US5993677A
Expired / Lapsed
US
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Process for transferring a thin film from an initial substrate onto a final substrate
Assignee: Commissariat à l'Énergie Atomique et Aux Énergies Alternatives
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Filing: 1997-01-10
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Granted: 1999-11-30
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Expires: 2017-01-10
Abstract
Abstract A thin film is transferred from an initial substrate onto a final substrate. The process includes the following successive stages: joining of the thin film (112) onto a handle substrate (120) comprising a cleavage zone, elimination of the initial substrate, joining of the thin film (112) with a final substrate (132), and cleavage of the handle substrate (120) following the cleavage zone. The cleavage zone includes a film of micro-bubbles formed by ion implantation. The invention has, in particular, applications in the fabrication of three-dimensional structures of integrated circuits.
Inventors
- 👤 Beatrice Biasse
- 👤 Michel Bruel
- 👤 Marc Zussy
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 04:38
CPC Classifications
H; H10; H10P; H10P90/00; H10P90/19; H10P90/1904; H10P90/1906; H10P90/1914; H10P90/1916; H10W; H10W10/00; H10W10/10; H10W10/181; H10P72/00; H10P72/70; H10P72/74; H10P72/7434; Y; Y10; Y10S; Y10S438/00; Y10S438/977
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
141 words
A process for transferring a thin film (112) from an initial substrate (110) onto a final substrate (132) by a handle substrate (120), the thin film having a first face (114) joined to the initial substrate (110) and a second, opposite, free, face (116), comprising the following successive stages: joining the thin film by its free face (116) with a superficial film (124) of the handle substrate (120), the superficial film (124) of the handle substrate being joined to a solid part (122) of the handle substrate (120) by the intermediary of a cleavage zone (126), wherein the cleavage zone (126) comprises a film of micro-bubbles; eliminating the initial substrate (110); joining the first face (114) of the thin film (112) with a face (134) of the final substrate (132); and cleaving the handle substrate (120) along the cleavage zone (126).
Claim 2
Dependent Claim
141 words
A process for transferring a thin film (112) from an initial substrate (110) onto a final substrate (132) by a handle substrate (120), the thin film having a first face (114) joined to the initial substrate (110) and a second, opposite, free, face (116), comprising the following successive stages: joining the thin film by its free face (116) with a superficial film (124) of the handle substrate (120), the superficial film (124) of the handle substrate being joined to a solid part (122) of the handle substrate (120) by the intermediary of a cleavage zone (126), wherein the cleavage zone (126) comprises a film of micro-bubbles; eliminating the initial substrate (110); joining the first face (114) of the thin film (112) with a face (134) of the final substrate (132); and cleaving the handle substrate (120) along the cleavage zone (126).
Claim 3
Dependent Claim
34 words
The process according to claim 1, wherein the superficial film (124) of the handle substrate remaining in contact with the second face (116) of the thin film (112) after said cleaving is also eliminated.
Claim 4
Dependent Claim
28 words
The process according to claim 1, wherein the initial substrate (110) is eliminated by at least one means selected from the group consisting of mechanical abrasion and etching.
Claim 5
Dependent Claim
57 words
The process according to claim 3, wherein said initial substrate (110) is silicon and is linked to the thin film (112) by a silicon oxide intermediary film, and wherein the initial substrate (110) is eliminated successively by: a mechanical abrasion, and an etching wherein the silicon oxide intermediary film acts as a stop layer for said etching.
Claim 6
Dependent Claim
26 words
The process according to claim 1, wherein the initial substrate (110) is eliminated by detaching it from the thin film (112) along its first face (114).
Claim 7
Dependent Claim
46 words
The process according to claim 5, wherein the initial substrate (110) is detached by exerting, on the initial substrate and the handle substrate (120), opposite tensile forces capable of provoking a tearing of the initial substrate along the first face (114) of the thin film (112).
Claim 8
Dependent Claim
33 words
The process according to claim 5, wherein the initial substrate (110) is detached by eliminating a surface sacrificial film from the initial substrate, in contact with the first face of the thin film.
Claim 9
Dependent Claim
76 words
The process according to claim 1, wherein the joining of the thin film (112) on the handle substrate (120) comprises: the mechanical-chemical polishing and/or chemical cleaning of one face (128) of the superficial film (124) of the handle substrate (120), the placing into contact of the second face (116) of the thin film (112) and of the face (128) of the superficial film (124) of the handle substrate, and the annealing of the structure thus obtained.
Claim 10
Dependent Claim
67 words
A process according to claim 1, wherein the joining of the thin film (112) on the final substrate (132) comprises: the mechanical-chemical polishing and/or chemical cleaning of the first face (114) of the thin film (112) and of the said face (134) of the final substrate, the placing of the said faces (114, 134) in contact with each other, and the annealing of the structure thus obtained.
Claim 11
Dependent Claim
21 words
The process according to claim 8, wherein the annealing is carried out at a temperature of the order of 350° C.
Claim 12
Dependent Claim
43 words
The process according to claim 1, wherein at least one of the joinings of the thin film (112) on the handle substrate (120) and of the thin film (112) on the final substrate (132) is an adhesive sticking making use of a glue.
Claim 13
Dependent Claim
45 words
The process according to claim 1, wherein said cleaving comprises a thermal cleavage treatment in order to cause a separation of the solid part (122) and superficial film (124) of the handle substrate (120) along a film of micro-bubbles comprised within the cleavage zone (126).
Claim 14
Dependent Claim
110 words
The process according to claim 1, wherein the joining of the thin film (112) on the final substrate (132) comprises: mechanical-chemical polishing and/or chemical cleaning of the first face (114) of the thin film (112) and of the said face (134) of the final substrate, placing the said faces (114, 134) in contact with each other, and annealing the structure thus obtained, wherein said cleaving comprises a thermal cleavage treatment in order to cause a separation of the solid part (122) and superficial film (124) of the handle substrate (120) along a film of micro-bubbles comprised within the cleavage zone (126), and wherein said annealing comprises said thermal cleavage treatment.
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