US5809633A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method for producing a smart card module for contactless smart cards
Assignee: Infineon Technologies AG
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Filing: 1997-03-05
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Granted: 1998-09-22
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Expires: 2017-03-05
Abstract
Abstract A method for producing a smart card module includes bonding one end of a thin wire onto a first contact zone of a semiconductor chip. The wire is guided in a plurality of turns forming an antenna coil. The wire is bonded onto a second contact area of the semiconductor chip. The wire turns of the antenna coil and the semiconductor chip are placed on a carrier body.
Inventors
- 👤 Josef Mundigl
- 👤 Detlef Houdeau
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 17:33
CPC Classifications
G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/07745; G06K19/07747; G06K19/07749; G06K19/0775; G06K19/07773; G06K19/07777; G06K19/07779; G06K19/07781; G06K19/07783; H; H10; H10W; H10W72/00; H10W72/50; H10W72/531; H10W72/5363; H10W72/541; H10W72/5453; H10W72/551; H10W72/552; H10W72/5524; H10W72/59; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49016; Y10T29/49117; Y10T29/49121
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
67 words
A method for producing a smart card module, which comprises: bonding one end of a thin wire onto a first contact zone of a semiconductor chip; guiding the wire in a plurality of turns forming an antenna coil; bonding the wire onto a second contact area of the semiconductor chip; and placing the wire turns of the antenna coil and the semiconductor chip on a carrier body.
Claim 2
Independent Claim
67 words
A method for producing a smart card module, which comprises: bonding one end of a thin wire onto a first contact zone of a semiconductor chip; guiding the wire in a plurality of turns forming an antenna coil; bonding the wire onto a second contact area of the semiconductor chip; and placing the wire turns of the antenna coil and the semiconductor chip on a carrier body.
Claim 3
Dependent Claim
16 words
The method according to claim 1, which comprises performing the guiding step with a bonding head.
Claim 4
Dependent Claim
54 words
The method according to claim 1, which comprises placing the semiconductor chip in a recess in the carrier body and suspending the semiconductor chip from bonds at the ends of the wire, while carrying out the step of placing the wire turns of the antenna coil and the semiconductor chip on the carrier body.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-09-21 | 2002-03-23 | 2002-09-22 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-09-21 | 2006-03-23 | 2006-09-22 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-09-21 | 2010-03-23 | 2010-09-22 | $7700.00 | Window Closed / Lapsed |