Implantable medical device microstrip telemetry antenna

Claim 2

A telemetry system for communications between an external programmer and an implantable medical device, comprising: the external programmer comprising an external telemetry antenna and an external transceiver for receiving uplink telemetry transmissions and transmitting downlink telemetry transmission through the external telemetry antenna; the implantable medical device comprising an implantable medical device housing, an implantable telemetry antenna and an implantable transceiver for receiving downlink transmissions and for transmitting uplink telemetry transmission through the implantable telemetry antenna, the implantable medical device housing being formed of a conductive metal and having an exterior housing surface and an interior housing surface; the implantable medical device housing being formed with a housing recess extending inwardly from the exterior housing surface to a predetermined housing recess depth in the predetermined substrate area of the exterior housing surface for receiving the dielectric substrate therein; wherein the implantable telemetry antenna is a conformal microstrip antenna formed as part of the implantable medical device housing, the microstrip antenna having electrically conductive ground plane and radiator patch layers separated by a dielectric substrate, layer the conductive radiator patch layer having a predetermined thickness and predetermined radiator patch layer dimensions, the patch layer being formed upon one side of the dielectric substrate layer.

Claim 3

A telemetry system for communication between an external programmer and an implantable medical device, wherein: the external programmer comprises an external telemetry antenna and an external transceiver from receiving uplink telemetry transmissions and transmitting downlink telemetry transmissions through the external telemetry antenna; the implantable medical device comprises an implantable medical device housing, an implantable telemetry antenna and an implantable transceiver for receiving downlink telemetry transmissions and for transmitting uplink telemetry transmission through the implantable telemetry antenna, the implantable medical device housing being formed of a conductive metal and having an exterior housing surface and an interior housing surface, the implantable medical device housing further being formed with a housing recess extending inwardly from the exterior housing surface to a predetermined housing recess depth in the predetermined substrate area of the exterior housing surface for receiving the dielectric substrate therein, the implantable medical device housing being formed as a conductive metal layer adhering to the interior housing surface; the implantable telemetry antenna is a conformal microstrip antenna formed as part of the implantable medical device housing, the microstrip antenna having electrically conductive ground plane and radiator patch layers separated by a dielectric substrate layer the conductive radiator patch layer having a predetermined thickness and predetermined radiator patch layer dimensions, the patch layer being formed upon one side of the dielectric substrate layer; the conductive ground plane layer is at least a portion of the conductive metal housing and has predetermined ground plane dimensions such that the conductive ground plane layer extends substantially in parallel to and at least coextensively with the conductive radiator patch layer, and the dielectric substrate is formed over a predetermined substrate area of the exterior housing surface, the dielectric substrate having an exposed exterior substrate surface, and the conductive radiator patch is formed over at least a portion of the extension substrate surface.

Claim 4

A telemetry system for communication between an external programmer and an implantable medical device, wherein: the external programmer comprises an external telemetry antenna and an external transceiver from receiving uplink telemetry transmissions and transmitting downlink telemetry transmissions through the external telemetry antenna; the implantable medical device comprises an implantable medical device housing, an implantable telemetry antenna and an implantable transceiver for receiving downlink telemetry transmissions and for transmitting uplink telemetry transmission through the implantable telemetry antenna, the implantable medical device housing being formed of a conductive metal and having an exterior housing surface and an interior housing surface, the implantable medical device housing further being formed with a housing recess extending inwardly from the exterior housing surface to a predetermined housing recess depth in the predetermined substrate area of the exterior housing surface for receiving the dielectric substrate therein, the implantable medical device housing being formed as a conductive metal layer adhering to the interior housing surface; the implantable telemetry antenna is a conformal microstrip antenna formed as part of the implantable medical device housing, the microstrip antenna having electrically conductive ground plane and radiator patch layers separated by a dielectric substrate layer the conductive radiator patch layer having a predetermined thickness and predetermined radiator patch layer dimensions, the patch layer being formed upon one side of the dielectric substrate layer; the conductive ground plane layer is at least a portion of the conductive metal housing and has predetermined ground plane dimensions such that the conductive ground plane layer extends substantially in parallel to and at least coextensively with the conductive radiator patch layer, and the dielectric substrate is formed over a predetermined substrate area of the exterior housing surface, the dielectric substrate having an exposed exterior substrate surface, and the conductive radiator patch is formed over at least a portion of the extension substrate surface.

Claim 5

The telemetry system of claim 1 further comprising a diadem layer of dielectric material formed over the conductive radiator patch layer.

Claim 6

The telemetry system of claim 1, wherein the implantable medical device housing is formed of a non-conductive dielectric substrate layer having an exterior housing surface and an interior housing surface; the conductive ground plane layer is formed as a conductive metal layer adhering to the interior housing surface; and the conductive radiator patch layer is formed between the exterior and interior housing surfaces to extend parallel to the ground plane layer and to be separated therefrom by an intermediate dielectric substrate layer of the medical device housing.

Claim 7

The telemetry system of any of preceding claims 1, 2 or 4, wherein the transceiver is disposed within the implantable medical device housing and further comprises feedthrough means extending through the conductive ground plane layer and the dielectric substrate layer to the radiator patch layer for electrically connecting the implantable transceiver within the implantable medical device housing with the radiator patch layer.

Claim 8

The telemetry system of any of preceding claims 1, 2 or 4 further comprising means for forming a ground plane layer extension in the same plane as, and surrounding the periphery of, the patch radiator layer.

Claim 9

An implantable medical device, comprising: an implantable telemetry antenna; an implantable medical device housing; and a transceiver coupled to the implantable telemetry antenna for communications between an external medical device and the implantable medical device, wherein the implantable telemetry antenna is conformal microstrip antenna formed as part of the implantable medical device housing, the microstrip antenna having electrically conductive ground plane and radiator patch layers separated by a dielectric substrate layer, the implantable medical device housing is formed of a non-conductive dielectric substrate layer having an exterior housing surface and an interior housing surface; the conductive ground plane layer is formed as a conductive metal layer adhering to the interior housing surface, and the conductive radiator patch layer is formed over at least a portion of the exterior housing surface.

Claim 10

An implantable medical device, comprising: an implantable telemetry antenna; an implantable medical device housing; and a transceiver coupled to the implantable telemetry antenna for communications between an external medical device and the implantable medical device, wherein the implantable telemetry antenna is conformal microstrip antenna formed as part of the implantable medical device housing, the microstrip antenna having electrically conductive ground plane and radiator patch layers separated by a dielectric substrate layer, the implantable medical device housing is formed of a non-conductive dielectric substrate layer having an exterior housing surface and an interior housing surface; the conductive ground plane layer is formed as a conductive metal layer adhering to the interior housing surface, and the conductive radiator patch layer is formed over at least a portion of the exterior housing surface.

Claim 11

The telemetry antenna of claim 7, wherein the conductive radiator patch layer has predetermined radiator patch layer dimensions and is formed upon one side of the dielectric substrate layer, the implantable medical device housing is formed of a conductive metal and has an exterior housing surface and an interior housing surface; the conductive ground plane layer is at least a portion of the conductive metal housing and has predetermined ground plane dimensions such that the conductive ground plane layer extends substantially in parallel to and at least coextensively with the conductive radiator patch layer; the dielectric substrate is formed over a predetermined substrate area of the exterior housing surface, the dielectric substrate having an exposed exterior substrate surface; the conductive radiator patch layer is formed over at least a portion of the exterior substrate surface, and the implantable medical device housing is formed with a housing recess extending inwardly from the exterior housing surface to a predetermined housing recess depth in the predetermined substrate area of the exterior housing surface for receiving the dielectric substrate therein.

Claim 12

The telemetry antenna of any of preceding claims 7 or 8, further comprising a radome layer of dielectric material formed over the conductive radiator patch layer.

Claim 13

The telemetry antenna of claim 7, wherein the implantable medical device housing is formed of a non-conductive dielectric substrate layer having an exterior housing surface and an interior housing surface; the conductive ground plane layer is formed as a conductive metal layer adhering to the interior housing surface; and the conductive radiator patch layer is formed between the exterior and interior housing surfaces to extend parallel to the ground plane layer and to be separated therefrom by an intermediate dielectric substrate layer of the medical device housing.

Claim 14

The telemetry antenna of any of preceding claims 7, 8 or 10, wherein the transceiver is disposed within the implantable medical device housing and further comprises feedthrough means extending through the conductive ground plane layer and the dielectric substrate layer to the radiator patch layer for electrically connecting the implantable transceiver within the implantable medical device housing with the radiator patch layer.

Claim 15

The telemetry antenna of any of preceding claims 7, 8 or 10 further comprising the step of forming a ground plane layer extension in the same plane as, and surrounding the periphery of, the patch radiator layer.

Claim 18

The method of claim 13, wherein the microstrip antenna forming step further comprises forming the dielectric substrate layer with a predetermined substrate layer thickness and an interior substrate surface and an exterior substrate surface; and forming the electrically conductive radiator patch layer on the exterior substrate surface to have predetermined radiator patch layer dimensions.

Claim 19

The method of claim 14, further comprising the step of forming the conductive ground plane layer on the interior substrate surface to have predetermined ground plane dimensions such that the conductive ground plane layer extends substantially in parallel to and at least coextensively with the conductive radiator patch layer.

Claim 20

The method of claim 13, wherein the step of forming an implantable medical device housing further comprises forming the implantable medical device housing of a conductive metal such that the conductive ground plane layer is at least a portion of the conductive metal housing; and the step of forming the microstrip antenna further comprises the steps of: forming the dielectric substrate layer on at least a portion of the exterior housing surface to have a predetermined substrate layer thickness and an interior substrate surface and an exterior substrate surface; and forming the electrically conductive radiator patch layer on at least a portion of the exterior substrate surface.

Claim 21

The method of claim 13, wherein the step of forming an implantable medical device housing further comprises the steps of: forming the implantable medical device housing of a conductive metal such that the conductive ground plane layer is at least a portion of the conductive metal housing; and forming a housing recess extending inwardly from the exterior housing surface to a predetermined housing recess depth in a predetermined substrate area of the exterior housing surface; and the step of forming the microstrip antenna further comprises the steps of: forming the dielectric substrate layer within the housing recess to have a relatively constant thickness and interior and exterior substrate surfaces; and forming the conductive radiator patch layer on at least a portion of the exterior substrate surface.

Claim 22

The method of claim 13, wherein the step of forming an implantable medical device housing comprises forming the implantable medical device housing of a non-conductive dielectric material; and the step of forming the microstrip antenna further comprises the steps of: forming the conductive radiator patch layer on the exterior housing surface to have predetermined radiator patch layer dimensions and an exposed radiator patch layer surface; and forming the conductive ground plane layer as a conductive metal layer adhering to the interior housing surface, wherein the implantable medical device housing functions as the dielectric substrate layer with a relatively constant thickness.

Claim 24

The method of claim 13, wherein the step of forming an implantable medical device housing comprises forming the implantable medical device housing of a non-conductive dielectric material; and the step of forming the microstrip antenna further comprises the steps of: forming the electrically conductive radiator patch layer between the exterior and interior housing surfaces; and forming the conductive ground plane layer as a conductive metal layer adhering to the interior housing surface such that an intermediate dielectric substrate layer of the implantable medical device housing functions as the dielectric substrate layer.