US5819398A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of manufacturing a ball grid array package
Assignee: STMicroelectronics Ltd Great Britain
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Filing: 1996-07-31
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Granted: 1998-10-13
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Expires: 2016-07-31
Abstract
Abstract The present invention proposes a method of manufacturing a ball grid array printed circuit board (210) that comprises the following steps: fabricating a printed circuit board, PCB, that comprises a matrix of ball grid array PCBs, each ball grid array PCB of the matrix is separated from its neighbors by the width of an electroplating tie bar (230); stamping the matrix of ball grid array PCBs for separating them and for forming an aperture (320) that is substantially centralized within each of them; preparing a metal sheet (510), onto which a semiconductor device (130) is mechanically attached; mechanically attaching a singularized ball grid array PCB to the metal sheet; and molding about the semiconductor device and a portion of the ball grid array PCB a protective material (140) that is substantially planar with respect to the ball grid array PCB.
Inventors
- 👤 Elwyn Wakefield
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 20:44
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/226; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W70/682; H10W70/685; H10W72/00; H10W72/071; H10W72/075; H10W72/07551; H10W72/07554; H10W72/50; H10W72/541; H10W72/547; H10W90/00; H10W90/701; H10W90/751; H10W90/754; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126; Y10T29/4913
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
151 words
A method of manufacturing a ball grid array printed circuit board, comprising the following steps: fabricating a matrix of ball grid array printed circuit boards, each ball grid array printed circuit board of the matrix being substantially the final desired size and being separated from its neighbors by only an electroplating tie bar; forming an aperture that is substantially centralized within each of the ball grid array printed circuit boards; stamping the matrix of ball grid array printed circuit boards to separate each of the ball grid array printed circuit boards; preparing a metal sheet, onto which a semiconductor device is mechanically attached; mechanically attaching a separated ball grid array printed circuit board to the metal sheet; and molding about the semiconductor device and a portion of the ball grid array printed circuit board a protective material that is substantially planar with respect to the ball grid array printed circuit board.
Claim 2
Independent Claim
151 words
A method of manufacturing a ball grid array printed circuit board, comprising the following steps: fabricating a matrix of ball grid array printed circuit boards, each ball grid array printed circuit board of the matrix being substantially the final desired size and being separated from its neighbors by only an electroplating tie bar; forming an aperture that is substantially centralized within each of the ball grid array printed circuit boards; stamping the matrix of ball grid array printed circuit boards to separate each of the ball grid array printed circuit boards; preparing a metal sheet, onto which a semiconductor device is mechanically attached; mechanically attaching a separated ball grid array printed circuit board to the metal sheet; and molding about the semiconductor device and a portion of the ball grid array printed circuit board a protective material that is substantially planar with respect to the ball grid array printed circuit board.
Claim 3
Dependent Claim
24 words
The method of manufacturing a ball grid array printed circuit board of claim 1, characterized in that the prepared metal sheet is substantially planar.
Claim 4
Dependent Claim
31 words
The method of manufacturing a ball grid array printed circuit board of claim 1, characterized in that the prepared metal sheet includes an indent, wherein the semiconductor device is mechanically attached.
Claim 5
Dependent Claim
35 words
The method of manufacturing a ball grid array printed circuit board of claim 1, characterized in that the prepared metal sheet is substantially the same size as a separated ball grid array printed circuit board.
Claim 6
Dependent Claim
33 words
The method of manufacturing a ball grid array printed circuit board of claim 1, characterized in that the prepared metal sheet substantially envelopes the sides of the ball grid array printed circuit board.
Claim 7
Dependent Claim
28 words
The method of manufacturing a ball grid array printed circuit board of claim 1, characterized in that a plurality of metal sheets are prepared at the same time.
Claim 8
Dependent Claim
33 words
The method of manufacturing a ball grid array printed circuit board of claim 6, characterized in that the plurality of metal sheets are prepared as a matrix of heatspreaders with solid center plates.
Claim 9
Dependent Claim
65 words
The method of manufacturing a ball grid array printed circuit board of claim 1, characterized in that the respective steps of mechanically attaching, to the prepared metal sheet, the semiconductor device and the separated ball grid array printed circuit board also include the respective steps of electrically attaching, to the prepared metal sheet, the semiconductor device and the separated ball grid array printed circuit board.
Claim 10
Dependent Claim
30 words
The method of manufacturing a ball grid array printed circuit board of claim 1, characterized in that the thickness of the prepared metal sheet is greater than approximately 0.1 millimeters.
Claim 11
Dependent Claim
28 words
The method of manufacturing a ball grid array printed circuit board of claim 1, characterized in that the thickness of the prepared metal sheet is approximately 0.25 millimeters.
Claim 12
Dependent Claim
29 words
The method of manufacturing a ball grid array printed circuit board of claim 1, characterized in that the prepared metal sheet is manufactured from copper or a copper alloy.
Claim 13
Dependent Claim
29 words
The method of manufacturing a ball grid array printed circuit board of claim 1, characterized in that the prepared metal sheet is manufactured from aluminum or an aluminum alloy.
Claim 14
Independent Claim
127 words
A method of manufacturing a ball grid array (BGA) printed circuit board, comprising the steps of: fabricating a matrix of BGA printed circuit boards, each BGA printed circuit board of said matrix being separated from adjacent BGA printed circuit boards by a distance that substantially corresponds to only the width of an electroplating tie bar; forming an aperture that is substantially centralized within each of the BGA printed circuit boards; separating said matrix of BGA printed circuit boards into individual BGA printed circuit boards; mechanically attaching a semiconductor device onto a prepared metal sheet; mechanically attaching one of said individual BGA printed circuit board to said metal sheet; and encapsulating said semiconductor device and a portion of said individual BGA printed circuit board in a protective material.
Claim 15
Independent Claim
127 words
A method of manufacturing a ball grid array (BGA) printed circuit board, comprising the steps of: fabricating a matrix of BGA printed circuit boards, each BGA printed circuit board of said matrix being separated from adjacent BGA printed circuit boards by a distance that substantially corresponds to only the width of an electroplating tie bar; forming an aperture that is substantially centralized within each of the BGA printed circuit boards; separating said matrix of BGA printed circuit boards into individual BGA printed circuit boards; mechanically attaching a semiconductor device onto a prepared metal sheet; mechanically attaching one of said individual BGA printed circuit board to said metal sheet; and encapsulating said semiconductor device and a portion of said individual BGA printed circuit board in a protective material.
Claim 16
Dependent Claim
13 words
The method of claim 13, wherein said prepared metal sheet is substantially planar.
Claim 17
Dependent Claim
20 words
The method of claim 13, wherein said prepared metal sheet includes an indent, wherein the semiconductor device is mechanically attached.
Claim 18
Dependent Claim
22 words
The method of claim 13, wherein said prepared metal sheet is substantially the same size as said individual BGA printed circuit board.
Claim 19
Dependent Claim
21 words
The method of claim 13, wherein said prepared metal sheet substantially envelops the sides of said individual BGA printed circuit board.
Claim 20
Dependent Claim
17 words
The method of claim 13, wherein a plurality of metal sheets are prepared at the same time.
Claim 21
Dependent Claim
22 words
The method of claim 18, wherein said plurality of metal sheets are prepared as a matrix of heatspreaders with solid center plates.
Claim 22
Dependent Claim
24 words
The method of claim 13, wherein said semiconductor device and said BGA printed circuit board are also electrically connected to said prepared metal sheet.
Claim 23
Dependent Claim
17 words
The method of claim 13, wherein said prepared metal sheet thickness is greater than approximately 0.1 millimeters.
Claim 24
Dependent Claim
15 words
The method of claim 13, wherein said prepared metal sheet thickness is approximately 0.25 millimeters.
Claim 25
Dependent Claim
18 words
The method of claim 13, wherein said prepared metal sheet is manufactured from copper or a copper alloy.
Claim 26
Dependent Claim
18 words
The method of claim 13, wherein said prepared metal sheet is manufactured from aluminum or an aluminum alloy.
Claim 27
Independent Claim
126 words
A method of manufacturing a ball grid array (BGA) printed circuit board, comprising the steps of: fabricating a plurality of printed circuit boards of like dimensions; forming an aperture within each said printed circuit board, wherein each said aperture is of a dimension different from any other said aperture of any other printed circuit board; laminating said printed circuit boards to form a matrix of BGA printed circuit boards; separating said matrix of BGA printed circuit boards into individual BGA printed circuit boards; mechanically attaching a semiconductor device onto a prepared metal sheet; mechanically attaching one of said individual BGA printed circuit board to said metal sheet; and encapsulating said semiconductor device and a portion of said individual BGA printed circuit board in a protective material.
Claim 28
Independent Claim
126 words
A method of manufacturing a ball grid array (BGA) printed circuit board, comprising the steps of: fabricating a plurality of printed circuit boards of like dimensions; forming an aperture within each said printed circuit board, wherein each said aperture is of a dimension different from any other said aperture of any other printed circuit board; laminating said printed circuit boards to form a matrix of BGA printed circuit boards; separating said matrix of BGA printed circuit boards into individual BGA printed circuit boards; mechanically attaching a semiconductor device onto a prepared metal sheet; mechanically attaching one of said individual BGA printed circuit board to said metal sheet; and encapsulating said semiconductor device and a portion of said individual BGA printed circuit board in a protective material.
References Cited (Backward Citations)
US4285002A
Cited
US4689103A
Cited
US5159750A
Cited
US5235209A
Cited
US5331510A
Cited
US5420460A
Cited
US5357672A
Cited
US5578796A
Cited
US5557502A
Cited
US5572405A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-10-12 | 2002-04-13 | 2002-10-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-10-12 | 2006-04-13 | 2006-10-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-10-12 | 2010-04-13 | 2010-10-13 | $7700.00 | Window Closed / Lapsed |