US6081035A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Microelectronic bond ribbon design
Assignee: Adeia Semiconductor Solutions LLC
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Filing: 1996-10-24
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Granted: 2000-06-27
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Expires: 2016-10-24
Abstract
Abstract An improved bond ribbon design, said bond ribbon having a dual taper that functions to localize the bending along a predetermined distribution of the bond ribbon during the bonding of the bond ribbon to an associated contact of a semiconductor chip. Use of the dual-tapered bond ribbons during bonding provides a bonded bond ribbon having a form that is substantially s-shaped. The radii of curvature making out the curves of the s-shaped configuration can be predetermined and controlled by the length and taper of the individual tapered section. The improved bond ribbon further comprises an anchor pad, said anchor pad characterized by a large surface area that decreases the likelihood of delamination of it from a supporting dielectric structure. A multiplicity of these improved bond ribbons can be fabricated in an external connection component so as to facilitate the alignment and bonding process of multiple bond ribbons to corresponding contacts of the semiconductor chip and can be designed, configured or placed such that the corner contact of the semiconductor chip are accessible for bonding. With respect to the problems associated with accessing the corner contacts of a semiconductor chip when using the connection component, three approaches are offered as solutions.
Inventors
- 👤 Michael Warner
- 👤 Thomas H. DiStefano
- 👤 David Gibson
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 15:06
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/701; H10W70/00; H10W70/40; H10W70/421; H10W70/435; H10W70/453; H10W70/456; H10W70/458; H10W72/071; H10W72/077
Claims Analysis
Total Claims: 35
Claim 1
Independent Claim
126 words
A conductive bond ribbon that connects to a semiconductor chip contact from a dielectric support structure wherein said bond ribbon has first and second major surfaces and an edge surface therebetween, the bond ribbon further comprising: a proximal section connected to the support structure; a distal section extending beyond a periphery of the support structure; a neck section between the proximal and distal sections, wherein the first and second surfaces of the neck section are narrower than the corresponding first and second surfaces of the proximal and distal sections; a first tapered section between the neck section and the proximal section; a second tapered section between the neck section and the distal section; and a bonding section between the second tapered section and the distal section.
Claim 2
Dependent Claim
126 words
A conductive bond ribbon that connects to a semiconductor chip contact from a dielectric support structure wherein said bond ribbon has first and second major surfaces and an edge surface therebetween, the bond ribbon further comprising: a proximal section connected to the support structure; a distal section extending beyond a periphery of the support structure; a neck section between the proximal and distal sections, wherein the first and second surfaces of the neck section are narrower than the corresponding first and second surfaces of the proximal and distal sections; a first tapered section between the neck section and the proximal section; a second tapered section between the neck section and the distal section; and a bonding section between the second tapered section and the distal section.
Claim 3
Dependent Claim
49 words
The bond ribbon as claimed in claim 1, wherein, after the bonding section of the bond ribbon has been downset and connected to a chip contact, the first tapered section of the bond ribbon has a radius of curvature and the second tapered section has a radius of curvature.
Claim 4
Dependent Claim
17 words
The bond ribbon as claimed in claim 2, wherein the downset bond ribbon is substantially "s" shaped.
Claim 5
Dependent Claim
33 words
The bond ribbon as claimed in claim 3, wherein the first and second radii of curvature are optimized and controlled by adjusting the length and gradualness of the first and second tapered sections.
Claim 6
Dependent Claim
61 words
The bond ribbon as claimed in claim 1, further including an anchor pad connected to the proximal section wherein said anchor pad has first and second surfaces that are larger than the corresponding first and second surfaces of the proximal section, whereby the larger first and second surfaces decrease the likelihood that the anchor pad will detach from the support structure.
Claim 7
Dependent Claim
16 words
The bond ribbon as claimed in claim 5, wherein the anchor pad includes the proximal section.
Claim 8
Dependent Claim
17 words
The bond ribbon as claimed in claim 6, wherein the anchor pad includes the first tapered section.
Claim 9
Dependent Claim
36 words
The bond ribbon of claims 1 or 5 further comprising one or more projections between the bonding section and the second tapered section wherein said projections extend outwardly from the edge surface of the bond ribbon.
Claim 10
Dependent Claim
226 words
A connection component for connecting conductive bond ribbons to contacts of a semiconductor chip from a dielectric support structure, said connection component comprised of: a conductive frame lying on a peripheral region; the support structure lying within a central region within the frame so that there is a bonding gap between at least a portion of the support and the conductive frame; a plurality of conductive bond ribbons, the bond ribbons each having first and second major surfaces and an edge surface therebetween, a proximal section connected to the support structure, a distal section extending beyond a periphery of the support structure, a neck section between the proximal and distal sections wherein the first and second surfaces of the neck section are narrower than the corresponding first and second surfaces of the proximal and distal sections, a first tapered section between the neck section and the proximal section, a second tapered section between the neck section and the distal section, and a bonding section between the second tapered section and the distal section, wherein the distal sections of the bond ribbons are connected to the frame so that each bond ribbon extends over the bonding gap; and a plurality of conductive terminals on a top surface of the support structure, each conductive terminal being electrically connected to a respective proximal section of a corresponding bond ribbon.
Claim 11
Dependent Claim
226 words
A connection component for connecting conductive bond ribbons to contacts of a semiconductor chip from a dielectric support structure, said connection component comprised of: a conductive frame lying on a peripheral region; the support structure lying within a central region within the frame so that there is a bonding gap between at least a portion of the support and the conductive frame; a plurality of conductive bond ribbons, the bond ribbons each having first and second major surfaces and an edge surface therebetween, a proximal section connected to the support structure, a distal section extending beyond a periphery of the support structure, a neck section between the proximal and distal sections wherein the first and second surfaces of the neck section are narrower than the corresponding first and second surfaces of the proximal and distal sections, a first tapered section between the neck section and the proximal section, a second tapered section between the neck section and the distal section, and a bonding section between the second tapered section and the distal section, wherein the distal sections of the bond ribbons are connected to the frame so that each bond ribbon extends over the bonding gap; and a plurality of conductive terminals on a top surface of the support structure, each conductive terminal being electrically connected to a respective proximal section of a corresponding bond ribbon.
Claim 12
Dependent Claim
61 words
The connection component as claimed in claim 9, further including an anchor pad connected to the proximal section wherein said anchor pad has first and second surfaces that are larger than the corresponding first and second surfaces of the proximal section, whereby the larger first and second surfaces decrease the likelihood that the anchor pad will detach from the support structure.
Claim 13
Dependent Claim
64 words
The connection component as claimed in claims 9 or 10 wherein the support structure and peripheral region are each further comprised of a dielectric layer having a top and bottom surface, wherein the first surface of the proximal sections of each bond ribbon connects to the bottom surface the support structure, and a compliant layer is attached the bottom surface of the support structure.
Claim 14
Dependent Claim
65 words
The connection component as claimed in claims 9 or 10 wherein the support structure and peripheral region are further comprised of a dielectric layer having a top and bottom surface, wherein the second surface of the proximal sections of each bond ribbon connects to the top surface of the support structure, and a compliant layer is attached to the bottom surface of the support structure.
Claim 15
Dependent Claim
49 words
The connection component as claimed in claims 9 or 10 wherein at least one bond ribbon near a corner of the frame extends over the bonding gap at a predetermined angle, whereby the corner contacts of a semiconductor chip are accessible for bonding using such corner located bond ribbons.
Claim 16
Dependent Claim
83 words
The connection component as claimed in claims 9 or 10, wherein the support structure further includes a bridge portion that extends across the bonding gap and connects to the peripheral region, wherein a corner bond ribbon is connected to the bridge at its proximal section and extends across the bonding gap substantially orthogonally with respect to the bridge and is further connected to the frame, whereby the corner bond ribbon may be more easily connected to a corner contact on the semiconductor chip.
Claim 17
Dependent Claim
117 words
A bond ribbon on a semiconductor chip connection component for bonding to a respective corner contact of a semiconductor chip, the bond ribbon comprising: a proximal section connected to the connection component; a distal section being releasably connected to a peripheral component; a central section extending beyond a periphery of the connection component and interconnecting the proximal and distal sections across a bonding gap between the connection component and the peripheral component, the central section being such that the proximal and distal sections do not lie in a straight line with respect to one another when the proximal and distal sections are connected to the central section and the distal section is connected to the peripheral component.
Claim 18
Dependent Claim
117 words
A bond ribbon on a semiconductor chip connection component for bonding to a respective corner contact of a semiconductor chip, the bond ribbon comprising: a proximal section connected to the connection component; a distal section being releasably connected to a peripheral component; a central section extending beyond a periphery of the connection component and interconnecting the proximal and distal sections across a bonding gap between the connection component and the peripheral component, the central section being such that the proximal and distal sections do not lie in a straight line with respect to one another when the proximal and distal sections are connected to the central section and the distal section is connected to the peripheral component.
Claim 19
Dependent Claim
30 words
The bond ribbon as claimed in claim 15, wherein the distal section is substantially perpendicular to the proximal section and the central section has at least one obtuse inner angle.
Claim 20
Dependent Claim
29 words
The bond ribbon as claimed in claim 16, wherein the central section of the bond ribbon has two inner angles, each inner angle being between 110 and 160 degrees.
Claim 21
Dependent Claim
28 words
The bond ribbon as claim in claim 15, wherein the central section of the bond ribbon follows the line of a curve between the proximal and distal sections.
Claim 22
Dependent Claim
43 words
The connection component as claimed in claims 9 or 10, further comprising a frangible section between the distal section and the bonding section whereby during a bonding process the frangible section is broken so as to disconnect the bond ribbon from the frame.
Claim 23
Dependent Claim
166 words
A bond ribbon on a semiconductor chip connection component for bonding to a respective corner contact of a semiconductor chip, the bond ribbon comprising: a proximal section connected to the connection component; a distal section being releasably connected to a peripheral component; a central section extending beyond a periphery of the connection component and interconnecting the proximal and distal sections across a bonding gap between the connection component and the peripheral component, the central section being such that the proximal and distal sections do not lie in a straight line with respect to one another, wherein a rigid portion of the central section of the bond ribbon near the proximal section is more rigid that the distal section and remaining central section of the bond ribbon so that after the bond ribbon is connected to a corner contact on the semiconductor chip the rigid portion remains more planar and better resists torsional forces in comparison to the distal section and the remainder of the central section.
Claim 24
Dependent Claim
166 words
A bond ribbon on a semiconductor chip connection component for bonding to a respective corner contact of a semiconductor chip, the bond ribbon comprising: a proximal section connected to the connection component; a distal section being releasably connected to a peripheral component; a central section extending beyond a periphery of the connection component and interconnecting the proximal and distal sections across a bonding gap between the connection component and the peripheral component, the central section being such that the proximal and distal sections do not lie in a straight line with respect to one another, wherein a rigid portion of the central section of the bond ribbon near the proximal section is more rigid that the distal section and remaining central section of the bond ribbon so that after the bond ribbon is connected to a corner contact on the semiconductor chip the rigid portion remains more planar and better resists torsional forces in comparison to the distal section and the remainder of the central section.
Claim 25
Dependent Claim
29 words
The bond ribbon as claimed in claim 20, wherein the rigid portion is made more rigid by making it wider than the distal section and the remaining central section.
Claim 26
Dependent Claim
29 words
The bond ribbon as claimed in claim 20, wherein the rigid portion is made more rigid by making it thicker than the distal section and the remaining central section.
Claim 27
Dependent Claim
100 words
A bond ribbon on a semiconductor chip connection component for bonding to a respective corner contact of a semiconductor chip, the bond ribbon comprising: a proximal section connected to the connection component; a distal section being releasably connected to a peripheral component; a central section extending beyond a periphery of the connection component and interconnecting the proximal and distal sections across a bonding gap between the connection component and the peripheral component, the central section being such that the proximal and distal sections do not lie in a straight line with respect to one another as viewed in plan view.
Claim 28
Dependent Claim
100 words
A bond ribbon on a semiconductor chip connection component for bonding to a respective corner contact of a semiconductor chip, the bond ribbon comprising: a proximal section connected to the connection component; a distal section being releasably connected to a peripheral component; a central section extending beyond a periphery of the connection component and interconnecting the proximal and distal sections across a bonding gap between the connection component and the peripheral component, the central section being such that the proximal and distal sections do not lie in a straight line with respect to one another as viewed in plan view.
Claim 29
Dependent Claim
30 words
The bond ribbon as claimed in claim 23, wherein the distal section is substantially perpendicular to the proximal section and the central section has at least one obtuse inner angle.
Claim 30
Dependent Claim
29 words
The bond ribbon as claimed in claim 24, wherein the central section of the bond ribbon has two inner angles, each inner angle being between 110 and 160 degrees.
Claim 31
Dependent Claim
28 words
The bond ribbon as claim in claim 23, wherein the central section of the bond ribbon follows the line of a curve between the proximal and distal sections.
Claim 32
Dependent Claim
79 words
The bond ribbon as claimed in claim 24, wherein a rigid portion of the central section of the bond ribbon near the proximal section is more rigid that the distal section and remaining central section of the bond ribbon so that after the bond ribbon is connected to a corner contact on the semiconductor chip the rigid portion remains more planar and better resists torsional forces in comparison to the distal section and the remainder of the central section.
Claim 33
Dependent Claim
29 words
The bond ribbon as claimed in claim 27, wherein the rigid portion is made more rigid by making it wider than the distal section and the remaining central section.
Claim 34
Dependent Claim
29 words
The bond ribbon as claimed in claim 27, wherein the rigid portion is made more rigid by making it thicker than the distal section and the remaining central section.
Claim 35
Dependent Claim
18 words
The bond ribbon as claimed in claim 15, wherein the distal section and the proximal section are co-planar.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-06-27 | 2003-12-27 | 2004-06-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-06-27 | 2007-12-27 | 2008-06-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-06-27 | 2011-12-27 | 2012-06-27 | $7700.00 | Window Closed / Lapsed |