Fabrication method of printed wiring board

Claim 1

A fabrication method of a printed wiring board, said method comprising the steps of: (a) preparing an adhesive material; said adhesive material being a mixture of a photo-setting resin as a matrix, particles of a photolyzable resin dispersed in said photo-setting resin, and a metal-organic compound or complex mixed with said photo-setting resin; (b) coating said adhesive material on an insulative base material to form an adhesive layer; (c) selectively exposing said adhesive layer to light using a mask with a pattern, thereby selectively curing said photo-setting resin contained in said adhesive layer and selectively photolyzing said particles of said photolyzable resin contained in said adhesive layer; (d) developing said exposed adhesive layer by an alkaline developer solution to selectively remove the exposed or cured parts of said adhesive layer, thereby transferring said pattern on said mask to said adhesive layer and removing said photolyzed particles to roughen the surface of the unexposed parts of said adhesive layer; (e) reducing said metal-organic compound or complex contained in the unexposed parts of said adhesive layer to activate said metal-organic compound or complex, thereby causing said metal-organic compound or complex to reveal plating catalytic activity; and (f) selectively forming a conductive layer on the unexposed parts of said adhesive layer by an electroless plating process of a conductive material; said plating process being performed under the plating catalytic activity of said activated metal-organic compound or complex.