface of said chip package and connected by an interference fit by engaging portions of said pair of insert leads thereby providing a heat sink for said chip package.
Claim 14
Dependent Claim
205 words
A semiconductor device chip package assembly for vertically mounting to a surface of a substrate, comprising: a chip package including an encapsulated semiconductor device, said chip package having a first surface, a second surface, a lead edge, a first end surface, a second end surface, and a plurality of lead pins extending along the lead edge for connecting to said surface of said substrate, the plurality of lead pins comprising gull-wing zig-zag lead pins, the first surface and the second surface of the chip package having substantially the same surface area; and a thermal carrier device substantially conforming to the surface area of said first surface of said chip package, said thermal carrier device including a pair of insert leads extending therefrom for substantially vertically mounting said thermal carrier device to said surface of said substrate, each insert lead of said pair of insert leads connected to an end of said thermal carrier device in substantial alignment with said plurality of lead pins of said chip package, said thermal carrier device adhesively connected to said first surface of said chip package and connected by an interference fit by engaging portions of said pair of insert leads thereby providing a heat sink for said chip package.
Claim 15
Dependent Claim
30 words
The semiconductor device chip package assembly of claim 12, wherein the first end surface and the second end surface of said chip package have substantially the same length and thickness.
Claim 16
Dependent Claim
26 words
The semiconductor device chip package assembly of claim 12, wherein said chip package is additionally connected to said thermal carrier device by a plurality of clips.
Claim 17
Dependent Claim
67 words
The semiconductor device chip package assembly of claim 12, wherein said thermal carrier device includes a first portion including one of said pair of insert leads and a second portion including another of said pair of insert leads, the first portion and the second portion of said thermal carrier device being located substantially adjacent the first end surface and the second end surface of the chip package.
Claim 18
Dependent Claim
18 words
The semiconductor device chip package assembly of claim 12, wherein said thermal carrier device is comprised of copper.
Claim 19
Dependent Claim
18 words
The semiconductor device chip package assembly of claim 12, wherein said thermal carrier device is comprised of aluminum.
Claim 20
Dependent Claim
24 words
The semiconductor device chip package assembly of claim 12, wherein a portion of said thermal carrier device is coated with a tin/lead alloy metal.
Claim 21
Dependent Claim
24 words
The semiconductor device chip package assembly of claim 12, wherein a portion of said thermal carrier device is coated with a nickel/palladium alloy metal.
Claim 22
Dependent Claim
23 words
The semiconductor device chip package assembly of claim 12, wherein a portion of said thermal carrier device is coated with a nickel/palladium/alumninum metal.
Claim 23
Dependent Claim
24 words
The semiconductor device chip package assembly of claim 12, wherein a portion of said thermal carrier device is coated with a metal for soldering.
Claim 24
Dependent Claim
27 words
The semiconductor device chip package assembly of claim 12, wherein said thermal carrier device has a thickness in the range of 5 mils to about 12 mils.
Claim 25
Dependent Claim
18 words
The semiconductor device chip package assembly of claim 12, wherein a portion of said chip package includes epoxy.
Claim 26
Independent Claim
201 words
A method of forming a semiconductor device chip package assembly for vertically mounting to a surface of a substrate, comprising: forming a chip package including an encapsulated semiconductor device, said chip package having a first surface, a second surface, a lead edge, a first end surface, a second end surface, and a plurality of lead pins extending along the lead edge for connecting to said surface of said substrate, said plurality of lead pins comprising gull-wing zig-zag leads; forming a thermal carrier device substantially conforming to a surface area of said first surface of said chip package, said thermal carrier device including at least two leads extending therefrom; connecting portions of the thermal carrier device using an interference fit with portions of said chip package, said thermal carrier device including a pair of insert leads extending therefrom; adhesively connecting to said first surface of said chip package, thereby providing a heat sink for said chip package, said thermal carrier device including a pair of insert leads extending therefrom; and mounting said thermal carrier device having said chip package connected thereto to said substrate by connecting said pair of insert leads to said surface of said substrate in a substantially vertically orientation.
Claim 27
Independent Claim
201 words
A method of forming a semiconductor device chip package assembly for vertically mounting to a surface of a substrate, comprising: forming a chip package including an encapsulated semiconductor device, said chip package having a first surface, a second surface, a lead edge, a first end surface, a second end surface, and a plurality of lead pins extending along the lead edge for connecting to said surface of said substrate, said plurality of lead pins comprising gull-wing zig-zag leads; forming a thermal carrier device substantially conforming to a surface area of said first surface of said chip package, said thermal carrier device including at least two leads extending therefrom; connecting portions of the thermal carrier device using an interference fit with portions of said chip package, said thermal carrier device including a pair of insert leads extending therefrom; adhesively connecting to said first surface of said chip package, thereby providing a heat sink for said chip package, said thermal carrier device including a pair of insert leads extending therefrom; and mounting said thermal carrier device having said chip package connected thereto to said substrate by connecting said pair of insert leads to said surface of said substrate in a substantially vertically orientation.
Claim 28
Dependent Claim
23 words
The method of claim 24, wherein the first surface and the second surface of the chip package have substantially the same surface area.
Claim 29
Dependent Claim
63 words
The method of claim 24, wherein said thermal carrier device includes a first portion including one of said pair of insert leads and a second portion including another of said pair of insert leads, the first portion and the second portion of said thermal carrier device being located substantially adjacent the first end surface and the second end surface of the chip package.
Claim 30
Dependent Claim
14 words
The method of claim 24, wherein said thermal carrier device is comprised of copper.
Claim 31
Dependent Claim
14 words
The method of claim 24, wherein said thermal carrier device is comprised of aluminum.
Claim 32
Dependent Claim
20 words
The method of claim 24, wherein a portion of said thermal carrier device is coated with a tin/lead alloy metal.
Claim 33
Dependent Claim
20 words
The method of claim 24, wherein a portion of said thermal carrier device is coated with a nickeupalladium alloy metal.
Claim 34
Dependent Claim
19 words
The method of claim 24, wherein a portion of said thermal carrier device is coated with a nickel/palladium/aluminum metal.
Claim 35
Dependent Claim
20 words
The method of claim 24, wherein a portion of said thermal carrier device is coated with a metal for soldering.
Claim 36
Dependent Claim
24 words
The method of claim 24, wherein said thermal carrier device has a thickness in a range of about 5 mils to about 12 mils.
Claim 37
Dependent Claim
14 words
The method of claim 24, wherein a portion of said chip package includes epoxy.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-09-05 | 2004-03-06 | 2004-09-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-09-05 | 2008-03-06 | 2008-09-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-09-05 | 2012-03-06 | 2012-09-05 | $7700.00 | Window Closed / Lapsed |