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US6087053A Expired / Lapsed US ⏱️ 0.0 years remaining

Device manufacturing method with transfer magnification adjustment to correct thermal distortion of substrate

Assignee: Canon Inc
•
Filing: 1998-05-05
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Granted: 2000-07-11
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Expires: 2018-05-05
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Abstract

Abstract An exposure method includes the steps of transferring, by exposure, a pattern formed on an original to different shot regions on a substrate sequentially, and performing, during exposure of a certain shot, at least one of (i) adjusting a relative positional relation between the original and the substrate, with respect to a direction effective to correct translation of a transfer region of the substrate due to thermal distortion thereof, and (ii) adjusting a transfer magnification of the pattern of the original to the substrate so as to correct enlargement of the transfer region due to thermal distortion of the substrate. In one preferred form, the adjustment is made in accordance with a correction table related to thermal expansion of the substrate during exposure and being prepared on the basis of one of a calculation and a preparatory exposure experiment. In another preferred form, the transfer magnification is adjusted by deforming the original, and in a further preferred form, the transfer magnification is adjusted by adjusting a projection optical system for projecting the pattern of the original to the substrate.

Inventors

  • 👤 Shinichi Hara

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-07 18:10
CPC Classifications
G; G03; G03F; G03F7/00; G03F7/70; G03F7/70425; G03F7/70216; G03F7/70241; G03F7/70258; G03F7/70691; G03F7/70783

Claims Analysis

Total Claims: 7
Claim 1
Independent Claim 100 words
An exposure method, comprising the steps of: transferring, by exposure, a pattern formed on an original to different shot regions on a substrate sequentially; and performing, during exposure of a certain shot, at least one of (i) adjusting a relative positional relation between the original and the substrate, with respect to a direction effective to correct translation of a transfer region of the substrate due to thermal distortion thereof, and (ii) adjusting a transfer magnification of the pattern of the original to the substrate so as to correct enlargement of the transfer region due to thermal distortion of the substrate.
Claim 2
Dependent Claim 100 words
An exposure method, comprising the steps of: transferring, by exposure, a pattern formed on an original to different shot regions on a substrate sequentially; and performing, during exposure of a certain shot, at least one of (i) adjusting a relative positional relation between the original and the substrate, with respect to a direction effective to correct translation of a transfer region of the substrate due to thermal distortion thereof, and (ii) adjusting a transfer magnification of the pattern of the original to the substrate so as to correct enlargement of the transfer region due to thermal distortion of the substrate.
Claim 3
Dependent Claim 42 words
A method according to claim 1, wherein said adjustment is made in accordance with a correction table related to thermal expansion of the substrate during exposure and being prepared on the basis of one of a calculation and a preparatory exposure experiment.
Claim 4
Dependent Claim 16 words
A method according to claim 2, wherein the transfer magnification is adjusted by deforming the original.
Claim 5
Dependent Claim 28 words
A method according to claim 1, wherein the transfer magnification is adjusted by adjusting a projection optical system for projecting the pattern of the original to the substrate.
Claim 6
Dependent Claim 22 words
A method according to claim 1, wherein the exposure uses exposure light which comprises one of X-rays, ultraviolet rays and visible light.
Claim 7
Dependent Claim 53 words
A device manufacturing method, comprising the steps of: preparing a substrate; applying a resist to the substrate prior to exposure thereof; transferring, by exposure, a pattern of an original to the substrate in accordance with an exposure method as recited in claim 1; and developing the resist of the substrate after the exposure.

References Cited (Backward Citations)

US4592081A Cited
JPS6144429A Cited
US5184176A Cited
JPH07183214A Cited
US5604779A Cited
JPH09211872A Cited
US5912096A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2003-07-11 2004-01-10 2004-07-11 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2007-07-11 2008-01-10 2008-07-11 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2011-07-11 2012-01-10 2012-07-11 $7700.00 Window Closed / Lapsed

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