US5969639A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Temperature measuring device
Assignee: UT Battelle LLC
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Filing: 1997-07-28
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Granted: 1999-10-19
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Expires: 2017-07-28
Abstract
Abstract Systems and methods are described for a wireless instrumented silicon wafer that can measure temperatures at various points and transmit those temperature readings to an external receiver. The device has particular utility in the processing of semiconductor wafers, where it can be used to map thermal uniformity on hot plates, cold plates, spin bowl chucks, etc. without the inconvenience of wires or the inevitable thermal perturbations attendant with them.
Inventors
- 👤 Robert J. Lauf
- 👤 Don W. Bible
- 👤 Carl W. Sohns
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 00:51
CPC Classifications
H; H01; H01Q; H01Q3/00; H01Q3/26
Claims Analysis
Total Claims: 35
Claim 1
Independent Claim
67 words
A temperature measurement device, comprising: a silicon semiconductor wafer; a solid-state temperature sensor mounted on said silicon semiconductor wafer; and a signal transmitter adapted to transmit an output signal of said solid-state temperature sensor to an external receiver from approximately -65° C., to approximately 200° C., said signal transmitter and said solid-state temperature sensor composing a set of integrated circuits disposed directly upon said silicon semiconductor wafer.
Claim 2
Dependent Claim
67 words
A temperature measurement device, comprising: a silicon semiconductor wafer; a solid-state temperature sensor mounted on said silicon semiconductor wafer; and a signal transmitter adapted to transmit an output signal of said solid-state temperature sensor to an external receiver from approximately -65° C., to approximately 200° C., said signal transmitter and said solid-state temperature sensor composing a set of integrated circuits disposed directly upon said silicon semiconductor wafer.
Claim 3
Dependent Claim
41 words
The device of claim 1, further comprising a plurality of temperature sensors disposed at a plurality of selected locations on said silicon semiconductor wafer such that temperatures at said plurality of selected locations on said silicon semiconductor wafer can be measured.
Claim 4
Dependent Claim
16 words
The device of claim 1, further comprising a power source located on said silicon semiconductor wafer.
Claim 5
Independent Claim
31 words
The device of claime 3, wherein said power source includes a thin film device selected from the group consisting of a battery, a capacitor, an inductive pick-up, and a photovoltaic device.
Claim 6
Dependent Claim
25 words
The device of claim 4, wherein said power source is fabricated directly upon said silicon semiconductor wafer as part of said set of integrated circuits.
Claim 7
Dependent Claim
19 words
The device of claim 1, wherein said temperature sensor includes a temperature detecting element and a signal conditioning circuit.
Claim 8
Dependent Claim
30 words
The device of claim 6, wherein said temperature detecting element includes a device selected from the group consisting of a thermocouple, a resistive temperature detector, a thermistor, and a diode.
Claim 9
Dependent Claim
29 words
The device of claim 1, wherein said signal transmitter includes an RF transmitter and an antenna, said RF transmitter and said antenna being colocated upon said silicon semiconductor wafer.
Claim 10
Dependent Claim
21 words
The device of claim 2, further comprising a switch for individually activating said plurality of temperature sensors in a sequential order.
Claim 11
Dependent Claim
26 words
The device of claim 1, further comprising a clock and a memory whereby temperature data can be captured at selected times and stored for later retrieval.
Claim 12
Dependent Claim
29 words
The device of claim 1, further comprising an RF receiver whereby instructions can be received from an external transmitter and the operations of said device can be controlled thereby.
Claim 13
Independent Claim
144 words
A system for measuring temperatures at various locations and times in a silicon semiconductor wafer processing environment, comprising: a temperature measuring device comprising: a silicon semiconductor wafer; a solid-state temperature sensor mounted on said silicon semiconductor wafer; a signal transmitter adapted to transmit an output signal of said temperature sensor to an external receiver from approximately -65° C. to approximately 200° C., said signal transmitter and said temperature sensor composing a set of integrated circuits disposed directly upon said silicon semiconductor wafer; an external receiver located outside said silicon semiconductor wafer processing environment, said external receiver adapted to receive said output signal from said signal transmitter; and an external data processing device coupled to said external receiver, said external data processing device adapted to convert said output signal into useful information for a function selected from the group consisting of display, storage, and retrieval.
Claim 14
Independent Claim
144 words
A system for measuring temperatures at various locations and times in a silicon semiconductor wafer processing environment, comprising: a temperature measuring device comprising: a silicon semiconductor wafer; a solid-state temperature sensor mounted on said silicon semiconductor wafer; a signal transmitter adapted to transmit an output signal of said temperature sensor to an external receiver from approximately -65° C. to approximately 200° C., said signal transmitter and said temperature sensor composing a set of integrated circuits disposed directly upon said silicon semiconductor wafer; an external receiver located outside said silicon semiconductor wafer processing environment, said external receiver adapted to receive said output signal from said signal transmitter; and an external data processing device coupled to said external receiver, said external data processing device adapted to convert said output signal into useful information for a function selected from the group consisting of display, storage, and retrieval.
Claim 15
Dependent Claim
40 words
The system of claim 12, wherein said temperature measuring device further includes a plurality of temperature sensors disposed at a plurality of locations about said silicon semiconductor wafer such that temperatures at said plurality of locations can be measured thereby.
Claim 16
Dependent Claim
24 words
The system of claim 12, wherein said temperature measuring device includes a power source, said power source being located upon said silicon semiconductor wafer.
Claim 17
Dependent Claim
31 words
The system of claim 14, wherein said power source includes a thin film device selected from the group consisting of a battery, a capacitor, an inductive pick-up and a photovoltaic device.
Claim 18
Dependent Claim
26 words
The system of claim 14, wherein said power source is fabricated directly upon said silicon semiconductor wafer as a part of said set of integrated circuits.
Claim 19
Dependent Claim
19 words
The system of claim 12, wherein said temperature sensor includes a temperature detecting element and a signal conditioning circuit.
Claim 20
Dependent Claim
30 words
The system of claim 17, wherein said temperature detecting element is a device selected from the group consisting of a thermocouple, a resistive temperature detector, a thermistor, and a diode.
Claim 21
Dependent Claim
28 words
The system of claim 12, wherein said signal transmitter includes an RF transmitter and an antenna, said transmitter and said antenna being colocated upon said silicon semiconductor wafer.
Claim 22
Dependent Claim
22 words
The system of claim 13, further comprising a switch for individually activating said plurality of temperature sensors in a desired sequential order.
Claim 23
Dependent Claim
46 words
The system of claim 12, further comprising a signal conditioning circuit electrically connected to said solid-state temperature sensor and said signal transmitter, said signal conditioning circuit including a clock and a memory whereby temperature data can be captured at selected times and stored for later retrieval.
Claim 24
Dependent Claim
37 words
The system of claim 12, further comprising an RF receiver located on said silicon semiconductor wafer whereby instructions can be received from an external transmitter and the operations of said temperature measuring device can be controlled thereby.
Claim 25
Dependent Claim
45 words
The system of claim 12, wherein said temperature measuring device includes at least two temperature sensing devices, a signal conditioner circuit, a power supply, an RF transmitter, and an antenna, all of which are fabricated as a monolithic integrated circuit upon said silicon semiconductor wafer.
Claim 26
Dependent Claim
34 words
The device of claim 2, wherein said plurality of temperature sensors are a plurality of resistance temperature detectors, and, further comprising a common current loop electrically connected to said plurality of resistance temperature detectors.
Claim 27
Dependent Claim
18 words
The device of claim 2, wherein said plurality of temperature sensors are energized by a common voltage source.
Claim 28
Dependent Claim
32 words
The device of claim 1, wherein said signal transmitter includes an infrared emitting diode, and, further comprising a voltage controlled oscillator electrically connected between said temperature sensor and said infrared emitting diode.
Claim 29
Dependent Claim
25 words
The system of claim 13, wherein said signal transmitter includes a plurality of infrared emitting diodes and said external receiver includes a movable infrared sensor.
Claim 30
Dependent Claim
23 words
The device of claim 2, wherein said signal transmitter includes an infrared emitting diode and said output signal includes a time domain signal.
Claim 31
Independent Claim
71 words
A method, comprising: sensing a temperature on a silicon semiconductor wafer with a solid-state temperature sensor that is mounted on said silicon semiconductor wafer; and transmitting an output signal of said solid-state temperature sensor from approximately -65° C. to approximately 200° C., to an external receiver from a signal transmitter, said signal transmitter and said solid-state temperature sensor composing a set of integrated circuits disposed directly upon said silicon semiconductor wafer.
Claim 32
Independent Claim
71 words
A method, comprising: sensing a temperature on a silicon semiconductor wafer with a solid-state temperature sensor that is mounted on said silicon semiconductor wafer; and transmitting an output signal of said solid-state temperature sensor from approximately -65° C. to approximately 200° C., to an external receiver from a signal transmitter, said signal transmitter and said solid-state temperature sensor composing a set of integrated circuits disposed directly upon said silicon semiconductor wafer.
Claim 33
Dependent Claim
48 words
The method of claim 29, further comprising sensing a plurality of temperatures with a plurality of temperature sensors that are energized by a common voltage source and performing a differential measurement by comparing the output of two of the plurality of temperature sensors and transmitting a differential signal.
Claim 34
Dependent Claim
34 words
The device of claim 1, further comprising a mandrel, said silicon semiconductor wafer being mounted on said mandrel; a bushing connected to said mandrel; and a set of brushes in contact with said bushing.
Claim 35
Dependent Claim
34 words
The system of claim 12, further comprising a mandrel, said silicon semiconductor wafer being mounted on said mandrel; a bushing connected to said mandrel; and a set of brushes in contact with said bushing.
References Cited (Backward Citations)
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| 3.5 Years (Year 4) | 2002-10-18 | 2003-04-19 | 2003-10-19 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-10-18 | 2007-04-19 | 2007-10-19 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-10-18 | 2011-04-19 | 2011-10-19 | $7700.00 | Window Closed / Lapsed |