US5828555A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multilayer printed circuit board and high-frequency circuit device using the same
Assignee: Fujitsu Ltd
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Filing: 1997-05-20
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Granted: 1998-10-27
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Expires: 2017-05-20
Abstract
Abstract A multilayer printed-circuit board includes at least one inner-layer signal line, first and second ground layers between which the inner-layer signal line is sandwiched via a frame member made of an insulating material in a thickness direction of the multilayer printed-circuit board, and metallic wall members which are provided on inner walls of slits formed in the frame member and extending along the inner-layer signal line. The first and second ground layers and the metallic wall members shielding the inner-layer signal line.
Inventors
- 👤 Takumi Itoh
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 16:48
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0216; H05K1/0218; H05K1/0219; H05K1/0221; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09063; H05K2201/09209; H05K2201/095; H05K2201/09618; H05K2201/09654; H05K2201/09809; H05K2201/09818; H05K2201/09981; H05K2201/10; H05K2201/10227; H05K2201/10356; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3447; H05K3/40; H05K3/42; H05K3/429
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
89 words
A multilayer printed-circuit board comprising: at least one inner-layer signal line; first and second ground layers between which said at least one inner-layer signal line is sandwiched via a frame member made of an insulating material in a thickness direction of the multilayer printed-circuit board; and metallic wall members provided on inner walls of slits formed in the frame member and extending along said at least one inner-layer signal line, said first and second ground layers and said metallic wall members shielding said at least one inner-layer signal line.
Claim 2
Dependent Claim
89 words
A multilayer printed-circuit board comprising: at least one inner-layer signal line; first and second ground layers between which said at least one inner-layer signal line is sandwiched via a frame member made of an insulating material in a thickness direction of the multilayer printed-circuit board; and metallic wall members provided on inner walls of slits formed in the frame member and extending along said at least one inner-layer signal line, said first and second ground layers and said metallic wall members shielding said at least one inner-layer signal line.
Claim 3
Dependent Claim
38 words
The multilayer printed-circuit board as claimed in claim 1, wherein: said slits penetrate the multilayer printed-circuit board in the thickness direction thereof; and said metallic wall members include plated films provided on the inner walls of the slits.
Claim 4
Dependent Claim
33 words
The multilayer printed-circuit board as claimed in claim 1, wherein: said slits penetrate the multilayer printed-circuit board in the thickness direction thereof; and said metallic wall members include solders filled in said slits.
Claim 5
Dependent Claim
38 words
The multilayer printed-circuit board as claimed in claim 1, wherein: said slits penetrate the multilayer printed-circuit board in the thickness direction thereof; and said metallic wall members include metallic strip members provided in said slits and soldered therein.
Claim 6
Dependent Claim
41 words
The multilayer printed-circuit board as claimed in claim 2, wherein: said slits are arranged in lines which respectively extend along said at least one inner-layer signal line; and said slits in each of the lines are spaced apart from each other.
Claim 7
Dependent Claim
41 words
The multilayer printed-circuit board as claimed in claim 3, wherein: said slits are arranged in lines which respectively extend along said at least one inner-layer signal line; and said slits in each of the lines are spaced apart from each other.
Claim 8
Dependent Claim
41 words
The multilayer printed-circuit board as claimed in claim 4, wherein: said slits are arranged in lines which respectively extend along said at least one inner-layer signal line; and said slits in each of the lines are spaced apart from each other.
Claim 9
Dependent Claim
33 words
The multilayer printed-circuit board as claimed in claim 5, wherein said slits in lines are offset in a direction perpendicular to the direction in which said at least one inner-layer signal line extends.
Claim 10
Dependent Claim
33 words
The multilayer printed-circuit board as claimed in claim 6, wherein said slits in lines are offset in a direction perpendicular to the direction in which said at least one inner-layer signal line extends.
Claim 11
Dependent Claim
33 words
The multilayer printed-circuit board as claimed in claim 7, wherein said slits in lines are offset in a direction perpendicular to the direction in which said at least one inner-layer signal line extends.
Claim 12
Dependent Claim
35 words
The multilayer printed-circuit board as claimed in claim 1, further comprising through holes provided further out than ends of said at least one inner-layer signal line, and metallic members respectively provided in the through holes.
Claim 13
Dependent Claim
156 words
A circuit device comprising: printed-circuit boards on which circuit parts are provided; a back board to which the printed-circuit boards are attached and arranged side by side; first connectors provided to the printed-circuit boards; and second connectors provided to the back board and engaged with the first connectors provided to the printed-circuit boards, each of the printed-circuit boards and the back boards comprising: at least one inner-layer signal line connected to one of the first and second connectors; first and second ground layers between which said at least one inner-layer signal line is sandwiched via a frame member made of an insulating material in a thickness direction of the multilayer printed-circuit board; and metallic wall members provided on inner walls of slits formed in the frame member and extending along said at least one inner-layer signal line, said first and second ground layers and said metallic wall members shielding said at least one inner-layer signal line.
Claim 14
Dependent Claim
156 words
A circuit device comprising: printed-circuit boards on which circuit parts are provided; a back board to which the printed-circuit boards are attached and arranged side by side; first connectors provided to the printed-circuit boards; and second connectors provided to the back board and engaged with the first connectors provided to the printed-circuit boards, each of the printed-circuit boards and the back boards comprising: at least one inner-layer signal line connected to one of the first and second connectors; first and second ground layers between which said at least one inner-layer signal line is sandwiched via a frame member made of an insulating material in a thickness direction of the multilayer printed-circuit board; and metallic wall members provided on inner walls of slits formed in the frame member and extending along said at least one inner-layer signal line, said first and second ground layers and said metallic wall members shielding said at least one inner-layer signal line.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-10-26 | 2002-04-27 | 2002-10-27 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-10-26 | 2006-04-27 | 2006-10-27 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-10-26 | 2010-04-27 | 2010-10-27 | $7700.00 | Window Closed / Lapsed |