US5946791A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for testing and mounting integrated circuits onto printed circuit boards
Assignee: Micron Technology Inc
•
Filing: 1997-07-24
•
Granted: 1999-09-07
•
Expires: 2017-07-24
Abstract
Abstract An integrated circuit (IC) device is mounted onto a printed circuit board (PCB) by inducing a magnetic field of a selected strength at the surface of the PCB to temporarily hold the IC device onto the PCB. The IC device is provided with magnetic material which is attracted by the magnetic field. The magnetic field is maintained while the IC device and PCB are tested, and then subsequently during soldering when the IC device is permanently bonded to the PCB.
Inventors
- 👤 Donald D. Baldwin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-10 01:58
CPC Classifications
B; B23; B23K; B23K31/00; B23K31/12; B23K1/00; B23K1/0008; B23K1/0016; B23K3/00; B23K3/08; B23K3/087; B23Q; B23Q3/00; B23Q3/15; B23Q3/154; B23Q3/1546; G; G01; G01R; G01R1/00; G01R1/02; G01R1/04; H; H05; H05K; H05K3/00; H05K3/30; H05K3/303; H05K3/32; H05K3/325; B23K2101/00; B23K2101/36; B23K2101/40; B23K2101/42; H05K2201/00; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K2203/00; H05K2203/10; H05K2203/104; H05K2203/13; H05K2203/1377; H05K2203/1394; H05K2203/16; H05K2203/162; H05K3/34; H05K3/341; H05K3/3421; Y; Y02; Y02P; Y02P70/00; Y02P70/50; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49004; Y10T29/49117; Y10T29/49121; Y10T29/49124; Y10T29/49126; Y10T29/4913; Y10T29/49133; Y10T29/49144; Y10T29/49155; Y10T29/53; Y10T29/53039; Y10T29/53061; Y10T29/53083; Y10T29/5313; Y10T29/53174; Y10T29/53183; Y10T29/53196
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
162 words
A method for mounting an integrated circuit onto a printed circuit board, the printed circuit board having a plurality of bonding sites, the integrated circuit having a plurality of conductive bonding portions arranged to electrically contact corresponding bonding sites when the integrated circuit is mounted to the printed circuit board, the method comprising: providing a printed circuit board having an upper surface; providing magnetic material within the integrated circuit; inducing a magnetic field at the upper surface of the printed circuit board to hold the integrated circuit onto the printed circuit board with the conductive portions of the integrated circuit in alignment with the corresponding bonding sites; testing the printed circuit board and integrated circuit while the integrated circuit is being held onto the printed circuit board by the magnetic field; and fixing the conductive bonding portions to the corresponding bonding sites of the printed circuit board while the integrated circuit is held onto the printed circuit board by the magnetic field.
Claim 2
Independent Claim
162 words
A method for mounting an integrated circuit onto a printed circuit board, the printed circuit board having a plurality of bonding sites, the integrated circuit having a plurality of conductive bonding portions arranged to electrically contact corresponding bonding sites when the integrated circuit is mounted to the printed circuit board, the method comprising: providing a printed circuit board having an upper surface; providing magnetic material within the integrated circuit; inducing a magnetic field at the upper surface of the printed circuit board to hold the integrated circuit onto the printed circuit board with the conductive portions of the integrated circuit in alignment with the corresponding bonding sites; testing the printed circuit board and integrated circuit while the integrated circuit is being held onto the printed circuit board by the magnetic field; and fixing the conductive bonding portions to the corresponding bonding sites of the printed circuit board while the integrated circuit is held onto the printed circuit board by the magnetic field.
Claim 3
Dependent Claim
46 words
A method for mounting an integrated circuit onto a printed circuit board according to claim 1 and further comprising providing a layer of magnetic material within the integrated circuit, and wherein the integrated circuit has a plurality of conductive bonding pads defining the conductive bonding portions.
Claim 4
Dependent Claim
65 words
A method for mounting an integrated circuit onto a printed circuit board according to claim 1 wherein the integrated circuit comprises a package including a chip encapsulated in a casing and a lead frame electrically coupled to the chip, the lead frame having a plurality of conductive leads which form the conductive bonding portions and further comprising forming the lead frame of a magnetic material.
Claim 5
Dependent Claim
31 words
A method for mounting an integrated circuit onto a printed circuit board according to claim 1 wherein the magnetic material is selected from a group consisting of iron, nickel, and cobalt.
Claim 6
Dependent Claim
58 words
A method for mounting an integrated circuit onto a printed circuit board according to claim 1 and further comprising providing a layer of magnetic material in the printed circuit board, and magnetically charging the printed circuit board layer to attract the magnetic material in the integrated circuit and to hold the integrated circuit onto the printed circuit board.
Claim 7
Independent Claim
179 words
A method for mounting an integrated circuit onto a printed circuit board, the printed circuit board having a plurality of bonding sites, the integrated circuit having a plurality of conductive bonding portions for electrically contacting corresponding bonding sites when the integrated circuit is mounted to the printed circuit board, the method comprising: providing a printed circuit board having an upper surface; providing magnetic material within the integrated circuit; positioning the integrated circuit relative to the printed circuit board with the conductive portions of the integrated circuit aligned with and contacting the corresponding bonding sites of the printed circuit board; inducing a magnetic field of a selected strength at the surface of the printed circuit board to hold the integrated circuit onto the printed circuit board; testing the printed circuit board and integrated circuit while the integrated circuit is being held onto the printed circuit board by the magnetic field; and soldering the conductive portions to the corresponding bonding sites of the printed circuit board while the integrated circuit is held onto the printed circuit board by the magnetic field.
Claim 8
Independent Claim
179 words
A method for mounting an integrated circuit onto a printed circuit board, the printed circuit board having a plurality of bonding sites, the integrated circuit having a plurality of conductive bonding portions for electrically contacting corresponding bonding sites when the integrated circuit is mounted to the printed circuit board, the method comprising: providing a printed circuit board having an upper surface; providing magnetic material within the integrated circuit; positioning the integrated circuit relative to the printed circuit board with the conductive portions of the integrated circuit aligned with and contacting the corresponding bonding sites of the printed circuit board; inducing a magnetic field of a selected strength at the surface of the printed circuit board to hold the integrated circuit onto the printed circuit board; testing the printed circuit board and integrated circuit while the integrated circuit is being held onto the printed circuit board by the magnetic field; and soldering the conductive portions to the corresponding bonding sites of the printed circuit board while the integrated circuit is held onto the printed circuit board by the magnetic field.
Claim 9
Dependent Claim
48 words
A method for mounting an integrated circuit onto a printed circuit board according to claim 6 and further comprising providing a layer of magnetic material within the chip, and wherein the integrated circuit comprises a chip having a plurality of bonding pads which form the conductive bonding portions.
Claim 10
Dependent Claim
63 words
A method for mounting an integrated circuit onto a printed circuit board according to claim 6 wherein the integrated circuit comprises a chip encapsulated in a casing and a lead frame electrically coupled to the chip, the lead frame having a plurality of conductive leads which form the conductive bonding portions, the method further comprising forming the lead frame of a magnetic material.
Claim 11
Dependent Claim
55 words
A method for mounting an integrated circuit onto a printed circuit board according to claim 6 and further comprising providing a layer of magnetic material in the printed circuit board, and magnetically charging the layer to attract the magnetic material in the integrated circuit and to hold the integrated circuit onto the printed circuit board.
Claim 12
Dependent Claim
94 words
A method for mounting an integrated circuit onto a printed circuit board according to claim 6 and further comprising moving the integrated circuit using a transfer mechanism having a handling instrument, the handling instrument having a surface, creating a magnetic field to attract the integrated circuit to the surface of the handling instrument, maintaining the magnetic field to transfer the integrated circuit to the printed circuit board and to align the conductive portions with the bonding sites, and ceasing to create the magnetic field after the conductive portions are aligned with the bonding sites.
Claim 13
Dependent Claim
129 words
A method for mounting an integrated circuit onto a printed circuit board according to claim 6 and further comprising providing a layer of magnetic material in the printed circuit board, moving the integrated circuit using a transfer mechanism having a handling instrument, the handling instrument having a surface, creating a magnetic field to attract the integrated circuit to the surface of the handling instrument, maintaining the magnetic field to transfer the integrated circuit to the printed circuit board and to align the conductive portions with the bonding sites, ceasing to create the magnetic field after the conductive portions are aligned with the bonding sites, and magnetically charging the layer to attract the magnetic material in the integrated circuit and to hold the integrated circuit onto the printed circuit board.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-09-06 | 2003-03-08 | 2003-09-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-09-06 | 2007-03-08 | 2007-09-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-09-06 | 2011-03-08 | 2011-09-07 | $7700.00 | Window Closed / Lapsed |