US6053801A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Substrate polishing with reduced contamination
Assignee: Applied Materials Inc
•
Filing: 1999-05-10
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Granted: 2000-04-25
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Expires: 2019-05-10
Abstract
Abstract Systems and methods for polishing a substrate with reduced contamination are described. A rinse arm has one or more nozzles configured to direct rinse fluid toward a polishing surface for polishing a substrate. The rinse arm further includes a fluid dispenser configured to direct rinse fluid to one or more surfaces of the rinse arm in proximity to the polishing surface and exposed to airborne slurry particles generated from slurry on the polishing surface. By maintaining the atmosphere in the vicinity of the exposed rinse arm surfaces at an elevated relative humidity level, airborne slurry particles adhering to the exposed rinse arm surfaces remain in suspension and, therefore, may be easily cleaned, e.g., during a high pressure rinse cycle. This feature reduces the likelihood that slurry particles will accumulate on exposed surfaces of the polishing apparatus and flake off while a substrate is being polished, reducing the likelihood of substrate defects caused by such slurry contamination.
Inventors
- 👤 Jay D. Pinson
- 👤 Nitin Shah
- 👤 David W. Groechel
- 👤 Joe Waidl
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:03
CPC Classifications
B; B24; B24B; B24B53/00; B24B53/017; B08; B08B; B08B17/00; B08B17/02; B24B57/00; B24B57/02
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
70 words
A substrate polishing system, comprising: a substrate carrier; a polishing surface; and a rinse arm having one or more nozzles configured to direct rinse fluid toward the polishing surface, the rinse arm further having a fluid dispenser configured to direct rinse fluid to one or more surfaces of the rinse arm in proximity to the polishing surface and exposed to airborne slurry particles generated from slurry on the polishing surface.
Claim 2
Dependent Claim
70 words
A substrate polishing system, comprising: a substrate carrier; a polishing surface; and a rinse arm having one or more nozzles configured to direct rinse fluid toward the polishing surface, the rinse arm further having a fluid dispenser configured to direct rinse fluid to one or more surfaces of the rinse arm in proximity to the polishing surface and exposed to airborne slurry particles generated from slurry on the polishing surface.
Claim 3
Dependent Claim
26 words
The system of claim 1, wherein the fluid dispenser is configured to direct moist air in the vicinity of the exposed surfaces of the rinse arm.
Claim 4
Dependent Claim
12 words
The system of claim 1, wherein the fluid dispenser comprises a nozzle.
Claim 5
Dependent Claim
38 words
The system of claim 3, wherein the fluid dispenser is configured to receive a liquid and to direct the liquid through the nozzle to generate a fine mist in the vicinity of the one or more exposed surfaces.
Claim 6
Dependent Claim
37 words
The system of claim 1, wherein, in operation, the fluid dispenser is configured to maintain the atmosphere in the vicinity of the one or more exposed surfaces at a relative humidity level of about 80% or greater.
Claim 7
Dependent Claim
26 words
The system of claim 1, wherein, in operation, the fluid dispenser is configured to maintain a layer of liquid on the one or more exposed surfaces.
Claim 8
Dependent Claim
33 words
The system of claim 1, wherein the rinse arm includes a spray shield, and the fluid dispenser is configured to direct rinse fluid to one or more exposed surfaces of the spray shield.
Claim 9
Dependent Claim
14 words
The system of claim 7, wherein the spray shield has an exposed curved surface.
Claim 10
Dependent Claim
68 words
A substrate polishing method, comprising: supporting a substrate above a polishing surface; dispensing slurry onto the polishing surface; polishing the substrate against the polishing surface; directing rinse fluid through a rinse arm toward the polishing surface; and directing rinse fluid to one or more surfaces of the rinse arm in proximity to the polishing surface and exposed to airborne slurry particles generated from slurry on the polishing surface.
Claim 11
Dependent Claim
68 words
A substrate polishing method, comprising: supporting a substrate above a polishing surface; dispensing slurry onto the polishing surface; polishing the substrate against the polishing surface; directing rinse fluid through a rinse arm toward the polishing surface; and directing rinse fluid to one or more surfaces of the rinse arm in proximity to the polishing surface and exposed to airborne slurry particles generated from slurry on the polishing surface.
Claim 12
Dependent Claim
37 words
The method of claim 9, wherein the step of directing rinse fluid toward one or more exposed surfaces of the rinse arm comprises directing moist air in the vicinity of the exposed surfaces of the rinse arm.
Claim 13
Dependent Claim
31 words
The method of claim 9, wherein the step of directing rinse fluid toward one or more exposed surfaces of the rinse arm comprises generating moist air with a fine mist nozzle.
Claim 14
Dependent Claim
46 words
The method of claim 9, wherein the step of directing rinse fluid toward one or more exposed surfaces of the rinse arm comprises maintaining the atmosphere in the vicinity of the one or more exposed surfaces at a relative humidity level of about 80% or greater.
Claim 15
Dependent Claim
35 words
The method of claim 9, wherein the step of directing rinse fluid toward one or more exposed surfaces of the rinse arm comprises maintaining a layer of liquid on the one or more exposed surfaces.
Claim 16
Dependent Claim
24 words
The method of claim 9, wherein rinse fluid is directed to the one or more exposed surfaces while the polishing surface is being rinsed.
Claim 17
Dependent Claim
24 words
The method of claim 9, wherein rinse fluid is directed to the one or more exposed surfaces after the polishing surface has been rinsed.
Claim 18
Dependent Claim
31 words
The method of claim 9, wherein the substrate is polished by a polishing apparatus, and rinse fluid is directed to one or more exposed surfaces while the polishing apparatus is idle.
Claim 19
Dependent Claim
28 words
The method of claim 9, wherein the rinse arm includes a spray shield, and rinse fluid is directed to one or more exposed surfaces of the spray shield.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-04-25 | 2003-10-25 | 2004-04-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-04-25 | 2007-10-25 | 2008-04-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-04-25 | 2011-10-25 | 2012-04-25 | $7700.00 | Window Closed / Lapsed |