US5995370A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Heat-sinking arrangement for circuit elements
Assignee: Sharp Corp
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Filing: 1998-08-06
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Granted: 1999-11-30
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Expires: 2018-08-06
Abstract
Abstract An effective heat-sinking arrangement is realized for circuit elements used in a portable type information terminal having a small restricted space therein. Wherein, a first substrate has a cavity formed in its insulating layer extending to an earthing layer and filled with a silver paste to form a seat for mounting a CPU that can thus thermally contact with the earthing layer, and a second substrate has a cavity formed in an insulating layer in which cavity a heat-conducting cushion bonded to the top of the CPU is fitted for creating the heat-conductive route between the CPU and the earthing layer of the second substrate.
Inventors
- 👤 Toshihiro Nakamori
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 02:13
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H05K1/0204; H05K1/0206; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/25; H10W40/251; H05K1/18; H05K1/189; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0209; H05K2201/03; H05K2201/0332; H05K2201/0388; H05K2201/0394; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K3/00; H05K3/40; H05K3/4038; H05K3/4053; H05K3/4069
Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
95 words
A heat-sinking arrangement for circuit elements, which comprises: a first substrate; a first earthing conductor layer on the first substrate; one or more circuit elements mounted on the first substrate; a second substrate, wherein the second substrate is electrically connected with the first substrate; a second earthing conductor layer on the second substrate; a conductive connecting member connecting the first earthing conductor layer and the second earthing conductive member; and a heat-conducting member, wherein the circuit elements are thermally connected with the second earthing conductor layer on the second substrate through the heat conducting layer.
Claim 2
Dependent Claim
95 words
A heat-sinking arrangement for circuit elements, which comprises: a first substrate; a first earthing conductor layer on the first substrate; one or more circuit elements mounted on the first substrate; a second substrate, wherein the second substrate is electrically connected with the first substrate; a second earthing conductor layer on the second substrate; a conductive connecting member connecting the first earthing conductor layer and the second earthing conductive member; and a heat-conducting member, wherein the circuit elements are thermally connected with the second earthing conductor layer on the second substrate through the heat conducting layer.
Claim 3
Dependent Claim
40 words
The heat-sinking arrangement for circuit elements as defined in claim 1, wherein the second substrate is disposed above the circuit elements mounted on the first substrate and the heat-conducting member is interposed between the circuit elements and the second substrate.
Claim 4
Dependent Claim
29 words
The heat-sinking arrangement for circuit elements as defined in claim 1 or 2, wherein a part of the second earthing conductive layer of the second substrate is outwardly exposed.
Claim 5
Dependent Claim
20 words
The heat-sinking arrangement for circuit elements as defined in claim 1, wherein the connecting member comprising a flexible wiring substrate.
Claim 6
Dependent Claim
32 words
The heat-sinking arrangement for circuit elements as defined in claim 1, wherein a ground conductor pattern formed on the first substrate is electrically connected to the conductor layer of the second substrate.
Claim 7
Dependent Claim
91 words
A heat-sinking arrangement for circuit elements, which comprises: a folded rigid-flexible wiring substrate; circuit elements mounted on the substrate; an earthing conductor layer formed on the substrate, wherein the circuit elements are thermally contacted with the earthing conductor layer; and a heat conducting member, wherein a part of the earthing conductor layer is exposed as a top exposed surface so that the circuit elements are sandwiched between two parts of the folded rigid-flexible wiring substrate to form a heat-conductive contact, whereby the circuit elements are contacting through the heat conducting member.
Claim 8
Dependent Claim
91 words
A heat-sinking arrangement for circuit elements, which comprises: a folded rigid-flexible wiring substrate; circuit elements mounted on the substrate; an earthing conductor layer formed on the substrate, wherein the circuit elements are thermally contacted with the earthing conductor layer; and a heat conducting member, wherein a part of the earthing conductor layer is exposed as a top exposed surface so that the circuit elements are sandwiched between two parts of the folded rigid-flexible wiring substrate to form a heat-conductive contact, whereby the circuit elements are contacting through the heat conducting member.
Claim 9
Dependent Claim
40 words
The heat-sinking arrangement for circuit elements as defined in claim 1 or 6, further comprising a housing having an inner wall, wherein the conductor layer of each substrate is in contact with the inner wall through a heat conducting cushion.
Claim 10
Dependent Claim
29 words
The heat-sinking arrangement for circuit elements according to claim 1, wherein the earthing layers are made from a conductive metal selected from the group consisting of copper and silver.
Claim 11
Dependent Claim
24 words
The heat-sinking arrangement for circuit elements according to claim 1, wherein the earthing layers form an earthing conductor pattern extending over their respective substrates.
Claim 12
Dependent Claim
51 words
The heat-sinking arrangement for circuit elements according to claim 1, further comprising: an insulating layer on the second substrate; and a signal layer, wherein the signal layer is composed of a pattern of conductors between terminals of electronic parts inserted into or mounted on the insulating layer of the second substrate.
Claim 13
Dependent Claim
21 words
The heat-sinking arrangement for circuit elements according to claim 1, further comprising: insulating resin filling spaces in the pattern of conductors.
Claim 14
Dependent Claim
20 words
The heat-sinking arrangement for circuit elements according to claim 1, wherein the heat conducting member comprises urethane resin or rubber.
Claim 15
Dependent Claim
40 words
The heat-sinking arrangement for circuit elements according to claim 1, wherein the conductive connecting member comprises: a socket (female side half); and a plug (male side half), wherein the plug is fitted in the socket to create an electrical connection.
Claim 16
Dependent Claim
17 words
The heat-sinking arrangement for circuit elements according to claim 1, wherein the circuit element comprises a CPU.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-11-29 | 2003-05-31 | 2003-11-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-11-29 | 2007-05-31 | 2007-11-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-11-29 | 2011-05-31 | 2011-11-30 | $7700.00 | Window Closed / Lapsed |