US5898573A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Microelectronic packages and packaging methods including thermally and electrically conductive pad
Assignee: Ericsson Inc
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Filing: 1997-09-29
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Granted: 1999-04-27
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Expires: 2017-09-29
Abstract
Abstract A thermally and electrically conductive (TEC) pad is disposed between a PCB and a heat sink in a cellular telephone base station. The TEC pad includes at least one aperture that overlies one or more signal vias on a ground plane of the PCB. The TEC pad apertures are larger than any underlying signal vias in order to electrically isolate the signal vias from the conductive material of the pad and the heat sink. The TEC pad allows ground vias on a PCB ground plane to ground to the heat sink.
Inventors
- 👤 Anthony Salvatore Fugaro
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 15:04
CPC Classifications
H; H05; H05K; H05K7/00; H05K7/20; H05K7/2039; H05K7/20509; H05K1/00; H05K1/02; H05K1/0201; H05K1/0203; H05K1/0204; H05K1/0206; H05K3/00; H05K3/0058; H05K3/0061; H05K9/00; H05K9/0007; H05K9/002; H05K9/0039; H05K1/0213; H05K1/0215; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0364; H05K2201/0379; H05K2201/06; H05K2201/066; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09745; H05K2201/10; H05K2201/10431; H05K2201/10598; H05K3/40; H05K3/42
Claims Analysis
Total Claims: 19
Claim 1
Independent Claim
100 words
A microelectronic packaging apparatus comprising: a heat sink having a face; an electronic substrate comprising a plurality of microelectronic devices on a first face thereof and a first conductive via extending to an opposite second face; and an electrically conductive substrate disposed between said heat sink and said electronic substrate including a face abutting said heat sink face and an opposite face having a recessed portion therein abutting said electronic substrate second face, said recessed portion configured to overlie said first conductive via on said electronic substrate second face to electrically isolate said first conductive via from said heat sink.
Claim 2
Dependent Claim
100 words
A microelectronic packaging apparatus comprising: a heat sink having a face; an electronic substrate comprising a plurality of microelectronic devices on a first face thereof and a first conductive via extending to an opposite second face; and an electrically conductive substrate disposed between said heat sink and said electronic substrate including a face abutting said heat sink face and an opposite face having a recessed portion therein abutting said electronic substrate second face, said recessed portion configured to overlie said first conductive via on said electronic substrate second face to electrically isolate said first conductive via from said heat sink.
Claim 3
Dependent Claim
17 words
A microelectronic packaging apparatus according to claim 1 wherein said electrically conductive substrate comprises thermally conductive material.
Claim 4
Dependent Claim
39 words
A microelectronic packaging apparatus according to claim 1 wherein said electronic substrate includes a second conductive via extending to said electronic substrate second face, said second conductive via electrically connected to said heat sink by said electrically conductive substrate.
Claim 5
Dependent Claim
18 words
A microelectronic packaging apparatus according to claim 1 wherein said electronic substrate second face is a ground plane.
Claim 6
Dependent Claim
42 words
A microelectronic packaging apparatus according to claim 1 wherein said electronic substrate includes a third conductive via extending to said electronic substrate second face, said third conductive via being electrically isolated from said heat sink by said electrically conductive substrate recessed portion.
Claim 7
Dependent Claim
57 words
A microelectronic packaging apparatus according to claim 1 wherein said electronic substrate includes a plurality of conductive vias extending to said opposite second face and wherein said electrically conductive substrate includes a plurality of recessed portions each configured to overlie a respective one of said conductive vias to electrically isolate said conductive vias from said heat sink.
Claim 8
Dependent Claim
17 words
A microelectronic packaging apparatus according to claim 1 wherein said electronic substrate is a printed circuit board.
Claim 9
Dependent Claim
21 words
A microelectronic packaging apparatus according to claim 1 wherein said recessed portion is an aperture extending through said electrically conductive substrate.
Claim 10
Dependent Claim
111 words
A cellular telephone base station comprising: a heat sink having a face; a cellular telephone base station printed circuit board including a plurality of cellular base station microelectronic devices on a first face thereof and a first conductive via extending to an opposite ground plane face; and a thermally and electrically conductive substrate disposed between said heat sink and said printed circuit board including a face abutting said heat sink face and an opposite face abutting said ground plane face, said thermally and electrically conductive substrate including an aperture therethrough overlying said first conductive via on said ground plane face to electrically isolate said first conductive via from said heat sink.
Claim 11
Dependent Claim
111 words
A cellular telephone base station comprising: a heat sink having a face; a cellular telephone base station printed circuit board including a plurality of cellular base station microelectronic devices on a first face thereof and a first conductive via extending to an opposite ground plane face; and a thermally and electrically conductive substrate disposed between said heat sink and said printed circuit board including a face abutting said heat sink face and an opposite face abutting said ground plane face, said thermally and electrically conductive substrate including an aperture therethrough overlying said first conductive via on said ground plane face to electrically isolate said first conductive via from said heat sink.
Claim 12
Dependent Claim
42 words
A cellular telephone base station according to claim 9 wherein said printed circuit board includes a second conductive via extending to said ground plane face, said second conductive via electrically connected to said heat sink by said thermally and electrically conductive substrate.
Claim 13
Dependent Claim
44 words
A cellular telephone base station according to claim 9 wherein said printed circuit board includes a third conductive via extending to said ground plane face, said third conductive via being electrically isolated from said heat sink by said thermally and electrically conductive substrate aperture.
Claim 14
Dependent Claim
61 words
A cellular telephone base station according to claim 9 wherein said printed circuit board includes a plurality of conductive vias extending to said ground plane face and wherein said thermally and electrically conductive substrate includes a plurality of apertures, each aperture configured to overlie a respective one of said conductive vias to electrically isolate said conductive vias from said heat sink.
Claim 15
Independent Claim
128 words
A method of fabricating a cellular telephone base station comprising the steps of: providing a heat sink having a face; providing a cellular telephone base station printed circuit board including a plurality of cellular base station microelectronic devices on a first face thereof and first and second conductive vias extending to an opposite ground plane face; providing a thermally and electrically conductive substrate with an aperture configured to overlie said first conductive via on said printed circuit board ground plane face; and securing said printed circuit board to said heat sink face with said thermally and electrically conductive substrate disposed therebetween to electrically isolate said first conductive via from said heat sink and to electrically connect said ground plane face and second conductive via to said heat sink.
Claim 16
Independent Claim
128 words
A method of fabricating a cellular telephone base station comprising the steps of: providing a heat sink having a face; providing a cellular telephone base station printed circuit board including a plurality of cellular base station microelectronic devices on a first face thereof and first and second conductive vias extending to an opposite ground plane face; providing a thermally and electrically conductive substrate with an aperture configured to overlie said first conductive via on said printed circuit board ground plane face; and securing said printed circuit board to said heat sink face with said thermally and electrically conductive substrate disposed therebetween to electrically isolate said first conductive via from said heat sink and to electrically connect said ground plane face and second conductive via to said heat sink.
Claim 17
Dependent Claim
30 words
A method according to claim 13 wherein said step of providing a printed circuit board comprises the step of providing a third conductive via extending to said ground plane face.
Claim 18
Dependent Claim
59 words
A method according to claim 14 wherein said step of providing a thermally and electrically conductive substrate comprises providing an aperture configured to overlie said first and third conductive vias on said ground plane face to electrically isolate said first and third conductive vias from said heat sink when said printed circuit board is secured to said heat sink.
Claim 19
Dependent Claim
80 words
A method according to claim 13 wherein said step of providing a printed circuit board comprises providing a plurality of conductive vias extending to said ground plane face, and wherein said step of providing a thermally and electrically conductive substrate comprises providing a plurality of apertures therein, each aperture configured to overlie a respective one of said conductive vias to electrically isolate said conductive vias from said heat sink when said printed circuit board is secured to said heat sink.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-04-26 | 2002-10-26 | 2003-04-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-04-26 | 2006-10-26 | 2007-04-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-04-26 | 2010-10-26 | 2011-04-27 | $7700.00 | Window Closed / Lapsed |