US6071653A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for fabricating a photomask
Assignee: United Microelectronics Corp
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Filing: 1998-11-04
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Granted: 2000-06-06
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Expires: 2018-11-04
Abstract
Abstract A method for fabricating a photomask includes forming an anti-reflection layer on a transparent substrate. A transparent layer is formed on the anti-reflection layer. Patterning the transparent layer forms a transparent bar layer so that a portion of the ant-reflection layer is exposed. An opaque layer is formed over the substrate. A polishing process is performed to polish the opaque layer and the transparent bar layer so that a top portion of the transparent bar layer is polished and exposed. An etching back process is performed to remove a portion of the opaque layer so that the anti-reflection layer is exposed and the remains of the opaque layer forms a spacer with uniform thickness on each side of the transparent bar layer. The transparent bar layer is removed by etching so as to form the photomask.
Inventors
- 👤 Benjamin Szu-Min Lin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 17:52
CPC Classifications
G; G03; G03F; G03F1/00; G03F1/38; G03F1/46; B; B82; B82Y; B82Y10/00; G03F1/50
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
77 words
A method for fabricating a photomask, the method comprising: providing a transparent substrate; forming a bar layer covering a predetermined area of the transparent substrate; forming an opaque layer overlying the bar layer and the transparent substrate; removing a portion of the opaque layer to expose the upper surface of the bar layer and the transparent substrate, wherein the remaining opaque layer forms a spacer on a sidewall of the bar layer; and removing the bar layer.
Claim 2
Independent Claim
77 words
A method for fabricating a photomask, the method comprising: providing a transparent substrate; forming a bar layer covering a predetermined area of the transparent substrate; forming an opaque layer overlying the bar layer and the transparent substrate; removing a portion of the opaque layer to expose the upper surface of the bar layer and the transparent substrate, wherein the remaining opaque layer forms a spacer on a sidewall of the bar layer; and removing the bar layer.
Claim 3
Dependent Claim
12 words
The method of claim 1, wherein the bar layer comprises silicon oxide.
Claim 4
Dependent Claim
53 words
The method of claim 1, wherein the step of removing the portion of the opaque layer comprises the steps of: removing a portion of the opaque layer until the substrate is exposed; polishing away top portions of the bar layer and the opaque layer until the remaining opaque layer possesses an uniform thickness.
Claim 5
Dependent Claim
28 words
The method of claim 3, wherein the step of polishing away the top portions of the spacer and the bar layer comprises a chemical mechanical polishing (CMP) process.
Claim 6
Dependent Claim
25 words
The method of claim 1, wherein the method further comprises forming an anti-reflection layer over the substrate before the step of forming the bar layer.
Claim 7
Dependent Claim
13 words
The method of claim 5, wherein the anti-reflection layer comprises CrO 2 .
Claim 8
Dependent Claim
13 words
The method of claim 1, wherein the substrate comprises quartz or silicon glass.
Claim 9
Dependent Claim
18 words
The method of claim 1, wherein the step of forming the material layer comprises chemical vapor deposition (CVD).
Claim 10
Dependent Claim
15 words
The method of claim 1, wherein the step of forming the opaque layer comprises CVD.
Claim 11
Dependent Claim
20 words
The method of claim 1, wherein the step of removing the portion of the opaque layer comprises an etching process.
Claim 12
Dependent Claim
17 words
The method of claim 1, wherein the step of removing the bar layer comprises an etching process.
Claim 13
Independent Claim
99 words
A method for fabricating a photomask, the method comprising: providing a transparent substrate; forming a material layer over the substrate; patterning the material layer to form a bar layer exposing a portion of the substrate; forming an opaque layer over the substrate; polishing away a portion of the opaque layer to expose a top surface of the bar layer; removing another portion of the opaque layer to expose the substrate, wherein the remaining opaque layer forms a spacer on a sidewall of the bar layer and serves as a pattern layer on the substrate; and removing the bar layer.
Claim 14
Independent Claim
99 words
A method for fabricating a photomask, the method comprising: providing a transparent substrate; forming a material layer over the substrate; patterning the material layer to form a bar layer exposing a portion of the substrate; forming an opaque layer over the substrate; polishing away a portion of the opaque layer to expose a top surface of the bar layer; removing another portion of the opaque layer to expose the substrate, wherein the remaining opaque layer forms a spacer on a sidewall of the bar layer and serves as a pattern layer on the substrate; and removing the bar layer.
Claim 15
Dependent Claim
12 words
The method of claim 12, wherein the material layer comprises silicon oxide.
Claim 16
Dependent Claim
25 words
The method of claim 12, wherein before the step of forming the material layer, the method further comprises forming an anti-reflection layer over the substrate.
Claim 17
Dependent Claim
13 words
The method of claim 14, wherein the anti-reflection layer comprises CrO 2 .
Claim 18
Dependent Claim
13 words
The method of claim 12, wherein the substrate comprises quartz or silicon glass.
Claim 19
Dependent Claim
18 words
The method of claim 12, wherein the step of forming the material layer comprises chemical vapor deposition (CVD).
Claim 20
Dependent Claim
22 words
The method of claim 12, wherein the step of removing the another portion of the opaque layer comprises an etching back process.
Claim 21
Dependent Claim
24 words
The method of claim 12, wherein the step of polishing away the portion of the opaque layer comprises a chemical mechanical polishing (CMP) process.
Claim 22
Dependent Claim
17 words
The method of claim 12, wherein the step of removing the bar layer comprises an etching process.
Claim 23
Independent Claim
85 words
A method for manufacturing a photomask, comprising the steps of: providing a transparent substrate; forming a patterned transparent layer on the transparent substrate; forming an opaque layer on the patterned transparent layer and the transparent substrate; removing a portion of the opaque layer to expose a portion of the transparent substrate, wherein the remaining opaque layer on the transparent substrate forms as a bar-type opaque layer at a sidewall of the patterned transparent layer and possesses an uniform thickness; and removing the patterned transparent layer.
Claim 24
Independent Claim
85 words
A method for manufacturing a photomask, comprising the steps of: providing a transparent substrate; forming a patterned transparent layer on the transparent substrate; forming an opaque layer on the patterned transparent layer and the transparent substrate; removing a portion of the opaque layer to expose a portion of the transparent substrate, wherein the remaining opaque layer on the transparent substrate forms as a bar-type opaque layer at a sidewall of the patterned transparent layer and possesses an uniform thickness; and removing the patterned transparent layer.
Claim 25
Dependent Claim
66 words
The method of claim 21, wherein the step of removing the portion of the opaque layer comprises the steps of: performing an etching process to remove a portion of the opaque layer to expose the portion of the transparent substrate; and performing a chemical-mechanical polishing process on the remaining opaque layer and the patterned transparent layer until the thickness of the remaining opaque layer is uniform.
Claim 26
Dependent Claim
66 words
The method of claim 21, wherein the step of removing the portion of the opaque layer comprises the steps of: performing a chemical-mechanical polishing process to remove a portion of the opaque layer until the top surface of the patterned transparent layer is exposed; and performing an etching process to remove a portion of the opaque layer until a portion of the transparent substrate is exposed.
References Cited (Backward Citations)
US5698349A
Cited
US5536606A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-06-06 | 2003-12-06 | 2004-06-06 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-06-06 | 2007-12-06 | 2008-06-06 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-06-06 | 2011-12-06 | 2012-06-06 | $7700.00 | Window Closed / Lapsed |