Abstract A method of determining classification codes for defects occurring in semiconductor manufacturing processes and for storing the information used to determine the classification codes. A wafer is selected from a production lot after the lot is sent through a first manufacturing process. The selected wafer is scanned to determine if there are defects on the wafer. Images of selected defects are examined and a numerical value is assigned to each of N elemental descriptor terms describing each defect. A classification code is determined for each defect based upon the numerical values assigned to the N elemental descriptor terms. The classification code and numerical values assigned to the N elemental descriptor terms are stored in a database. The wafer is sent through each sequential process and classification codes are assigned to additional defects selected after each sequential process. The classification codes and numerical values assigned to the N elemental descriptor terms for the additional selected defects are stored in the database.
A method of determining classification codes for defects occurring in semiconductor manufacturing processes and for storing the information used to determine the classification codes, the method comprising: sending a production lot of wafers through a first manufacturing process; scanning a selected wafer from the production lot to determine if there are defects present on the selected wafer; selecting defects to review; examining an image of each selected defect; assigning a numerical value to each of N elemental descriptor terms describing each defect; determining a classification code for each defect based upon the numerical values assigned to the N elemental descriptor terms; and storing the classification code and each of the numerical values assigned to the N elemental descriptor terms in a database.
Claim 2
Independent Claim
122 words
A method of determining classification codes for defects occurring in semiconductor manufacturing processes and for storing the information used to determine the classification codes, the method comprising: sending a production lot of wafers through a first manufacturing process; scanning a selected wafer from the production lot to determine if there are defects present on the selected wafer; selecting defects to review; examining an image of each selected defect; assigning a numerical value to each of N elemental descriptor terms describing each defect; determining a classification code for each defect based upon the numerical values assigned to the N elemental descriptor terms; and storing the classification code and each of the numerical values assigned to the N elemental descriptor terms in a database.
Claim 3
Dependent Claim
107 words
The method of claim 1, further comprising: sending the production lot of wafers through a next manufacturing process; scanning the selected wafer to determine if there are additional defects present on the selected wafer; selecting additional defects to review; examining an image of each selected additional defect; assigning a numerical value to each of the N elemental descriptor terms describing each defect; determining a classification code for each additional defect based upon the numerical values assigned to the N elemental descriptor terms; and storing the classification code and each of the numerical values assigned to the N elemental descriptor terms for each additional defect in the database.
Claim 4
Dependent Claim
60 words
The method of claim 2, further comprising: retrieving the stored classification code and each of the numerical values assigned to the N elemental descriptor terms in the database; changing the classification code for selected defects; and storing the changed classification code for selected defects and each of the numerical values assigned to the N elemental descriptor terms in the database.