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US5882433A Expired / Lapsed US ⏱️ 0.0 years remaining

Spin cleaning method

Assignee: Tokyo Electron Ltd
•
Filing: 1996-05-21
•
Granted: 1999-03-16
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Expires: 2016-05-21
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Abstract

Abstract At first, a semiconductor wafer is held and rotated by a spin chuck, and supplied with a hydrofluoric acid solution from a chemical liquid nozzle to remove natural oxide films on the wafer. Then, the wafer is supplied with pure water for rinsing it from a rinsing nozzle while the wafer is rotated. Right before the pure water stops being supplied, the wafer is supplied with an IPA liquid from a replacing medium nozzle while the wafer is rotated. The pure water is replaced with the IPA liquid by means of the Marangoni effect and a centrifugal force. Then, the wafer is rotated at 300 rpm for one second, at 3000 rpm for four seconds, and at 5000 rpm for five seconds, in this order, to remove the IPA liquid by means of a centrifugal force.

Inventors

  • 👤 Kinya Ueno

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-10-31 09:01
CPC Classifications
H; H10; H10P; H10P52/00; H10P72/00; H10P72/04; H10P72/0402; H10P72/0406; B; B08; B08B; B08B3/00; B08B3/02

Claims Analysis

Total Claims: 25
Claim 1
Independent Claim 199 words
A spin cleaning method comprising: an attaching step of attaching a target substrate having a surface to a rotatable spin chuck having a plurality of first clamp fingers to engage with a side of the substrate and fix the substrate; a chemical liquid treatment step of supplying a chemical liquid onto the surface of the substrate while rotating the substrate, after the attaching step; a rinsing step of supplying a rinsing liquid onto the surface of the substrate while rotating the substrate, after the chemical liquid treatment step; a replacing step of supplying a replacing medium liquid onto a substantial center of the surface of the substrate from above, and replacing the rinsing liquid with the replacing medium liquid on the surface of the substrate, the replacing medium liquid being mixable with the rinsing liquid and having a degree of surface tension lower than that of the rinsing liquid, supply of the replacing medium liquid being started before supply of the rinsing liquid is stopped, the substrate being rotated during the replacing step; and a removing step of removing the replacing liquid on the surface of the substrate by a centrifugal force which is generated by rotating the substrate.
Claim 2
Dependent Claim 199 words
A spin cleaning method comprising: an attaching step of attaching a target substrate having a surface to a rotatable spin chuck having a plurality of first clamp fingers to engage with a side of the substrate and fix the substrate; a chemical liquid treatment step of supplying a chemical liquid onto the surface of the substrate while rotating the substrate, after the attaching step; a rinsing step of supplying a rinsing liquid onto the surface of the substrate while rotating the substrate, after the chemical liquid treatment step; a replacing step of supplying a replacing medium liquid onto a substantial center of the surface of the substrate from above, and replacing the rinsing liquid with the replacing medium liquid on the surface of the substrate, the replacing medium liquid being mixable with the rinsing liquid and having a degree of surface tension lower than that of the rinsing liquid, supply of the replacing medium liquid being started before supply of the rinsing liquid is stopped, the substrate being rotated during the replacing step; and a removing step of removing the replacing liquid on the surface of the substrate by a centrifugal force which is generated by rotating the substrate.
Claim 3
Dependent Claim 34 words
The spin cleaning method according to claim 1, further comprising a chemical liquid treatment step of supplying a chemical liquid onto the surface of the substrate while rotating the substrate, before the rinsing step.
Claim 4
Dependent Claim 26 words
The spin cleaning method according to claim 1, wherein the replacing medium liquid has a vapor pressure of 10 mmHg to 200 mmHg at 20° C.
Claim 5
Dependent Claim 24 words
The spin cleaning method according to claim 1, wherein supply of the replacing liquid is started before supply of the rinsing liquid is stopped.
Claim 6
Dependent Claim 17 words
The spin cleaning method according to claim 1, wherein the substrate is rotated during the replacing step.
Claim 7
Dependent Claim 39 words
The spin cleaning method according to claim 1, wherein the substrate is held and rotated by a spin chuck, which has a plurality of first clamp fingers to engage with a side of the substrate and fix the substrate.
Claim 8
Dependent Claim 40 words
The spin cleaning method according to claim 6, wherein the substrate is rotated first at a first rotation speed of 1000 rpm or less and then at a second rotation speed of 2000 rpm or more in the removing step.
Claim 9
Dependent Claim 52 words
The spin cleaning method according to claim 7, wherein the spin chuck has a plurality of second clamp fingers to engage with a side of the substrate and fix the substrate, the substrate being fixed first by the first clamp fingers and then by the second clamp fingers in the removing step.
Claim 10
Dependent Claim 34 words
The spin cleaning method according to claim 1, wherein the replacing medium liquid is supplied onto the surface of the substrate from a supply port having an inner diameter of 4 mm or more.
Claim 11
Dependent Claim 24 words
The spin cleaning method according to claim 1, wherein the replacing medium liquid is supplied at a flow speed of 80 cm/sec or less.
Claim 12
Dependent Claim 24 words
The spin cleaning method according to claim 1, wherein N 2 gas is sprayed onto the surface of the substrate in the removing step.
Claim 13
Dependent Claim 255 words
A spin cleaning method comprising: an attaching step of attaching a target substrate having a surface to a rotatable spin chuck having a plurality of first clamp fingers to engage with a side of the substrate and fix the substrate; a chemical liquid treatment step of supplying a chemical liquid onto the surface of the substrate while rotating the substrate, after the attaching step; a rinsing step of supplying a rinsing liquid onto the surface of the substrate while rotating the substrate, after the chemical liquid treatment step; a replacing step of supplying a replacing medium vapor onto a substantial center of the surface of the substrate from above and under such conditions as to substantially maintain the replacing medium vapor in a vapor state, and replacing the rinsing liquid with the replacing medium vapor on the surface of the substrate, the replacing medium vapor being mixable with the rinsing liquid and having a degree of surface tension lower than that of the rinsing liquid, supply of the replacing medium vapor being started before supply of the rinsing liquid is stopped and while the substrate is being rotated, the substrate being rotated during the replacing step, the replacing medium vapor being supplied from a supply port which is moved above the substrate and scans the substrate radially outward from the substantial center of the surface in the replacing step; and a removing step of removing the replacing liquid on the surface of the substrate by a centrifugal force which is generated by rotating the substrate.
Claim 14
Dependent Claim 255 words
A spin cleaning method comprising: an attaching step of attaching a target substrate having a surface to a rotatable spin chuck having a plurality of first clamp fingers to engage with a side of the substrate and fix the substrate; a chemical liquid treatment step of supplying a chemical liquid onto the surface of the substrate while rotating the substrate, after the attaching step; a rinsing step of supplying a rinsing liquid onto the surface of the substrate while rotating the substrate, after the chemical liquid treatment step; a replacing step of supplying a replacing medium vapor onto a substantial center of the surface of the substrate from above and under such conditions as to substantially maintain the replacing medium vapor in a vapor state, and replacing the rinsing liquid with the replacing medium vapor on the surface of the substrate, the replacing medium vapor being mixable with the rinsing liquid and having a degree of surface tension lower than that of the rinsing liquid, supply of the replacing medium vapor being started before supply of the rinsing liquid is stopped and while the substrate is being rotated, the substrate being rotated during the replacing step, the replacing medium vapor being supplied from a supply port which is moved above the substrate and scans the substrate radially outward from the substantial center of the surface in the replacing step; and a removing step of removing the replacing liquid on the surface of the substrate by a centrifugal force which is generated by rotating the substrate.
Claim 15
Dependent Claim 34 words
The spin cleaning method according to claim 12, further comprising a chemical liquid treatment step of supplying a chemical liquid onto the surface of the substrate while rotating the substrate, before the rinsing step.
Claim 16
Dependent Claim 26 words
The spin cleaning method according to claim 12, wherein the replacing medium vapor has a vapor pressure of 10 mmHg to 200 mmHg at 20° C.
Claim 17
Dependent Claim 24 words
The spin cleaning method according to. claim 12, wherein supply of the replacing liquid is started before supply of the rinsing liquid is stopped.
Claim 18
Dependent Claim 17 words
The spin cleaning method according to claim 12, wherein the substrate is rotated during the replacing step.
Claim 19
Dependent Claim 39 words
The spin cleaning method according to claim 12, wherein the substrate is held and rotated by a spin chuck, which has a plurality of first clamp fingers to engage with a side of the substrate and fix the substrate.
Claim 20
Dependent Claim 40 words
The spin cleaning method according to claim 17, wherein the substrate is rotated first at a first rotation speed of 1000 rpm or less and then at a second rotation speed of 2000 rpm or more in the removing step.
Claim 21
Dependent Claim 52 words
The spin cleaning method according to claim 18, wherein the spin chuck has a plurality of second clamp fingers to engage with a side of the substrate and fix the substrate, the substrate being fixed first by the first clamp fingers and then by the second clamp fingers in the removing step.
Claim 22
Dependent Claim 33 words
The spin cleaning method according to claim 12, wherein the replacing medium vapor is supplied from a supply port which is moved above the substrate and scan the substrate in the replacing step.
Claim 23
Dependent Claim 71 words
The spin cleaning method according to claim 12, wherein the rinsing liquid and replacing medium vapor are supplied from supply ports which are substantially simultaneously moved above the substrate and scan the substrate in the replacing step, while the supply port of the rinsing liquid goes ahead of the supply port of the replacing medium vapor, so that the rinsing and replacing steps are performed substantially in parallel with each other.
Claim 24
Dependent Claim 39 words
The spin cleaning method according to claim 12, wherein the replacing medium is diffused along a rectifying plate, which is placed to face the substrate substantially all over the substrate with a small gap therebetween, during the replacing step.
Claim 25
Dependent Claim 24 words
The spin cleaning method according to claim 12, wherein N 2 gas is sprayed onto the surface of the substrate in the removing step.

References Cited (Backward Citations)

JPS62188323A Cited
JPH05243205A Cited
US5271774A Cited
JPH06275596A Cited
US5660642A Cited
US5715612A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2002-03-15 2002-09-14 2003-03-16 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2006-03-15 2006-09-14 2007-03-16 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2010-03-15 2010-09-14 2011-03-16 $7700.00 Window Closed / Lapsed

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