US5859473A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Duplexer package
Assignee: Taiyo Yuden Co Ltd
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Filing: 1997-03-06
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Granted: 1999-01-12
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Expires: 2017-03-06
Abstract
Abstract A duplexer package comprises two surface acoustic wave filter chips having different band center frequencies and a phase matching circuit for matching the phases of the two SAW filter chips, the filter chips and the phase matching circuit being accommodated in one unit, wherein the phase matching circuit is formed in a layer providing a cavity for the filter chips, the layer defining the cavity being located above a face for mounting the surface acoustic wave filter chips. According to the present invention, the height of the duplexer package can be lowered.
Inventors
- 👤 Osamu Ikata
- 👤 Yoshio Satoh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 04:07
CPC Classifications
H; H03; H03H; H03H9/00; H03H9/70; H03H9/72; H03H9/725; H03H9/46; H03H9/64; H03H9/02; H03H9/05; H03H9/0538; H03H9/0566; H03H9/0576; H10; H10W; H10W72/00; H10W72/851; H10W72/874; H10W72/884; H10W90/00; H10W90/701; H10W90/731; H10W90/734; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
83 words
A duplexer package comprising two surface acoustic wave filter chips having different center pass band frequencies and a phase matching circuit for matching the phases of the two surface acoustic wave filter chips, the filter chips and the phase matching circuit being accommodated in one unit, wherein the phase matching circuit is formed in a layer providing a cavity for the surface acoustic wave filter chips, the layer defining the cavity being located above a face for mounting the surface acoustic filter chips.
Claim 2
Dependent Claim
83 words
A duplexer package comprising two surface acoustic wave filter chips having different center pass band frequencies and a phase matching circuit for matching the phases of the two surface acoustic wave filter chips, the filter chips and the phase matching circuit being accommodated in one unit, wherein the phase matching circuit is formed in a layer providing a cavity for the surface acoustic wave filter chips, the layer defining the cavity being located above a face for mounting the surface acoustic filter chips.
Claim 3
Dependent Claim
60 words
A duplexer package according to claim 1 wherein the layer providing the cavity includes a bonding terminal layer, a ground layer disposed under the bonding terminal layer, the ground layer including separate patterns for the individual surface acoustic wave filter chips, and a matching layer disposed under the ground layer, the phase matching circuit being formed on the matching layer.
Claim 4
Dependent Claim
24 words
A duplexer package according to claim 1 or 2 wherein a common ground layer is formed on the face for mounting the filter chips.
Claim 5
Dependent Claim
30 words
A duplexer package according to claim 1 or 2 wherein a common ground layer is formed under the face for mounting the filter chips with an insulating layer in between.
Claim 6
Dependent Claim
38 words
A duplexer package according to claim 3 wherein a common signal terminal is provided on the common ground layer and the phase matching circuit is formed between the common signal terminal and either one of the filter chips.
Claim 7
Dependent Claim
38 words
A duplexer package according to claim 4 wherein a common signal terminal is provided on the common ground layer and the phase matching circuit is formed between the common signal terminal and either one of the filter chips.
Claim 8
Dependent Claim
28 words
A duplexer package according to claim 1 or 2 wherein the phase matching circuit is made of a conductive material containing copper or silver as a principal component.
Claim 9
Dependent Claim
27 words
A duplexer package according to claim 1 or 2 wherein the phase matching circuit is formed of a strip-line to surround the surface acoustic wave filter chips.
Claim 10
Dependent Claim
25 words
A duplexer package according to claim 5 wherein the phase matching circuit is formed of a strip-line to surround the surface acoustic wave filter chips.
Claim 11
Dependent Claim
25 words
A duplexer package according to claim 6 wherein the phase matching circuit is formed of a strip-line to surround the surface acoustic wave filter chips.
Claim 12
Dependent Claim
18 words
A duplexer package according to claim 8 wherein the width of the strip-line varies at both ends thereof.
References Cited (Backward Citations)
US5561406A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-01-11 | 2002-07-13 | 2003-01-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-01-11 | 2006-07-13 | 2007-01-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-01-11 | 2010-07-13 | 2011-01-12 | $7700.00 | Window Closed / Lapsed |