US6077772A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Methods of forming metal interconnections including thermally treated barrier layers
Assignee: Samsung Electronics Co Ltd
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Filing: 1999-03-16
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Granted: 2000-06-20
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Expires: 2019-03-16
Abstract
Abstract A method of forming a metal interconnection includes the steps of forming a first conductive layer on a substrate, and forming an insulating layer on the first conductive layer and on the substrate. A contact hole is formed in the insulating layer thereby exposing a portion of the first conductive layer, a barrier layer is formed on the exposed portion of the first conductive layer in the contact hole, and a thermal treatment is performed on the barrier layer. After the step of performing the thermal treatment, a wetting layer is formed on a sidewall of the contact hole, and a second conductive layer is formed on the barrier layer and on the wetting layer in the contact hole.
Inventors
- 👤 In-seon Park
- 👤 Sung-tae Kim
- 👤 Du-Hwan Lee
- 👤 Won-Goo Hur
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 01:34
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/056; H10W20/032; H10W20/047; H10W20/048; H10W20/033; H10W20/052; H10W20/0526; H10W20/059
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
141 words
A method of forming a metal interconnection, said method comprising the steps of: forming a first conductive metal layer on a substrate; forming an insulating layer on the first conductive metal layer and on the substrate wherein the insulating layer includes a contact hole therein exposing a portion of the first conductive metal layer; forming a barrier layer on the exposed portion of the first conductive metal layer in the contact hole wherein the barrier layer comprises titanium; performing a thermal treatment on the barrier layer comprising titanium; after the step of performing the thermal treatment, forming a wetting layer on a sidewall of the contact hole; and forming a second conductive metal layer on the barrier layer and on the wetting layer in the contact hole wherein the wetting layer comprises a material different than the second conductive metal layer.
Claim 2
Independent Claim
141 words
A method of forming a metal interconnection, said method comprising the steps of: forming a first conductive metal layer on a substrate; forming an insulating layer on the first conductive metal layer and on the substrate wherein the insulating layer includes a contact hole therein exposing a portion of the first conductive metal layer; forming a barrier layer on the exposed portion of the first conductive metal layer in the contact hole wherein the barrier layer comprises titanium; performing a thermal treatment on the barrier layer comprising titanium; after the step of performing the thermal treatment, forming a wetting layer on a sidewall of the contact hole; and forming a second conductive metal layer on the barrier layer and on the wetting layer in the contact hole wherein the wetting layer comprises a material different than the second conductive metal layer.
Claim 3
Dependent Claim
35 words
A method according to claim 1 wherein the step of performing the thermal treatment comprises heating the barrier layer to a temperature in the range of about 400 degrees C to about 600 degrees C.
Claim 4
Dependent Claim
32 words
A method according to claim 2 wherein the barrier layer is heated to the temperature in the range of about 400 degrees C to about 600 degrees C for about 45 minutes.
Claim 5
Dependent Claim
35 words
A method according to claim 1 wherein the step of performing the thermal treatment comprises heating the barrier layer to a temperature in the range of about 600 degrees C to about 700 degrees C.
Claim 6
Dependent Claim
32 words
A method according to claim 4 wherein the barrier layer is heated to the temperature in the range of about 400 degrees C to about 600 degrees C for about 20 seconds.
Claim 7
Dependent Claim
20 words
A method according to claim 4 wherein the step of performing the thermal treatment comprises a rapid thermal nitridation (RTN).
Claim 8
Dependent Claim
27 words
A method according to claim 1 wherein the step of performing the thermal treatment comprises one of a rapid thermal nitridation (RTN) and a furnace thermal treatment.
Claim 9
Dependent Claim
14 words
A method according to claim 1 wherein the first conductive metal layer comprises tungsten.
Claim 10
Dependent Claim
14 words
A method according to claim 1 wherein the barrier layer comprises titanium nitride (TiN).
Claim 11
Dependent Claim
23 words
A method according to claim 1 wherein the barrier layer comprises a layer of titanium (Ti) and a layer of titanium nitride (TiN).
Claim 12
Dependent Claim
25 words
A method according to claim 1 wherein the wetting layer comprises a material selected from the group consisting of titanium nitride (TiN) and titanium (Ti).
Claim 13
Dependent Claim
28 words
A method according to claim 1 wherein the barrier layer has a thickness of about 150 Angstroms or less on the exposed portion of the first conductive layer.
Claim 14
Dependent Claim
31 words
A method according to claim 1 wherein the wetting layer has a thickness in the range of about 30 Angstroms to about 100 Angstroms on the sidewall of the contact hole.
Claim 15
Dependent Claim
19 words
A method according to claim 1 wherein the step of performing the thermal treatment comprises densifying the barrier layer.
Claim 16
Dependent Claim
33 words
A method according to claim 1 further comprising the step of: after the step of forming the second conductive metal layer, performing a second thermal treatment to reflow the second conductive metal layer.
Claim 17
Dependent Claim
14 words
A method according to claim 1 wherein the second conductive metal layer comprises aluminum.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-06-20 | 2003-12-20 | 2004-06-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-06-20 | 2007-12-20 | 2008-06-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-06-20 | 2011-12-20 | 2012-06-20 | $7700.00 | Window Closed / Lapsed |