US5914525A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device
Assignee: Innotech Corp
•
Filing: 1998-06-12
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Granted: 1999-06-22
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Expires: 2018-06-12
Abstract
Abstract A semiconductor device is disclosed, comprising an integrated circuit formed on an upper surface of a semiconductor wafer chip and inductance formed on sides of the semiconductor wafer chip.
Inventors
- 👤 Minoru Yoshida
- 👤 Yasuhiko Nishikubo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 18:49
CPC Classifications
H; H01; H01F; H01F17/00; H01F17/0006; H01F17/0033
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
27 words
A semiconductor device comprising an integrated circuit formed on an upper surface of a semiconductor wafer chip and inductance formed on sides of the semiconductor wafer chip.
Claim 2
Dependent Claim
27 words
A semiconductor device comprising an integrated circuit formed on an upper surface of a semiconductor wafer chip and inductance formed on sides of the semiconductor wafer chip.
Claim 3
Dependent Claim
21 words
The semiconductor device according to claim 1, wherein the inductance is connected to the integrated circuit to configure a resonance circuit.
Claim 4
Dependent Claim
20 words
The semiconductor device according to claim 1, wherein the semiconductor wafer chip is in the form of a polygonal cylinder.
References Cited (Backward Citations)
US5157576A
Cited
JPH04186667A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-06-21 | 2002-12-21 | 2003-06-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-06-21 | 2006-12-21 | 2007-06-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-06-21 | 2010-12-21 | 2011-06-22 | $7700.00 | Window Closed / Lapsed |