US6014240A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for an integrated laser beam scanner using a carrier substrate
Assignee: Xerox Corp
•
Filing: 1998-12-01
•
Granted: 2000-01-11
•
Expires: 2018-12-01
Abstract
Abstract An solid state scanning system having a single crystal silicon deflection mirror and scanning mirror is integrated with a light source. Separation of the micro-electro-mechanical systems and light emitters on separate substrates allows the use of flip-chip and solder bump bonding techniques for mounting of the light sources. The separate substrates are subsequently full wafer bonded together to create an integrated solid state scanning system.
Inventors
- 👤 Philip D. Floyd
- 👤 Decai Sun
- 👤 Joel A. Kubby
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 04:04
CPC Classifications
G; G06; G06K; G06K7/00; G06K7/10; G06K7/10544; G06K7/10554; G06K7/10594; G06K7/10603; G06K7/10633; G06K7/10643; G06K7/10653; G02; G02B; G02B26/00; G02B26/08; G02B26/0816; G02B26/0833; G02B26/0841; G02B26/085; G02B26/10
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
135 words
An integrated laser beam scanning structure comprising: a first wafer having a first surface and a second surface, said wafer having a recess piercing said first surface and said second surface; a layer having a first region and a second region, said layer being attached to said first surface; a deflecting mirror fashioned from said first region of said layer; a torsional mirror fashioned from said second region of said layer; a second wafer having a first side; and a light source mounted on said first side of said second wafer, said first side of said second wafer being attached to said second surface of said first wafer such that said light source occupies said recess whereby a light beam emitted from said light source is deflected by said deflecting mirror onto said torsional mirror.
Claim 2
Dependent Claim
135 words
An integrated laser beam scanning structure comprising: a first wafer having a first surface and a second surface, said wafer having a recess piercing said first surface and said second surface; a layer having a first region and a second region, said layer being attached to said first surface; a deflecting mirror fashioned from said first region of said layer; a torsional mirror fashioned from said second region of said layer; a second wafer having a first side; and a light source mounted on said first side of said second wafer, said first side of said second wafer being attached to said second surface of said first wafer such that said light source occupies said recess whereby a light beam emitted from said light source is deflected by said deflecting mirror onto said torsional mirror.
Claim 3
Dependent Claim
15 words
The structure of claim 1 wherein said first wafer is a silicon on oxide wafer.
Claim 4
Dependent Claim
14 words
The structure of claim 1 wherein said layer is a single crystal silicon layer.
Claim 5
Dependent Claim
14 words
The structure of claim 1 wherein said light source is a semiconductor light emitter.
Claim 6
Dependent Claim
23 words
The structure of claim 4 wherein said semiconductor light emitter is mounted on said first side of said second wafer using solder bumps.
Claim 7
Dependent Claim
14 words
The structure of claim 4 wherein said semiconductor light emitter is a VCSEL chip.
Claim 8
Dependent Claim
13 words
The structure of claim 1 wherein said recess is deep reactive ion etched.
Claim 9
Dependent Claim
16 words
The structure of claim 1 wherein said torsional mirror is actuated by a pair of electrodes.
Claim 10
Dependent Claim
16 words
The structure of claim 1 wherein said torsional mirror is actuated by a thin film coil.
Claim 11
Dependent Claim
17 words
The structure of claim 1 wherein a ferromagnetic thin film coil is attached to said torsional mirror.
Claim 12
Dependent Claim
16 words
The structure of claim 1 wherein a thin film coil is attached to said torsional mirror.
Claim 13
Independent Claim
143 words
A method for making an integrated laser beam scanner comprising the steps of: providing a first wafer having a first surface and a second surface, said wafer having a recess piercing said first surface and said second surface; attaching a layer having a first region and a second region to said first surface of said first wafer; fashioning a deflecting mirror from said first region of said layer; fashioning a torsional mirror from said second region of said layer; providing a second wafer having a first side, said second wafer having a light source mounted on said first side; and attaching said first side of said second wafer to said second surface of said first wafer such that said light source occupies said recess whereby a light beam emitted from said light source is deflected by said deflecting mirror onto said torsional mirror.
Claim 14
Independent Claim
143 words
A method for making an integrated laser beam scanner comprising the steps of: providing a first wafer having a first surface and a second surface, said wafer having a recess piercing said first surface and said second surface; attaching a layer having a first region and a second region to said first surface of said first wafer; fashioning a deflecting mirror from said first region of said layer; fashioning a torsional mirror from said second region of said layer; providing a second wafer having a first side, said second wafer having a light source mounted on said first side; and attaching said first side of said second wafer to said second surface of said first wafer such that said light source occupies said recess whereby a light beam emitted from said light source is deflected by said deflecting mirror onto said torsional mirror.
Claim 15
Dependent Claim
14 words
The method of claim 12 wherein said layer is a single crystalline silicon layer.
Claim 16
Dependent Claim
14 words
The method of claim 12 wherein said light source is a semiconductor light emitter.
Claim 17
Dependent Claim
14 words
The method of claim 14 wherein said semiconductor light emitter is a VCSEL chip.
Claim 18
Dependent Claim
15 words
The method of claim 14 wherein said semiconductor light emitter is mounted using solder bumps.
Claim 19
Dependent Claim
16 words
The method of claim 12 wherein said torsional mirror is actuated by a pair of electrodes.
Claim 20
Dependent Claim
21 words
The method of claim 12 wherein said torsional mirror is actuated by a thin film coil and an external magnetic field.
Claim 21
Dependent Claim
17 words
The method of claim 12 wherein a ferromagnetic thin film coil is attached to said torsional mirror.
Claim 22
Dependent Claim
16 words
The method of claim 12 wherein a thin film coil is attached to said torsional mirror.
References Cited (Backward Citations)
US5629790A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-01-10 | 2003-07-12 | 2004-01-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-01-10 | 2007-07-12 | 2008-01-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-01-10 | 2011-07-12 | 2012-01-11 | $7700.00 | Window Closed / Lapsed |