Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
111 words
A thin film transistor device structure comprising; a substrate on which a plurality of electrically conducting gate electrodes are disposed; a layer of high dielectric constant gate insulator disposed on said electrodes; a layer of an organic semiconductor disposed on said insulator and substantially overlapping the said electrodes; a plurality of sets of electrically conductive source and drain electrodes disposed on said organic semiconductor in alignment with each of the said gate electrodes; said high dielectric constant insulator is selected from the group consisting of barium strontium titanate, barium zirconate titanate, lead zirconate titanate, lead lanthanum titanate, barium titanate, strontium titanate, barium magnesium fluoride, tantalum pentoxide, titanium dioxide and yttrium trioxide.
Claim 2
Dependent Claim
111 words
A thin film transistor device structure comprising; a substrate on which a plurality of electrically conducting gate electrodes are disposed; a layer of high dielectric constant gate insulator disposed on said electrodes; a layer of an organic semiconductor disposed on said insulator and substantially overlapping the said electrodes; a plurality of sets of electrically conductive source and drain electrodes disposed on said organic semiconductor in alignment with each of the said gate electrodes; said high dielectric constant insulator is selected from the group consisting of barium strontium titanate, barium zirconate titanate, lead zirconate titanate, lead lanthanum titanate, barium titanate, strontium titanate, barium magnesium fluoride, tantalum pentoxide, titanium dioxide and yttrium trioxide.
Claim 3
Dependent Claim
28 words
A structure according to claim 1 further including an insulating passivation layer disposed on said structure that protects it from further processing exposures and from the external ambient.
Claim 4
Dependent Claim
25 words
A structure according to claim 1 wherein the substrate is selected from the group consisting of glass, plastic, quartz, undoped silicon and heavily doped silicon.
Claim 5
Dependent Claim
21 words
A structure according to claim 3 wherein the said plastic substrate is selected from the group comprising polycarbonate, Mylar, and polyimide.
Claim 6
Dependent Claim
35 words
A structure according to claim 1 wherein the said gate electrode material is selected from the group consisting of chromium, titanium, copper, aluminum, molybdenum, tungsten, nickel, gold, platinum, conducting polyaniline, conducting polypyrrole or combinations thereof.
Claim 7
Dependent Claim
40 words
A structure according to claim 1 wherein said gate electrodes are 30 nm to 500 nm thick and are produced by a process selected from the group consisting of evaporation, sputtering, chemical vapor deposition, electrodeposition, spin coating, and electroless plating.
Claim 8
Dependent Claim
22 words
A structure according to claim 1 wherein the said insulator has a thickness in the range of 80 nm to 1000 nm.
Claim 9
Dependent Claim
33 words
A structure according to claim 1 wherein the said insulator is produced by a process selected from the group consisting of sputtering, chemical vapor deposition, sol gel coating, evaporation and laser ablative deposition.
Claim 10
Dependent Claim
112 words
A thin film transistor device structure comprising: a substrate on which a plurality of electrically conducting gate electrodes are disposed; a layer of high dielectric constant gate insulator disposed on said electrodes; a layer of an organic semiconductor disposed on said insulator and substantially overlapping the said electrodes; a plurality of sets of electrically conductive source and drain electrodes disposed on said organic semiconductor in alignment with each of the said gate electrodes; and said high dielectric constant insulator is selected from the group consisting of barium strontium titanate, barium zirconate titanate, lead zirconate titanate, lead lanthanum titanate, barium titanate, strontium titanate, barium magnesium fluoride, tantalum pentoxide, titanium dioxide and yttrium trioxide.
Claim 11
Dependent Claim
112 words
A thin film transistor device structure comprising: a substrate on which a plurality of electrically conducting gate electrodes are disposed; a layer of high dielectric constant gate insulator disposed on said electrodes; a layer of an organic semiconductor disposed on said insulator and substantially overlapping the said electrodes; a plurality of sets of electrically conductive source and drain electrodes disposed on said organic semiconductor in alignment with each of the said gate electrodes; and said high dielectric constant insulator is selected from the group consisting of barium strontium titanate, barium zirconate titanate, lead zirconate titanate, lead lanthanum titanate, barium titanate, strontium titanate, barium magnesium fluoride, tantalum pentoxide, titanium dioxide and yttrium trioxide.
Claim 12
Dependent Claim
28 words
A structure according to claim 1 wherein said organic semiconductor is any polymeric or oligomeric semiconductor that exhibits an increase in field effect mobility with increasing gate voltage.
Claim 13
Dependent Claim
15 words
A structure according to claim 10 wherein said organic semiconductor is an acene molecular material.
Claim 14
Dependent Claim
28 words
A structure according to claim 11 wherein said acene is selected from the group consisting of one or more of naphtalene, anthracene, tetracene, pentacene, hexacene and derivatives thereof.
Claim 15
Dependent Claim
24 words
A structure according to claim 10 wherein the said organic semiconductor layer has a thickness in the range from one monolayer to 400 nm.
Claim 16
Dependent Claim
43 words
A structure according to claim 10 wherein the said semiconductor layer is deposited by a process selected from the group consisting of evaporation, chemical vapor deposition, spin coating and baking, electropolymerization, molecular beam deposition and self assembly from solution or a combination thereof.
Claim 17
Dependent Claim
49 words
A structure according to claim 10 wherein the said semiconductor layer is optionally segmented by a process selected from the group consisting of deposition through a mask, screen printing, stamping, and patterning of the blanket film, in order to minimize the leakage and stray currents in the TFT device.
Claim 18
Dependent Claim
37 words
A structure according to claim 1 wherein said source and drain electrodes are made of material selected from the group consisting of chromium, titanium, copper, aluminum, molybdenum, tungsten, nickel, gold, palladium, platinum, conducting polymers and combinations thereof.
Claim 19
Dependent Claim
46 words
A structure according to claim 16 wherein an optional ohmic contact layer made of a material selected from the group consisting of gold, platinum, palladium, conducting polymers and oligomers, semiconducting polymers and oligomers, and combination thereof, is disposed between said source/drain electrodes and said semiconductor layer.
Claim 20
Dependent Claim
25 words
A structure according to claim 16 wherein the thickness of the said source and drain electrodes is in the range 30 nm to 500 nm.
Claim 21
Dependent Claim
31 words
A structure according to claim 16 wherein said source and drain electrodes are patterned by a method selected from the group consisting of deposition through shadow mask and lithographic patterning techniques.
Claim 22
Dependent Claim
24 words
A structure according to claim 2 wherein said passivation layer is a polymer selected from the group consisting of polyimide, parylene and undoped polyaniline.