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US6034393A Expired / Lapsed US ⏱️ 0.0 years remaining

Nonvolatile semiconductor memory device using trench isolation and manufacturing method thereof

Assignee: Renesas Electronics Corp
•
Filing: 1997-12-01
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Granted: 2000-03-07
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Expires: 2017-12-01
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Abstract

Abstract A nonvolatile semiconductor memory device with trench isolation having sufficient capability of isolating memory cells is provided. A trench formed as a line in the main surface of semiconductor substrate is filled with a first insulating film. On semiconductor substrate on both sides of trench, a first gate electrode is provided with a first oxide film interposed. On the first gate electrode, a second gate electrode is provided with a second insulating film interposed. An angle formed by a side wall upper surface of trench and the surface of semiconductor substrate is smaller than 90°.

Inventors

  • 👤 Osamu Sakamoto
  • 👤 Natsuo Ajika

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-03 09:57
CPC Classifications
H; H10; H10B; H10B41/00; H10B41/30; H10W; H10W10/00; H10W10/01; H10W10/011; H10W10/014; H10W10/0143; H10W10/0145; H10W10/10; H10W10/17

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 129 words
A nonvolatile semiconductor memory device using trench isolation, comprising: a silicon semiconductor substrate; a trench for said trench isolation formed as a line in a main surface of said semiconductor substrate; a first insulating film provided on said semiconductor substrate to fill said trench; a first gate electrode provided on said semiconductor substrate on both sides of said trench with a first oxide film interposed; and a second gate electrode formed on said first gate electrode with a second insulating film interposed therebetween; wherein an angle formed by a side wall surface of said trench and an upper surface of said semiconductor substrate is smaller than 90° C.; and said first oxide film is formed of SiO x N y or a material containing SiO x N y .
Claim 2
Dependent Claim 129 words
A nonvolatile semiconductor memory device using trench isolation, comprising: a silicon semiconductor substrate; a trench for said trench isolation formed as a line in a main surface of said semiconductor substrate; a first insulating film provided on said semiconductor substrate to fill said trench; a first gate electrode provided on said semiconductor substrate on both sides of said trench with a first oxide film interposed; and a second gate electrode formed on said first gate electrode with a second insulating film interposed therebetween; wherein an angle formed by a side wall surface of said trench and an upper surface of said semiconductor substrate is smaller than 90° C.; and said first oxide film is formed of SiO x N y or a material containing SiO x N y .
Claim 3
Dependent Claim 84 words
The nonvolatile semiconductor memory device according to claim 1, wherein said second insulating film is formed of a material containing an oxide of same element as a main element constituting said semiconductor substrate, a material containing a nitride of same element as a main element constituting said semiconductor substrate, or a stacked film of a material containing an oxide of same element as a main element constituting said semiconductor substrate and a material containing a nitride of a main element constituting said semiconductor substrate.
Claim 4
Dependent Claim 50 words
The nonvolatile semiconductor memory device according to claim 2, wherein said second insulating film is formed of a material containing SiO 2 , a material containing Si x N y , or a stacked film of a material containing SiO 2 and a material containing Si x N y .
Claim 5
Dependent Claim 25 words
The nonvolatile semiconductor memory device according to claim 1, wherein said first insulating film does not contain any impurity providing conductivity to said semiconductor substrate.
Claim 6
Dependent Claim 49 words
The nonvolatile semiconductor memory device according to claim 1, wherein a portion where said first insulating film is in contact with a side wall of said first gate electrode is below an upper surface of said first gate electrode and above a lower surface of said first gate electrode.
Claim 7
Dependent Claim 121 words
A nonvolatile semiconductor memory device using trench isolation, comprising: a silicon semiconductor substrate; a trench for said trench isolation formed as a line in a main surface of said semiconductor substrate; a first insulating film provided on said semiconductor substrate to fill said trench; a first gate electrode provided on said semiconductor substrate on both sides of said trench with a first oxide film interposed; and a second gate electrode formed on said first gate electrode with a second insulating film interposed therebetween; wherein the width of said trench becomes narrower in the direction of a bottom of the trench, and said first oxide film is formed of SiO x N y or a material containing SiO x N y .
Claim 8
Dependent Claim 121 words
A nonvolatile semiconductor memory device using trench isolation, comprising: a silicon semiconductor substrate; a trench for said trench isolation formed as a line in a main surface of said semiconductor substrate; a first insulating film provided on said semiconductor substrate to fill said trench; a first gate electrode provided on said semiconductor substrate on both sides of said trench with a first oxide film interposed; and a second gate electrode formed on said first gate electrode with a second insulating film interposed therebetween; wherein the width of said trench becomes narrower in the direction of a bottom of the trench, and said first oxide film is formed of SiO x N y or a material containing SiO x N y .

References Cited (Backward Citations)

US5559048A Cited
JPH0817948A Cited
JPH0897275A Cited
JPH098156A Cited
US5844270A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2003-03-07 2003-09-06 2004-03-07 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2007-03-07 2007-09-06 2008-03-07 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2011-03-07 2011-09-06 2012-03-07 $7700.00 Window Closed / Lapsed

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