Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
164 words
A probe structure comprising a conductive contact part formed on one side of an insulating substrate, a conductive circuit formed on the other side of the insulating substrate, wherein the contact part and the conductive circuit are connected via a conductive path formed in a through-hole formed in the thickness direction of the insulating substrate, and the contact part comprises a deep layer comprising copper, nickel, nickel alloy or a laminate structure of a nickel layer and a copper layer, wherein said deep layer has a hardness of not less than 100 Hk and not more than 700 Hk, an intermediate layer comprising gold, palladium, silver, indium or platinum, wherein said intermediate layer has a hardness of not less than 10 Hk and not more than 300 Hk, and a surface layer comprising rhodium, ruthenium, cobalt-tungsten alloy, chromium, iron-tungsten alloy or chromium-molybdenum alloy, wherein said surface layer has a hardness of not less than 700 Hk and not more than 1200 Hk, successively laminated.
Claim 2
Dependent Claim
164 words
A probe structure comprising a conductive contact part formed on one side of an insulating substrate, a conductive circuit formed on the other side of the insulating substrate, wherein the contact part and the conductive circuit are connected via a conductive path formed in a through-hole formed in the thickness direction of the insulating substrate, and the contact part comprises a deep layer comprising copper, nickel, nickel alloy or a laminate structure of a nickel layer and a copper layer, wherein said deep layer has a hardness of not less than 100 Hk and not more than 700 Hk, an intermediate layer comprising gold, palladium, silver, indium or platinum, wherein said intermediate layer has a hardness of not less than 10 Hk and not more than 300 Hk, and a surface layer comprising rhodium, ruthenium, cobalt-tungsten alloy, chromium, iron-tungsten alloy or chromium-molybdenum alloy, wherein said surface layer has a hardness of not less than 700 Hk and not more than 1200 Hk, successively laminated.
Claim 3
Dependent Claim
24 words
The probe structure of claim 1, wherein the deep layer has a hardness of not less than 100 Hk and less than 300 Hk.
Claim 4
Dependent Claim
26 words
The probe structure of claim 1, wherein the surface layer has a tensile stress at the contact part of not more than 50 kg/mm 2 .
Claim 5
Dependent Claim
42 words
The probe structure of claim 1, wherein the contact part comprises a rhodium surface layer, a gold intermediate layer and a deep layer which is a nickel layer or copper layer, or a laminate of a nickel layer and a copper layer.
Claim 6
Dependent Claim
52 words
The probe structure of claim 1, wherein the intermediate layer at the contact part has a thickness of not less than 0.01 μm and not more than 3 μm and the surface layer at the contact part has a thickness of not less than 0.5 μm and not more than 10 μm.
Claim 7
Dependent Claim
29 words
The probe structure of claim 1, wherein at least one of the surface layer, the intermediate layer and the deep layer at the contact part is formed by plating.
Claim 8
Dependent Claim
24 words
The probe structure of claim 1, wherein the contact part comprises a rhodium surface layer, a gold intermediate layer and a nickel deep layer.
Claim 9
Dependent Claim
58 words
The probe structure of claim 1, wherein the deep layer consists essentially of copper, nickel, nickel alloy or a laminate structure of a nickel layer and a copper layer, the intermediate layer consists essentially of gold, palladium, silver, indium or platinum, and the surface layer consists essentially of rhodium, ruthenium, cobalt-tungsten alloy, chromium, iron-tungsten alloy or chromium-molybdenum alloy.