US5973263A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Encapsulated electronic component and method for encapsulating an electronic component
Assignee: Round Rock Research LLC
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Filing: 1997-08-18
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Granted: 1999-10-26
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Expires: 2017-08-18
Abstract
Abstract An encapsulation body for enclosing an electronic element is disclosed and which includes a first layer of a slow curing two-part epoxy which is in a flowable state; a second layer of material positioned outwardly of the first layer and which substantially retains the first layer of material on the electronic element while the first layer of material is in a flowable state; and a dam surrounding the electronic element, the first and second layers of material received within the dam.
Inventors
- 👤 Mark E. Tuttle
- 👤 Joseph P. Mousseau
- 👤 Clay L. Cirino
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:22
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/40; H10W76/42; H10W76/47; H10W74/00; H10W74/01; H10W74/10; H10W74/111; H10W74/121; H10W74/40; H10W74/47; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49146
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
101 words
An encapsulation body for enclosing an electronic element which rests on a substrate, comprising: a first layer of material positioned in covering relation relative to the electronic component, the first layer of material comprising a slow curing two part epoxy which is in a flowable state; a second layer of material positioned outwardly of the first layer of material and which substantially retains the first layer of material on the electronic element while the first layer of material is in the flowable state; and a dam surrounding the electronic element, the first and second layers of material received within the dam.
Claim 2
Dependent Claim
101 words
An encapsulation body for enclosing an electronic element which rests on a substrate, comprising: a first layer of material positioned in covering relation relative to the electronic component, the first layer of material comprising a slow curing two part epoxy which is in a flowable state; a second layer of material positioned outwardly of the first layer of material and which substantially retains the first layer of material on the electronic element while the first layer of material is in the flowable state; and a dam surrounding the electronic element, the first and second layers of material received within the dam.
Claim 3
Dependent Claim
136 words
An encapsulation body for enclosing an electronic element which rests on a substrate, comprising: a first layer of material positioned in covering relation relative to the electronic component, the first layer of material comprising a slow curing two part epoxy which is in a flowable state, and wherein the first layer two part epoxy has an exterior surface; a second layer of material positioned outwardly of the first layer of material and which substantially retains the first layer of material on the electronic element while the first layer of material is in the flowable state, and wherein the second layer comprises a material which accelerates the hardening of the exterior surface of the first layer two part epoxy; and a dam surrounding the electronic element, the first and second layers of material received within the dam.
Claim 4
Dependent Claim
136 words
An encapsulation body for enclosing an electronic element which rests on a substrate, comprising: a first layer of material positioned in covering relation relative to the electronic component, the first layer of material comprising a slow curing two part epoxy which is in a flowable state, and wherein the first layer two part epoxy has an exterior surface; a second layer of material positioned outwardly of the first layer of material and which substantially retains the first layer of material on the electronic element while the first layer of material is in the flowable state, and wherein the second layer comprises a material which accelerates the hardening of the exterior surface of the first layer two part epoxy; and a dam surrounding the electronic element, the first and second layers of material received within the dam.
Claim 5
Dependent Claim
27 words
An encapsulation body as claimed in claim 2 wherein the second layer of material comprises a catalyst which accelerates hardening and a fast curing two part epoxy.
Claim 6
Dependent Claim
22 words
An encapsulation body as claimed in claim 2, wherein the second layer of material comprises a catalyst, and a light curable coating.
Claim 7
Independent Claim
118 words
A method for encapsulating an electronic component which is supported on a substrate, comprising: providing a first flowable two part epoxy layer on the electronic component, the first flowable two part epoxy layer having a first curing rate; providing a second two part epoxy layer atop the first two part epoxy layer, the second two part epoxy layer having a second curing rate which is faster than the first curing rate, the second two part epoxy layer retaining the first flowable two part epoxy layer on the electronic component while the first flowable two part epoxy layer cures; and providing an enclosure dam around the electronic component, the first flowable layer and second layer received within the dam.
Claim 8
Independent Claim
118 words
A method for encapsulating an electronic component which is supported on a substrate, comprising: providing a first flowable two part epoxy layer on the electronic component, the first flowable two part epoxy layer having a first curing rate; providing a second two part epoxy layer atop the first two part epoxy layer, the second two part epoxy layer having a second curing rate which is faster than the first curing rate, the second two part epoxy layer retaining the first flowable two part epoxy layer on the electronic component while the first flowable two part epoxy layer cures; and providing an enclosure dam around the electronic component, the first flowable layer and second layer received within the dam.
Claim 9
Dependent Claim
37 words
A method as claimed in claim 5, wherein the first flowable two part epoxy layer has an exterior surface, and wherein a catalyst is applied to the exterior surface of the first flowable two part epoxy layer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-10-25 | 2003-04-26 | 2003-10-26 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-10-25 | 2007-04-26 | 2007-10-26 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-10-25 | 2011-04-26 | 2011-10-26 | $7700.00 | Window Closed / Lapsed |