US5830800A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Packaging method for a ball grid array integrated circuit without utilizing a base plate
Assignee: Compeq Manufacturing Co Ltd
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Filing: 1997-04-11
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Granted: 1998-11-03
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Expires: 2017-04-11
Abstract
Abstract A packaging method for a ball grid array (BGA) integrated circuit (IC) without utilizing a base plate as a supporting plate, and therefore reducing the thickness of the packaged BGA IC. In the method, a copper sheet is used as a supporting plate first. After resin is applied to coat a chip implanted on the copper sheet and connecting wires thereof has hardened, the hardened resin is sufficiently firm to support the IC, so the copper sheet can be etched. Accordingly, a base plate is not necessary.
Inventors
- 👤 Ting-Hao Lin
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 02:42
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/019; H10W74/014; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10P; H10P72/00; H10P72/70; H10P72/74; H10P72/7424; H10W72/00; H10W72/01; H10W72/0198; H10W72/071; H10W72/075; H10W72/07502; H10W72/07504; H10W72/50; H10W72/551; H10W72/552; H10W72/5522; H10W90/00; H10W90/701; H10W90/751; H10W90/756; Y; Y10; Y10S; Y10S438/00; Y10S438/977
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
117 words
A packaging method for a ball grid array (BGA) integrated circuit (IC) without utilizing a base plate comprising steps of: preparing a copper sheet; covering a patterned dry film to said copper sheet; electroplating metal to portions of said copper sheet exposed from said patterned dry film to form at least one circuit and removing said dry film; implanting at least one chip to said copper sheet; electrically connecting terminals of said at least one chip with said at least one circuit by wires; applying resin to coat said at least one chip; etching said copper sheet after said resin has been hardened to expose said circuit; and implanting solder balls to contact positions of said circuit.
Claim 2
Dependent Claim
117 words
A packaging method for a ball grid array (BGA) integrated circuit (IC) without utilizing a base plate comprising steps of: preparing a copper sheet; covering a patterned dry film to said copper sheet; electroplating metal to portions of said copper sheet exposed from said patterned dry film to form at least one circuit and removing said dry film; implanting at least one chip to said copper sheet; electrically connecting terminals of said at least one chip with said at least one circuit by wires; applying resin to coat said at least one chip; etching said copper sheet after said resin has been hardened to expose said circuit; and implanting solder balls to contact positions of said circuit.
Claim 3
Dependent Claim
46 words
The method according to claim 1, wherein said step of implanting chip implants a plurality of chips on said copper sheet, said step of electroplating metal to said copper sheet forms a corresponding number of circuits, and there is a connecting link between every two circuits.
Claim 4
Dependent Claim
27 words
The method according to claim 2, further comprising a step of etching said connecting links to form individually separate ICs after said step of implanting solder balls.
Claim 5
Dependent Claim
25 words
The method according to claim 3, further comprising a step of applying an antioxidation coating to said separate ICs after said connecting links are etched.
Claim 6
Dependent Claim
35 words
The method according to claim 1, further comprising a step of applying an antioxidation coating to said exposed circuits except for the positions to be implanted with solder balls after said copper sheet is etched.
Claim 7
Dependent Claim
16 words
The method according to claim 1, wherein said electroplated circuits are projected from said copper sheet.
Claim 8
Dependent Claim
27 words
The method according to claim 1, wherein said wires connecting said terminals of said at least one chip with said at least one circuit are gold wires.
References Cited (Backward Citations)
US5656550A
Cited
US5620928A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-11-02 | 2002-05-04 | 2002-11-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-11-02 | 2006-05-04 | 2006-11-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-11-02 | 2010-05-04 | 2010-11-03 | $7700.00 | Window Closed / Lapsed |