US5886896A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method and apparatus for integrated control of a sensor in a manufacturing processing station
Assignee: Advanced Micro Devices Inc
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Filing: 1996-11-19
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Granted: 1999-03-23
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Expires: 2016-11-19
Abstract
Abstract A method and apparatus for manufacturing products is provided with a computer that controls a processing tool, and a sensor that senses an operating condition of the processing tool. The sensor is coupled to the computer so that the setup and operation of the sensor is controlled by the computer. The control of the sensor and the processing tool by the computer is performed according to a single recipe, thereby providing automatic setup of the sensor in addition to the processing tool. Information from the sensor gathered during the processing step is integrated into the database coupled to the computer to provide correlation between the sensor data and lot and entity records related to the products being manufactured by the processing tool.
Inventors
- 👤 Mikkel Lantz
- 👤 John T. Shea
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-01 12:26
CPC Classifications
G; G06; G06Q; G06Q10/00; G06Q10/06; G05; G05B; G05B2219/00; G05B2219/30; G05B2219/31; G05B2219/31432; G05B2219/32; G05B2219/32187; G05B2219/45; G05B2219/45031; Y; Y02; Y02P; Y02P90/00; Y02P90/02
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
175 words
An arrangement for manufacturing semiconductor devices, comprising: a processing tool for performing at least one manufacturing process step on the semiconductor devices; a sensor which senses a condition of the manufacturing process step; a computer that controls the manufacturing process of the processing tool according to a set of process instructions; and a memory that stores and associates identification data, which identifies the semiconductor devices on which the manufacturing process step is performed by the processing tool, with sensor data sensed by the sensor during the manufacturing processing step performed on the semiconductor devices; wherein the computer further includes a manufacturing execution system that sends control signals to the processing tool to control the processing tool, an equipment interface and a recipe management system communicatively coupled to each other and to the manufacturing execution system, the equipment interface including means for retrieving from the recipe management system a recipe for performing the manufacturing process step, and means for generating the set of process instructions in accordance with the recipe retrieved from the recipe management system.
Claim 2
Dependent Claim
175 words
An arrangement for manufacturing semiconductor devices, comprising: a processing tool for performing at least one manufacturing process step on the semiconductor devices; a sensor which senses a condition of the manufacturing process step; a computer that controls the manufacturing process of the processing tool according to a set of process instructions; and a memory that stores and associates identification data, which identifies the semiconductor devices on which the manufacturing process step is performed by the processing tool, with sensor data sensed by the sensor during the manufacturing processing step performed on the semiconductor devices; wherein the computer further includes a manufacturing execution system that sends control signals to the processing tool to control the processing tool, an equipment interface and a recipe management system communicatively coupled to each other and to the manufacturing execution system, the equipment interface including means for retrieving from the recipe management system a recipe for performing the manufacturing process step, and means for generating the set of process instructions in accordance with the recipe retrieved from the recipe management system.
Claim 3
Dependent Claim
24 words
The arrangement of claim 1, further comprising a sensor controller coupled to the sensor to control the sensor in accordance with sensor control instructions.
Claim 4
Dependent Claim
38 words
The arrangement of claim 2, wherein the equipment interface includes a first communications logic server that communicates with the sensor controller and provides the sensor control instructions in accordance with the recipe retrieved from the recipe management system.
Claim 5
Dependent Claim
30 words
The arrangement of claim 3, wherein the equipment interface includes a second communications logic server that communicates with the processing tool to provide the processing tool with the process instructions.
Claim 6
Independent Claim
111 words
A method of manufacturing a product using a processing tool, comprising the steps of: storing in a memory identification information that identifies products to be processed by the processing tool; operating the processing tool to perform a manufacturing process step on the products; sensing a manufacturing process condition during the manufacturing process step; storing the sensed manufacturing process condition in the same memory as the identification information such that the sensed manufacturing process condition is correlated to the identification information retrieving a single recipe that is a function of the identification information; setting up the sensor to operate in accordance with the recipe; and sending the recipe to the processing tool.
Claim 7
Independent Claim
111 words
A method of manufacturing a product using a processing tool, comprising the steps of: storing in a memory identification information that identifies products to be processed by the processing tool; operating the processing tool to perform a manufacturing process step on the products; sensing a manufacturing process condition during the manufacturing process step; storing the sensed manufacturing process condition in the same memory as the identification information such that the sensed manufacturing process condition is correlated to the identification information retrieving a single recipe that is a function of the identification information; setting up the sensor to operate in accordance with the recipe; and sending the recipe to the processing tool.
Claim 8
Dependent Claim
36 words
The method of claim 5, further comprising analyzing the sensed manufacturing process condition during operation of the processing tool and controlling the operation of the processing tool as a function of the sensed manufacturing process condition.
Claim 9
Dependent Claim
11 words
The method of claim 6, wherein the products are semiconductor wafers.
Claim 10
Dependent Claim
111 words
An arrangement for manufacturing semiconductor devices, comprising: a processing tool for performing at least one manufacturing process step on the semiconductor devices; a particle sensor which senses a condition of the manufacturing process step; a computer that controls the manufacturing process of the processing tool according to a set of process instructions, said computer including means for controlling the processing tool as a function of the sensor data; and a memory that stores and associates identification data, which identifies the semiconductor devices on which the manufacturing process step is performed by the processing tool, with sensor data sensed by the sensor during the manufacturing processing step performed on the semiconductor devices.
Claim 11
Dependent Claim
111 words
An arrangement for manufacturing semiconductor devices, comprising: a processing tool for performing at least one manufacturing process step on the semiconductor devices; a particle sensor which senses a condition of the manufacturing process step; a computer that controls the manufacturing process of the processing tool according to a set of process instructions, said computer including means for controlling the processing tool as a function of the sensor data; and a memory that stores and associates identification data, which identifies the semiconductor devices on which the manufacturing process step is performed by the processing tool, with sensor data sensed by the sensor during the manufacturing processing step performed on the semiconductor devices.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-03-22 | 2002-09-21 | 2003-03-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-03-22 | 2006-09-21 | 2007-03-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-03-22 | 2010-09-21 | 2011-03-23 | $7700.00 | Window Closed / Lapsed |