US5925936A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device for face down bonding to a mounting substrate and a method of manufacturing the same
Assignee: Toshiba Corp
•
Filing: 1997-02-26
•
Granted: 1999-07-20
•
Expires: 2017-02-26
Abstract
Abstract Resin meltable at a time of reflowing is provided on the surface of a semiconductor chip and top ends of the connection electrodes are located parallel with the surface of the resin. A semiconductor chip is mounted on a mounting substrate and, upon reflowing, the resin is molten to allow the semiconductive chip to be bonded to the mounting substrate and encapsulate a resultant structure.
Inventors
- 👤 Yasuhiro Yamaji
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 21:54
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/30; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/111; H10W74/114; H10W74/15; H10W72/01; H10W72/013; H10W72/01331; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/07251; H10W72/073; H10W72/20; H10W72/251; H10W72/252; H10W72/851; H10W72/853; H10W72/856
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
64 words
A semiconductor device comprising: a semiconductor chip; bump electrodes provided on the semiconductor chip; and a protection film coated on a surface of the semiconductor chip, allowing a top surface of the bump electrodes to be exposed, and adapted to, when the semiconductor chip is to be mounted, be molten and bond the semiconductor chip to a mounting substrate and encapsulate a resultant structure.
Claim 2
Dependent Claim
64 words
A semiconductor device comprising: a semiconductor chip; bump electrodes provided on the semiconductor chip; and a protection film coated on a surface of the semiconductor chip, allowing a top surface of the bump electrodes to be exposed, and adapted to, when the semiconductor chip is to be mounted, be molten and bond the semiconductor chip to a mounting substrate and encapsulate a resultant structure.
Claim 3
Dependent Claim
16 words
A semiconductor device according to claim 1, wherein the protection film is formed of thermoplastic resin.
Claim 4
Dependent Claim
44 words
A semiconductor device according to claim 1, wherein the protection film is formed of thermoplastic resin whose glass transition temperature is equal to, or less than, a melting point of a soldering or brazing material for connection to a terminal of a mounting substrate.
Claim 5
Dependent Claim
44 words
A semiconductor device according to claim 1, wherein the protection film is formed of a two-layered structure, one layer being formed of thermosetting resin provided on the semiconductor chip and the other layer being formed of thermoplastic resin provided on the thermosetting resin layer.
Claim 6
Dependent Claim
76 words
A semiconductor device according to claim 1, wherein the protection film is formed of a two-layered structure, one layer being formed of thermosetting resin provided on the semiconductor chip and the other layer being formed of thermoplastic resin formed on the thermosetting resin layer, and the thermoplastic resin having a glass transition temperature equal to, or less than, a melting point of a soldering or brazing material for connection to a terminal of a mounting substrate.
Claim 7
Dependent Claim
19 words
A semiconductor device according to claim 1, wherein a rear surface of the semiconductor chip is coated with resin.
Claim 8
Dependent Claim
20 words
A semiconductor device according to claim 1, wherein rear and side surfaces of the semiconductor chip are coated with resin.
Claim 9
Dependent Claim
35 words
A semiconductor device according to claim 1, wherein a rear surface of the semiconductor chip is bonded to a metal plate with either one of a resin layer and soldering or brazing layer in between.
Claim 10
Dependent Claim
131 words
A package structure comprising: a mounting substrate; connection terminals provided on a surface of the mounting substrate; a soldering or brazing material provided on the connection terminals to allow terminal connection; a semiconductor chip whose surface is so located as to face the surface of the mounting substrate; bump electrodes provided on the surface of the semiconductor chip, the bump electrode being connected to the connection terminal by melting the soldering or brazing material for terminal connection; and a protection film covered on the facing surface of the semiconductor chip in a manner to expose top surfaces of the bump electrodes, the protection film being allowed to be molten, at a time of melting the soldering or brazing material, bond the semiconductor chip to the mounting substrate and encapsulate the chip.
Claim 11
Dependent Claim
131 words
A package structure comprising: a mounting substrate; connection terminals provided on a surface of the mounting substrate; a soldering or brazing material provided on the connection terminals to allow terminal connection; a semiconductor chip whose surface is so located as to face the surface of the mounting substrate; bump electrodes provided on the surface of the semiconductor chip, the bump electrode being connected to the connection terminal by melting the soldering or brazing material for terminal connection; and a protection film covered on the facing surface of the semiconductor chip in a manner to expose top surfaces of the bump electrodes, the protection film being allowed to be molten, at a time of melting the soldering or brazing material, bond the semiconductor chip to the mounting substrate and encapsulate the chip.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-07-19 | 2003-01-18 | 2003-07-20 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-07-19 | 2007-01-18 | 2007-07-20 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-07-19 | 2011-01-18 | 2011-07-20 | $7700.00 | Window Closed / Lapsed |