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US6049105A Expired / Lapsed US ⏱️ 0.0 years remaining

DRAM cell arrangement having dynamic self-amplifying memory cells, and method for manufacturing same

Assignee: Polaris Innovations Ltd
•
Filing: 1998-06-03
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Granted: 2000-04-11
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Expires: 2018-06-03
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Abstract

Abstract A DRAM cell arrangement having dynamic, self-amplifying memory cells, and method for manufacturing same, wherein each memory cell includes a selection transistor, a memory transistor and a diode structure. The selection transistor and the memory transistor are each fashioned as vertical MOS transistors and are arranged one over the other such that they are connected to one another via a common source/drain region. A source/drain region of the memory transistor is connected to a supply voltage line, a source/drain region of the selection transistor is connected to a bitline, and the gate electrode of the selection transistor is connected to a wordline. A diode structure is connected between the common source/drain region and the gate electrode of the memory transistor.

Inventors

  • 👤 Wolfgang Krautschneider
  • 👤 Franz Hofmann

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 13:48
CPC Classifications
H; H10; H10B; H10B12/00; H10B12/30; H10B12/34; H10B12/01; H10B12/02; H10B12/05; H10B12/053; H10B12/48; H10B12/488

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 123 words
A DRAM cell arrangement, comprising: a substrate; and a plurality of dynamic self-amplifying memory cells integrated in the substrate, wherein each of the memory cells further comprises: a selection MOS transistor having a source/drain region connected to a bit line and having a gate electrode connected to a word line; a memory MOS transistor connected to the selection MOS transistor via a common source/drain region, the memory MOS transistor and the selection MOS transistor positioned vertically one over the other and in relation to a main surface of the substrate, the memory MOS transistor having a source/drain region connected to a supply voltage line; and a diode structure connected between the common source/drain region and a gate electrode of the memory MOS transistor.
Claim 2
Dependent Claim 123 words
A DRAM cell arrangement, comprising: a substrate; and a plurality of dynamic self-amplifying memory cells integrated in the substrate, wherein each of the memory cells further comprises: a selection MOS transistor having a source/drain region connected to a bit line and having a gate electrode connected to a word line; a memory MOS transistor connected to the selection MOS transistor via a common source/drain region, the memory MOS transistor and the selection MOS transistor positioned vertically one over the other and in relation to a main surface of the substrate, the memory MOS transistor having a source/drain region connected to a supply voltage line; and a diode structure connected between the common source/drain region and a gate electrode of the memory MOS transistor.
Claim 3
Dependent Claim 82 words
A DRAM cell arrangement as claimed in claim 1, further comprising: a plurality of substrate columns extending perpendicularly from the main surface of the substrate, each of the columns associated with one of the plurality of memory cells wherein the selection MOS transistor and memory MOS transistor are positioned on edges of the column and wherein the column is annularly surrounded by the diode structure, the gate electrode of the selection MOS transistor and the gate electrode of the memory MOS transistor.
Claim 4
Dependent Claim 64 words
A DRAM cell arrangement as claimed in claim 2, wherein: the supply voltage line is partially positioned within the substrate underneath a respective column; the word line includes a plurality of segments, each segment arranged between adjacent columns and connecting the gate electrode of the selection MOS transistors respectively positioned on the adjacent columns; and the diode structure is positioned underneath the word line.
Claim 5
Dependent Claim 17 words
A DRAM cell arrangement as claimed in claim 1, wherein the diode structure includes an np diode.
Claim 6
Dependent Claim 17 words
A DRAM cell arrangement as claimed in claim 1, wherein the diode structure includes a Schottky diode.
Claim 7
Dependent Claim 17 words
A DRAM cell arrangement as claimed in claim 1, wherein the diode structure includes a thin-layer diode.
Claim 8
Dependent Claim 38 words
A DRAM cell arrangement as claimed in claim 2, further comprising: an additional conductive structure positioned between adjacent columns wherein the conductive structure engages the diode structures respectively positioned on the adjacent columns to form an additional capacitance.

References Cited (Backward Citations)

WO1992001287A1 Cited
US5308778A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2003-04-11 2003-10-11 2004-04-11 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2007-04-11 2007-10-11 2008-04-11 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2011-04-11 2011-10-11 2012-04-11 $7700.00 Window Closed / Lapsed

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