Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
84 words
A method of fabricating an MFM capacitor comprising the steps of: depositing on a substrate a lower electrode layer, a ferroelectric dielectric layer, and an upper electrode layer; etching the upper electrode layer and ferroelectric dielectric layer according to a first pattern, exposing an upper surface of the lower electrode layer; and etching the upper electrode layer and the lower electrode layer without etching through the ferroelectric dielectric layer according to a second pattern, such that a portion of the exposed lower electrode remains.
Claim 2
Independent Claim
84 words
A method of fabricating an MFM capacitor comprising the steps of: depositing on a substrate a lower electrode layer, a ferroelectric dielectric layer, and an upper electrode layer; etching the upper electrode layer and ferroelectric dielectric layer according to a first pattern, exposing an upper surface of the lower electrode layer; and etching the upper electrode layer and the lower electrode layer without etching through the ferroelectric dielectric layer according to a second pattern, such that a portion of the exposed lower electrode remains.
Claim 3
Dependent Claim
56 words
The method of claim 1 in which the first etching step comprises the steps of: applying a photoresist layer on an upper surface of the upper electrode layer; defining a pattern in the photoresist layer corresponding to the dimensions of the MFM capacitor ferroelectric dielectric; and etching the upper electrode layer and the ferroelectric dielectric layer.
Claim 4
Dependent Claim
76 words
The method of claim 1 in which the second etching step comprises the steps of: applying a photoresist layer on an upper surface of the upper electrode layer and an exposed portion of an upper surface of the lower electrode layer; defining a pattern in the photoresist layer corresponding to the dimensions of one or more upper electrodes and the dimensions of the lower electrode; and etching the upper electrode layer and the lower electrode layer.
Claim 5
Dependent Claim
22 words
The method of claim 1 in which the second etching step further comprises the step of producing a vestigial upper electrode feature.
Claim 6
Dependent Claim
15 words
The method of claim 1 further comprising the step of depositing an oxide dielectric layer.
Claim 7
Dependent Claim
32 words
The method of claim 5 further comprising the step of etching the oxide dielectric layer to expose the surface of one or more upper electrodes and the surface of a lower electrode.
Claim 8
Dependent Claim
18 words
The method of claim 6 further comprising the step of individually metalizing the upper electrodes and lower electrode.
Claim 9
Independent Claim
125 words
A method of fabricating an MFM capacitor comprising the steps of: depositing an oxide layer on a substrate; depositing a platinum lower electrode layer on the oxide layer; depositing a PZT ferroelectric dielectric layer on the lower electrode layer; depositing a platinum upper electrode layer on the ferroelectric dielectric layer; etching the upper electrode layer and the ferroelectric layer according to a pattern determined by a first reticle, exposing an upper surface of the lower electrode layer; etching the upper electrode layer and the lower electrode layer without etching through the ferroelectric dielectric layer according to a pattern determined by a second reticle, so that one or more upper electrodes, a vestigial upper electrode, and a bottom electrode having an exposed upper surface are formed.
Claim 10
Independent Claim
125 words
A method of fabricating an MFM capacitor comprising the steps of: depositing an oxide layer on a substrate; depositing a platinum lower electrode layer on the oxide layer; depositing a PZT ferroelectric dielectric layer on the lower electrode layer; depositing a platinum upper electrode layer on the ferroelectric dielectric layer; etching the upper electrode layer and the ferroelectric layer according to a pattern determined by a first reticle, exposing an upper surface of the lower electrode layer; etching the upper electrode layer and the lower electrode layer without etching through the ferroelectric dielectric layer according to a pattern determined by a second reticle, so that one or more upper electrodes, a vestigial upper electrode, and a bottom electrode having an exposed upper surface are formed.
Claim 11
Dependent Claim
47 words
The method of claim 8 further comprising the steps of: depositing an oxide dielectric layer on the surface of the MFM capacitor; and etching the oxide dielectric layer to expose the surface of the upper electrodes and bottom electrode, wherein the vestigial upper electrode is electrically isolated.
Claim 12
Dependent Claim
18 words
The method of claim 9 further comprising the step of individually metalizing the upper electrodes and bottom electrode.