Memory card and its manufacturing method

Claim 2

A memory card having a spacer and circuit elements including a semiconductor device and a transmitting/receiving device sealed within a synthetic resin substrate in the form of a substantially flat plate; a pair of substantially parallel synthetic resin sheet members spaced from each other a distance substantially corresponding to the thickness of said synthetic resin substrate plate; and at least one glue-printed section provided between said spacer and each circuit element and at least one of said synthetic resin sheet members for fixing said spacer and circuit elements to said at least one synthetic resin sheet member, said glue-printed sections fixing said spacer and circuit elements and being substantially surrounded by said synthetic resin substrate.

Claim 3

A memory card according to claim 1, wherein epoxy resins or UV hardened resins are used as said synthetic resin for sealing said circuit elements in said substrate, said synthetic resin sheet members being formed of a material selected from the group of polyester films, vinyl chloride sheets or polycarbonate films for covering both surfaces of said substrate.

Claim 4

A memory card according to claim 1, wherein the thickness of said synthetic resin sheet member is about 0.1 mm, and the whole thickness after both surfaces of said substrate have been covered with said synthetic resin sheet members is about 0.76 mm.

Claim 5

A memory card according to each of claims 1 through 3, wherein a spacer is disposed in said substrate and said spacer is sealed inside said substrate together with said circuit elements.

Claim 6

A memory card according to claim 4, wherein said spacer is disposed in the periphery of said substrate.

Claim 7

A memory card according to claim 4, wherein said spacer is disposed in the center of said substrate.

Claim 8

A memory card according to claim 4, wherein said spacer is disposed both in the periphery of and the center of said substrate.

Claim 9

A memory card according to claim 4, wherein glue-printed sections are provided between said spacer and said synthetic resin sheet members for fixing said spacer to said synthetic resin sheet member, by which the quantity of said glue-printed sections is minimized to one necessary for fixing said spacer.

Claim 10

A memory card according to claim 4, wherein said glue-printed sections are placed in dots.

Claim 11

A manufacturing method for a memory card having a spacer and circuit elements including a semiconductor device and a transmitting/receiving device sealed within a synthetic resin substrate in the form of a substantially flat plate, comprising the steps of: a. laying a first synthetic resin sheet member on a flat lower casting plate; b. providing at least one glue-printed section between said first synthetic resin sheet member and each of said circuit elements and said spacer for fixing each of said circuit elements and said spacer to said fixing synthetic resin sheet member; c. mounting said circuit elements on said first synthetic resin sheet member by means of said glue-printed sections; d. injecting a synthetic resin onto said first sheet member which is placed on the lower casting plate to substantially surround said circuit elements and form said synthetic resin substrate; e. placing a flat upper casting plate with a second synthetic resin sheet member on a surface on a side of said lower casting plate to position said first and second synthetic resin sheet members on opposite sides of said synthetic resin substrate and said spacer and pressing said synthetic resin substrate between said upper and lower casting plates; f. curing said synthetic resin substrate while maintaining said pressing pressure; g. removing a resin body, which has been cured, from between said casting plates; and h. blanking said resin body to a predetermined dimension to form it into a completed memory card.

Claim 12

A manufacturing method for a memory card having a spacer and circuit elements including a semiconductor device and a transmitting/receiving device sealed within a synthetic resin substrate in the form of a substantially flat plate, comprising the steps of: a. laying a first synthetic resin sheet member on a flat lower casting plate; b. providing at least one glue-printed section between said first synthetic resin sheet member and each of said circuit elements and said spacer for fixing each of said circuit elements and said spacer to said fixing synthetic resin sheet member; c. mounting said circuit elements on said first synthetic resin sheet member by means of said glue-printed sections; d. injecting a synthetic resin onto said first sheet member which is placed on the lower casting plate to substantially surround said circuit elements and form said synthetic resin substrate; e. placing a flat upper casting plate with a second synthetic resin sheet member on a surface on a side of said lower casting plate to position said first and second synthetic resin sheet members on opposite sides of said synthetic resin substrate and said spacer and pressing said synthetic resin substrate between said upper and lower casting plates; f. curing said synthetic resin substrate while maintaining said pressing pressure; g. removing a resin body, which has been cured, from between said casting plates; and h. blanking said resin body to a predetermined dimension to form it into a completed memory card.

Claim 13

A manufacturing card according to claim 10, wherein both surfaces of said final product are ground to be flat.