Cooling system for electronics

Claim 1

A cooling system for cooling electronic components, comprising a hermetically closed pipe circuit which includes an evaporator and a condenser and in which a refrigerant used in the circuit is circulated by a thermosiphon effect, the evaporator being in heat-conducting contact with a plurality of heat-emitting components of a multichip module to be cooled and absorbs heat therefrom, the absorbed heat being transported through the pipe circuit by the refrigerant to the condenser and dissipated therein, the pipe circuit including a plurality of series-connected evaporators each being in heat-conducting contact with one of said heat-emitting components, each of the evaporators including a heat-conducting body having a plurality of narrow and mutually parallel passageways between a respective inlet chamber and outlet chamber formed in said conducting body and connected to the pipe circuit, said evaporators being disposed on the heat-emitting components of the multichip module and inside said multichip module, the evaporators together enhancing pumping of the refrigerant used in the pipe circuit, the condenser being located outside the multichip module and on a carrier side of the multichip module so that the liquid level of the condensed refrigerant is below an uppermost evaporator in the pipe circuit.