US5838546A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Mounting structure for a semiconductor circuit
Assignee: NEC Corp
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Filing: 1997-04-14
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Granted: 1998-11-17
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Expires: 2017-04-14
Abstract
Abstract In a tape carrier package applying a TAB technique, a flex rigid PWB is used as a tape carrier. A flexible portion is provided with a semiconductor connection terminal. An LSI is directly mounted to the flexible portion. A rigid portion is provided with an electrode for mounting a component and an electrode for an external input/output.
Inventors
- 👤 Tadayoshi Miyoshi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 23:48
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/18; H05K1/182; H05K1/184; H05K1/189; H10; H10W; H10W70/00; H10W70/40; H10W70/453; H10W90/00; H05K1/02; H05K1/14; H05K1/141; H05K1/181; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0388; H05K2201/0397; H05K2201/09; H05K2201/09145; H05K2201/0919; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10674; H05K2201/10704; H05K3/00; H05K3/46; H05K3/4688; H05K3/4691; H10W72/00; H10W72/50; H10W72/551; H10W72/552; H10W72/701; H10W74/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
78 words
A semiconductor mounting structure comprising a flex rigid substrate, wherein a flex portion is provided with a connection terminal for a semiconductor integrated circuit, the semiconductor integrated circuit being directly connected and mounted to said connection terminal for the semiconductor integrated circuit; and wherein the rigid portion of said flex rigid substrate is provided with an external input/output terminal, and the semiconductor integrated circuit is connected and mounted to the mounting substrate by using said external input/output terminal.
Claim 2
Dependent Claim
78 words
A semiconductor mounting structure comprising a flex rigid substrate, wherein a flex portion is provided with a connection terminal for a semiconductor integrated circuit, the semiconductor integrated circuit being directly connected and mounted to said connection terminal for the semiconductor integrated circuit; and wherein the rigid portion of said flex rigid substrate is provided with an external input/output terminal, and the semiconductor integrated circuit is connected and mounted to the mounting substrate by using said external input/output terminal.
Claim 3
Dependent Claim
93 words
A semiconductor mounting structure comprising a flex rigid substrate, wherein a flex portion is provided with a connection terminal for a semiconductor integrated circuit, the semiconductor integrated circuit being directly connected and mounted to said connection terminal for the semiconductor integrated circuit; wherein said semiconductor integrated circuit is sealed by a resin after mounting said semiconductor integrated circuit; and wherein a rigid portion of said flex rigid substrate is provided with an electrode for mounting an electronic component, and the electronic component is mounted to said connection terminal for mounting the electronic component.
Claim 4
Dependent Claim
93 words
A semiconductor mounting structure comprising a flex rigid substrate, wherein a flex portion is provided with a connection terminal for a semiconductor integrated circuit, the semiconductor integrated circuit being directly connected and mounted to said connection terminal for the semiconductor integrated circuit; wherein said semiconductor integrated circuit is sealed by a resin after mounting said semiconductor integrated circuit; and wherein a rigid portion of said flex rigid substrate is provided with an electrode for mounting an electronic component, and the electronic component is mounted to said connection terminal for mounting the electronic component.
Claim 5
Dependent Claim
112 words
A semiconductor mounting structure comprising a flex rigid substrate, wherein a flex portion is provided with a connection terminal for a semiconductor integrated circuit, the semiconductor integrated circuit being directly connected and mounted to said connection terminal for the semiconductor integrated circuit; wherein a rigid portion of said flex rigid substrate is provided with an electrode for mounting an electronic component, and the electronic component is mounted to said connection terminal for mounting the electronic component; and wherein the rigid portion of said flex rigid substrate is provided with an external input/output terminal, and the semiconductor integrated circuit is connected and mounted to the mounting substrate by using said external input/output terminal.
Claim 6
Dependent Claim
112 words
A semiconductor mounting structure comprising a flex rigid substrate, wherein a flex portion is provided with a connection terminal for a semiconductor integrated circuit, the semiconductor integrated circuit being directly connected and mounted to said connection terminal for the semiconductor integrated circuit; wherein a rigid portion of said flex rigid substrate is provided with an electrode for mounting an electronic component, and the electronic component is mounted to said connection terminal for mounting the electronic component; and wherein the rigid portion of said flex rigid substrate is provided with an external input/output terminal, and the semiconductor integrated circuit is connected and mounted to the mounting substrate by using said external input/output terminal.
Claim 7
Dependent Claim
91 words
A semiconductor mounting structure comprising a flex rigid substrate, wherein a flex portion is provided with a connection terminal for a semiconductor integrated circuit, the semiconductor integrated circuit being directly connected and mounted to said connection terminal for the semiconductor integrated circuit; wherein a plurality of semiconductor integrated circuits are mounted to said flex portion; and wherein the rigid portion of said flex rigid substrate is provided with an external input/output terminal, and the semiconductor integrated circuit is connected and mounted to the mounting substrate by using said external input/output terminal.
Claim 8
Dependent Claim
91 words
A semiconductor mounting structure comprising a flex rigid substrate, wherein a flex portion is provided with a connection terminal for a semiconductor integrated circuit, the semiconductor integrated circuit being directly connected and mounted to said connection terminal for the semiconductor integrated circuit; wherein a plurality of semiconductor integrated circuits are mounted to said flex portion; and wherein the rigid portion of said flex rigid substrate is provided with an external input/output terminal, and the semiconductor integrated circuit is connected and mounted to the mounting substrate by using said external input/output terminal.
Claim 9
Dependent Claim
107 words
A semiconductor mounting structure comprising a flex rigid substrate, wherein a flex portion is provided with a connection terminal for a semiconductor integrated circuit, the semiconductor integrated circuit being directly connected and mounted to said connection terminal for the semiconductor integrated circuit; wherein said semiconductor integrated circuit is sealed by a resin after mounting said semiconductor integrated circuit; wherein a plurality of semiconductor integrated circuits are mounted to said flex portion; and wherein the rigid portion of said flex rigid substrate is provided with an external input/output terminal, and the semiconductor integrated circuit is connected and mounted to the mounting substrate by using said external input/output terminal.
Claim 10
Dependent Claim
107 words
A semiconductor mounting structure comprising a flex rigid substrate, wherein a flex portion is provided with a connection terminal for a semiconductor integrated circuit, the semiconductor integrated circuit being directly connected and mounted to said connection terminal for the semiconductor integrated circuit; wherein said semiconductor integrated circuit is sealed by a resin after mounting said semiconductor integrated circuit; wherein a plurality of semiconductor integrated circuits are mounted to said flex portion; and wherein the rigid portion of said flex rigid substrate is provided with an external input/output terminal, and the semiconductor integrated circuit is connected and mounted to the mounting substrate by using said external input/output terminal.
Claim 11
Dependent Claim
52 words
The semiconductor mounting structure according to claim 4, wherein a mounting portion of the semiconductor integrated circuit of said flex portion is arranged so that the mounting portion being integrated with the substrate can be adjacent to a cooling means, said semiconductor integrated circuit is adjacent or contacted to said cooling means.
Claim 12
Dependent Claim
52 words
The semiconductor mounting structure according to claim 5, wherein a mounting portion of the semiconductor integrated circuit of said flex portion is arranged so that the mounting portion being integrated with the substrate can be adjacent to a cooling means, said semiconductor integrated circuit is adjacent or contacted to said cooling means.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-11-16 | 2002-05-18 | 2002-11-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-11-16 | 2006-05-18 | 2006-11-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-11-16 | 2010-05-18 | 2010-11-17 | $7700.00 | Window Closed / Lapsed |