US6078099A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Lead frame structure for preventing the warping of semiconductor package body
Assignee: Walsin Advanced Electronics Ltd
•
Filing: 1999-02-16
•
Granted: 2000-06-20
•
Expires: 2019-02-16
Abstract
Abstract A lead frame structure can prevent the warping of a semiconductor package body. The lead frame has a downset die pad and upset internal leads so that packaging material can be evenly distributed both above and below the lead frame.
Inventors
- 👤 Wen-Chun Liu
- 👤 Jung-Jie Liou
- 👤 Chih-Kung Huang
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 18:15
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/421; H10W70/424; H10W70/427; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 32
Claim 1
Independent Claim
74 words
A lead frame having a plane, comprising: a die pad downward below the plane of the lead frame at the center of the lead frame; and a plurality of leads surrounding the die pad, wherein each lead comprises an internal lead, tips of the internal leads close to the die pad bend upward above the plane of the lead frame, and the die pad and the internal leads are not at the same plane.
Claim 2
Dependent Claim
74 words
A lead frame having a plane, comprising: a die pad downward below the plane of the lead frame at the center of the lead frame; and a plurality of leads surrounding the die pad, wherein each lead comprises an internal lead, tips of the internal leads close to the die pad bend upward above the plane of the lead frame, and the die pad and the internal leads are not at the same plane.
Claim 3
Dependent Claim
16 words
The lead frame of claim 1, wherein the die pad is parallel to the lead frame.
Claim 4
Dependent Claim
23 words
The lead frame of claim 1, wherein all the tips of the internal leads together form a surface that parallels the lead frame.
Claim 5
Dependent Claim
51 words
The lead frame of claim 1, wherein the lead frame further includes side rails such that the die pad is connected to the side rails by a plurality of tie bars and the leads are connected with each other and ultimately to the side rails by a plurality of dam bars.
Claim 6
Dependent Claim
125 words
A semiconductor integrated circuit package, comprising: a silicon chip having a first side and a second side; a die pad attached to the first side of the silicon chip; a plurality of leads surrounding the silicon chip such that each lead includes an internal lead section, a shoulder section and an external lead section, wherein the die pad is downward below the lead shoulder section, the internal leads bend towards the second side of the silicon chip, the internal lead section, the die pad and the lead shoulder section are on different planes, and the leads are furthermore electrically connected to the silicon chip; and an insulating material that seals off the silicon chip, the die pad and the internal lead section of the leads.
Claim 7
Dependent Claim
125 words
A semiconductor integrated circuit package, comprising: a silicon chip having a first side and a second side; a die pad attached to the first side of the silicon chip; a plurality of leads surrounding the silicon chip such that each lead includes an internal lead section, a shoulder section and an external lead section, wherein the die pad is downward below the lead shoulder section, the internal leads bend towards the second side of the silicon chip, the internal lead section, the die pad and the lead shoulder section are on different planes, and the leads are furthermore electrically connected to the silicon chip; and an insulating material that seals off the silicon chip, the die pad and the internal lead section of the leads.
Claim 8
Dependent Claim
20 words
The package of claim 5, wherein the leads are connected to the silicon chip by a plurality of gold wires.
Claim 9
Dependent Claim
20 words
The package of claim 5, wherein the leads are connected to the silicon chip by a plurality of metallic wires.
Claim 10
Dependent Claim
12 words
The package of claim 5, wherein the insulating material includes epoxy resin.
Claim 11
Dependent Claim
17 words
The package of claim 5, wherein the external lead section of the leads includes the pin-through-hole type.
Claim 12
Dependent Claim
18 words
The package of claim 5, wherein the external lead section of the leads includes the gull wing type.
Claim 13
Dependent Claim
16 words
The package of claim 5, wherein the external lead section of the leads includes the J-type.
Claim 14
Dependent Claim
14 words
The package of claim 5, wherein the package can be a small outline package.
Claim 15
Dependent Claim
74 words
A lead frame having a plane, comprising: a die pad downward below the plane of the lead frame at the center of the lead frame; and a plurality of leads surrounding the die pad, wherein each lead comprises an internal lead, tips of the internal leads close to the die pad also bend downward below the plane of the lead frame and the die pad and the internal leads are at the same plane.
Claim 16
Dependent Claim
74 words
A lead frame having a plane, comprising: a die pad downward below the plane of the lead frame at the center of the lead frame; and a plurality of leads surrounding the die pad, wherein each lead comprises an internal lead, tips of the internal leads close to the die pad also bend downward below the plane of the lead frame and the die pad and the internal leads are at the same plane.
Claim 17
Dependent Claim
16 words
The lead frame of claim 13, wherein the die pad is parallel to the lead frame.
Claim 18
Dependent Claim
23 words
The lead frame of claim 13, wherein all the tips of the internal leads together form a surface parallel to the lead frame.
Claim 19
Dependent Claim
51 words
The lead frame of claim 13, wherein the lead frame further includes side rails such that the die pad is connected to the side rails by a plurality of tie bars and the leads are connected with each other and ultimately to the side rails by a plurality of dam bars.
Claim 20
Dependent Claim
125 words
A semiconductor integrated circuit package, comprising: a silicon chip having a first side and a second side; a die pad attached to the first side of the silicon chip; a plurality of leads surrounding the silicon chip such that each lead includes an internal lead section, a shoulder section and an external lead section, wherein the die pad is downward below the lead shoulder section, the internal leads bend towards the first side of the silicon chip, the die pad, the internal lead section and the lead shoulder section are on different planes, and the leads are furthermore electrically connected to the silicon chip; and an insulating material that seals off the silicon chip, the die pad and the internal lead section of the leads.
Claim 21
Dependent Claim
125 words
A semiconductor integrated circuit package, comprising: a silicon chip having a first side and a second side; a die pad attached to the first side of the silicon chip; a plurality of leads surrounding the silicon chip such that each lead includes an internal lead section, a shoulder section and an external lead section, wherein the die pad is downward below the lead shoulder section, the internal leads bend towards the first side of the silicon chip, the die pad, the internal lead section and the lead shoulder section are on different planes, and the leads are furthermore electrically connected to the silicon chip; and an insulating material that seals off the silicon chip, the die pad and the internal lead section of the leads.
Claim 22
Dependent Claim
20 words
The package of claim 17, wherein the leads are connected to the silicon chip by a plurality of gold wires.
Claim 23
Dependent Claim
20 words
The package of claim 17, wherein the leads are connected to the silicon chip by a plurality of aluminum wires.
Claim 24
Dependent Claim
12 words
The package of claim 17, wherein the insulating material includes epoxy resin.
Claim 25
Dependent Claim
17 words
The package of claim 17, wherein the external lead section of the leads includes the pin-through-hole type.
Claim 26
Dependent Claim
18 words
The package of claim 17, wherein the external lead section of the leads includes the gull wing type.
Claim 27
Dependent Claim
16 words
The package of claim 17, wherein the external lead section of the leads includes the J-type.
Claim 28
Dependent Claim
14 words
The package of claim 17, wherein the package can be a small outline package.
Claim 29
Dependent Claim
14 words
The lead frame of claim 1, wherein the lead frame is made of alloy.
Claim 30
Dependent Claim
16 words
The package of claim 5, wherein the die pad and the leads are made of alloy.
Claim 31
Dependent Claim
14 words
The lead frame of claim 13, wherein the lead frame is made of copper.
Claim 32
Dependent Claim
16 words
The package of claim 17, wherein the die pad and the leads are made of copper.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-06-20 | 2003-12-20 | 2004-06-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-06-20 | 2007-12-20 | 2008-06-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-06-20 | 2011-12-20 | 2012-06-20 | $7700.00 | Window Closed / Lapsed |