US5780926A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Multichip package device having a lead frame with stacked patterned metallization layers and insulation layers
Assignee: Samsung Electronics Co Ltd
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Filing: 1997-02-14
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Granted: 1998-07-14
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Expires: 2017-02-14
Abstract
Abstract A multichip package device includes a lead frame having supporting portions and lead portions for electrically connecting the multichip package with an external electronic device. The multichip package is formed by depositing first and second inner insulation layers on lower and upper surfaces of the lead frame, respectively. Via holes are then formed through the first and the second inner insulation layers. First and second metallization layers are deposited and patterned on lower and upper surfaces of the first and the second inner insulation layers, respectively. First and second outer insulation layers are then deposited on lower and upper surfaces of the first and the second patterned metallization layers, respectively. A plurality of chips, each having an active surface on which a plurality of bonding pads are formed, are attached to lower and upper surfaces of the first and second outer insulation layers. A plurality of bonding wires are connected between the plurality of bonding pads and the lead portions through the via holes and the first and second patterned metallization layers.
Inventors
- 👤 Jeong Woo Seo
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:47
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/811; H10W70/00; H10W70/40; H10W70/464; H10W70/468; H10W74/00; H10W90/701; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
193 words
A multichip package device comprising: a lead frame having supporting portions and lead portions, said lead portions comprising inner leads and outer leads for electrically connecting the multichip package with an external electronic device; first and second inner insulation layers deposited on lower and upper surfaces of the lead frame, respectively; via holes formed through the first and the second inner insulation layers; first and second metallization layers deposited and patterned on lower and upper surfaces of the first and the second inner insulation layers, respectively; first and second outer insulation layers deposited on lower and upper surfaces of the first and the second patterned metallization layers, respectively; a plurality of chips, each having an active surface on which a plurality of bonding pads are formed, and wherein backsides of the chips are attached to lower and upper surfaces of the first and second outer insulation layers; a plurality of bonding wires connected between the plurality of bonding pads and the inner leads through the via holes and the first and second patterned metallization layers; and an encapsulant for encapsulating the chips, the supporting portions and the inner leads of the lead portions.
Claim 2
Dependent Claim
193 words
A multichip package device comprising: a lead frame having supporting portions and lead portions, said lead portions comprising inner leads and outer leads for electrically connecting the multichip package with an external electronic device; first and second inner insulation layers deposited on lower and upper surfaces of the lead frame, respectively; via holes formed through the first and the second inner insulation layers; first and second metallization layers deposited and patterned on lower and upper surfaces of the first and the second inner insulation layers, respectively; first and second outer insulation layers deposited on lower and upper surfaces of the first and the second patterned metallization layers, respectively; a plurality of chips, each having an active surface on which a plurality of bonding pads are formed, and wherein backsides of the chips are attached to lower and upper surfaces of the first and second outer insulation layers; a plurality of bonding wires connected between the plurality of bonding pads and the inner leads through the via holes and the first and second patterned metallization layers; and an encapsulant for encapsulating the chips, the supporting portions and the inner leads of the lead portions.
Claim 3
Dependent Claim
20 words
The multichip package of claim 1, wherein said supporting portions and said lead portions of the lead frame are coplanar.
Claim 4
Dependent Claim
28 words
The multichip package of claim 2, wherein said first and second inner insulation layers, and said first and second outer insulation layers are made of a photo resist.
Claim 5
Dependent Claim
50 words
The multichip package of claim 1, wherein bonding areas of the first and the second patterned metallization layers are exposed to the outside by selectively removing portions of the first and second outer insulation layers, so that the bonding pads of the chips are interconnected with corresponding patterned metallization layers.
Claim 6
Dependent Claim
27 words
The multichip package of claim 1, wherein said inner leads are electrically interconnected with the corresponding via holes, said via holes being plated with a conductive material.
Claim 7
Dependent Claim
15 words
The multichip package of claim 1, wherein said encapsulant is an epoxy molding compound (EMC).
Claim 8
Dependent Claim
18 words
The multichip package of claim 1, wherein said bonding pads are centrally formed on each of said chips.
Claim 9
Dependent Claim
18 words
The multichip package of claim 1, wherein said bonding pads are formed on edge portions of said chips.
Claim 10
Dependent Claim
14 words
The multichip package of claim 1, wherein said lead frame is made of copper.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-07-13 | 2002-01-12 | 2002-07-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-07-13 | 2006-01-12 | 2006-07-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-07-13 | 2010-01-12 | 2010-07-14 | $7700.00 | Window Closed / Lapsed |