US5946192A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Power transistor module packaging structure
Assignee: Mitsubishi Electric Corp
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Filing: 1997-07-31
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Granted: 1999-08-31
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Expires: 2017-07-31
Abstract
Abstract An apparatus which secures a heat sink to an electrical component connected to a circuit board, including a first outer cover which engages a portion of the heat sink and a portion of the circuit board. In addition, the first outer cover encloses the electrical component, and the electrical component has at least two pins, a first surface facing the circuit board, and a second surface facing the heat sink. Further, a majority of heat dissipating surfaces of the heat sink are outside a space enclosed by the first outer cover and the circuit board.
Inventors
- 👤 Takahiro Ishigami
- 👤 Hitoshi Tanifuji
- 👤 Yoshihiko Kikkawa
- 👤 Yoshihiro Iwasaki
- 👤 Hiroaki Suzuki
- 👤 Makoto Tanikawa
- 👤 Masahito Mori
- 👤 Isao Kawasaki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 19:29
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H05K7/2039; H05K7/20409; H05K7/20418
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
132 words
An apparatus which secures a heat sink to an electrical component connected to a circuit board, comprising: a first outer cover which engages a portion of said heat sink and a portion of said circuit board, said first outer cover enclosing said electrical component; said electrical component having at least two pins, a first surface facing said circuit board, and a second surface facing said heat sink; and a fastener having an engaging face on a pin side of the electrical component and a shaft extending into the heat sink to squeeze the electrical component from the pin side of the electrical component against the heat sink, wherein a majority of heat dissipating surfaces of the heat sink are outside a space enclosed by the first outer cover and the circuit board.
Claim 2
Independent Claim
132 words
An apparatus which secures a heat sink to an electrical component connected to a circuit board, comprising: a first outer cover which engages a portion of said heat sink and a portion of said circuit board, said first outer cover enclosing said electrical component; said electrical component having at least two pins, a first surface facing said circuit board, and a second surface facing said heat sink; and a fastener having an engaging face on a pin side of the electrical component and a shaft extending into the heat sink to squeeze the electrical component from the pin side of the electrical component against the heat sink, wherein a majority of heat dissipating surfaces of the heat sink are outside a space enclosed by the first outer cover and the circuit board.
Claim 3
Dependent Claim
30 words
An apparatus according to claim 1, wherein said first surface of said electrical component faces a top surface of said circuit board having at least one other electrical component thereon.
Claim 4
Dependent Claim
14 words
An apparatus according to claim 1, wherein said electrical component comprises a power module.
Claim 5
Dependent Claim
15 words
An apparatus according to claim 1, wherein said first outer cover supports said heat sink.
Claim 6
Dependent Claim
36 words
An apparatus according to claim 1, wherein said at least two pins of said electrical component extend substantially perpendicular to said first surface of said electrical component and connect said electrical component to said circuit board.
Claim 7
Dependent Claim
19 words
An apparatus according to claim 1, wherein said at least two pins of said electrical component comprise hook-shaped pins.
Claim 8
Dependent Claim
24 words
An apparatus according to claim 1, further comprising a base plate disposed between said second surface of said electrical component and said heat sink.
Claim 9
Dependent Claim
22 words
An apparatus according to claim 1, wherein said heat sink comprises a plurality of fins substantially perpendicular to said first outer cover.
Claim 10
Dependent Claim
26 words
An apparatus according to claim 2, further comprising a second outer cover engaged with said first cover and covering a bottom surface of said circuit board.
Claim 11
Dependent Claim
15 words
An apparatus according to claim 1, wherein said first outer cover comprises a box shape.
Claim 12
Dependent Claim
15 words
An apparatus according to claim 9, wherein said second outer cover comprises a box shape.
Claim 13
Dependent Claim
15 words
An apparatus according to claim 1, wherein the first outer cover supports the heat sink.
Claim 14
Dependent Claim
23 words
An apparatus according to claim 1, wherein the first outer cover includes an opening with prongs which engage edges of the heat sink.
Claim 15
Dependent Claim
145 words
A power transistor module package, comprising: a circuit board having mounted thereon a power transistor module; a heat sink secured to said power transistor module; a first outer cover which engages a portion of said heat sink and a portion of said circuit board, said first outer cover enclosing said power transistor module; said power transistor module having at least two pins, a first surface facing said circuit board, and a second surface facing said heat sink; and a fastener having an engaging face on a pin side of the power transistor module and a shaft extending into the heat sink to squeeze the power transistor module from the pin side of the power transistor module against the heat sink; wherein a majority of heat dissipating surfaces of the heat sink are outside a space enclosed by the first outer cover and the circuit board.
Claim 16
Dependent Claim
145 words
A power transistor module package, comprising: a circuit board having mounted thereon a power transistor module; a heat sink secured to said power transistor module; a first outer cover which engages a portion of said heat sink and a portion of said circuit board, said first outer cover enclosing said power transistor module; said power transistor module having at least two pins, a first surface facing said circuit board, and a second surface facing said heat sink; and a fastener having an engaging face on a pin side of the power transistor module and a shaft extending into the heat sink to squeeze the power transistor module from the pin side of the power transistor module against the heat sink; wherein a majority of heat dissipating surfaces of the heat sink are outside a space enclosed by the first outer cover and the circuit board.
Claim 17
Dependent Claim
31 words
A package according to claim 14, wherein said first surface of said power transistor module faces a top surface of said circuit board having at least one other electrical component thereon.
Claim 18
Dependent Claim
15 words
A package according to claim 14, wherein said first outer cover supports said heat sink.
Claim 19
Dependent Claim
25 words
A package according to claim 14, further comprising a base plate disposed between said second surface of said power transistor module and said heat sink.
Claim 20
Dependent Claim
22 words
A package according to claim 14, wherein said heat sink comprises a plurality of fins substantially perpendicular to said first outer cover.
Claim 21
Dependent Claim
26 words
A package according to claim 15, further comprising a second outer cover engaged with said first cover and covering a bottom surface of said circuit board.
Claim 22
Dependent Claim
39 words
A package according to claim 14, wherein said at least two pins of said power transistor module extend substantially perpendicular to said first surface of said power transistor module and connect said power transistor module to said circuit board.
Claim 23
Dependent Claim
15 words
An apparatus according to claim 14, wherein the first outer cover supports the heat sink.
Claim 24
Dependent Claim
23 words
An apparatus according to claim 14, wherein the first outer cover includes an opening with prongs which engage edges of the heat sink.
References Cited (Backward Citations)
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US4621304A
Cited
JPH02170494A
Cited
US5339215A
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JPH06123449A
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-08-30 | 2003-03-01 | 2003-08-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-08-30 | 2007-03-01 | 2007-08-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-08-30 | 2011-03-01 | 2011-08-31 | $7700.00 | Window Closed / Lapsed |