US5780875A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Hybrid optical integration assembly using optical platform
Assignee: Hitachi Cable Ltd
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Filing: 1996-08-29
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Granted: 1998-07-14
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Expires: 2016-08-29
Abstract
Abstract An optical assembly structure includes, a semiconductor element generating a large amount of heat and a high impedance optical element which are to be mounted, with low optical loss on the same semiconductor substrate which has an optical waveguide formed thereon.The element generating a large amount of heat is mounted on a terrace of the semiconductor substrate directly or through an insulating layer having a thickness of submicron order, while the high impedance element is mounted in a groove which is etched into the semiconductor substrate to such an extent that the optical axis of the high impedance element mates with the optical axis of the optical waveguide layer formed on a recess in the semiconductor substrate. The optical axes can be adjusted independently for the respective elements. Alternatively, with a potential on the semiconductor substrate set equal to a supply voltage or a ground potential, a crystal substrate for a forward biased heat generating element is given the polarity opposite to that of a crystal substrate for a reverse biased element which may imply a problem of stray capacitance.
Inventors
- 👤 Shinji Tsuji
- 👤 Ryuta Takahashi
- 👤 Masato Shishikura
- 👤 Satoru Kikuchi
- 👤 Satoshi Aoki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 16:15
CPC Classifications
G; G02; G02B; G02B6/00; G02B6/24; G02B6/42; G02B6/4201; G02B6/4246; G02B6/4219; G02B6/422; G02B6/4221; G02B6/4224; G02B6/4249; H; H10; H10W; H10W72/00; H10W72/50; H10W72/541; H10W72/5445; H10W72/551; H10W72/552; H10W72/5522; H10W72/851; H10W72/874; H10W72/884
Claims Analysis
Total Claims: 32
Claim 1
Independent Claim
153 words
An optical assembly, comprising: a semiconductor substrate; a semiconductor light emitting element mounted on said semiconductor substrate; and a semiconductor light receiving element mounted on said semiconductor substrate, wherein said semiconductor light emitting element is mounted on said semiconductor substrate directly or through a thin film layer, said semiconductor light receiving element is mounted on said semiconductor substrate through a dielectric layer, said semiconductor substrate includes an optical waveguide formed thereon, said optical waveguide having said dielectric layer, wherein a material inserted between said semiconductor light receiving element and said semiconductor substrate has a thickness which is greater than the thickness of a material inserted between said semiconductor light emitting element and said semiconductor substrate, and said optical waveguide has its optical axis adjusted to the optical axis of said semiconductor light emitting element, and said optical waveguide has its optical axis adjusted to the optical axis of said semiconductor light receiving element.
Claim 2
Dependent Claim
153 words
An optical assembly, comprising: a semiconductor substrate; a semiconductor light emitting element mounted on said semiconductor substrate; and a semiconductor light receiving element mounted on said semiconductor substrate, wherein said semiconductor light emitting element is mounted on said semiconductor substrate directly or through a thin film layer, said semiconductor light receiving element is mounted on said semiconductor substrate through a dielectric layer, said semiconductor substrate includes an optical waveguide formed thereon, said optical waveguide having said dielectric layer, wherein a material inserted between said semiconductor light receiving element and said semiconductor substrate has a thickness which is greater than the thickness of a material inserted between said semiconductor light emitting element and said semiconductor substrate, and said optical waveguide has its optical axis adjusted to the optical axis of said semiconductor light emitting element, and said optical waveguide has its optical axis adjusted to the optical axis of said semiconductor light receiving element.
Claim 3
Dependent Claim
67 words
An optical assembly according to claim 1, wherein said semiconductor substrate has a terrace for mounting said semiconductor light emitting element thereon; said semiconductor light emitting element is mounted on said terrace; said semiconductor substrate has a bottom around said terrace; said optical waveguide is formed on said bottom; and said semiconductor light receiving element is mounted in a groove formed by partially etching said dielectric layer.
Claim 4
Dependent Claim
23 words
An optical assembly according to claim 2, wherein said groove in which said optical light receiving element mounted is covered by a lid.
Claim 5
Dependent Claim
32 words
An optical assembly according to claim 2, wherein the interior of said groove in which said semiconductor light receiving element is mounted is filled with a resin to bury a light path.
Claim 6
Dependent Claim
54 words
An optical assembly according to claim 1, wherein said semiconductor light receiving element has an optical waveguide structure, and the height of the optical axis of said semiconductor light receiving element is adjusted to the height of the optical axis of said optical waveguide with an offset equal to or less than 3 microns.
Claim 7
Dependent Claim
29 words
An optical assembly according to claim 1, wherein said semiconductor light receiving element is applied with a predetermined voltage such that said semiconductor light receiving element is reversely biased.
Claim 8
Dependent Claim
29 words
An optical assembly according to claim 1, wherein a material for said semiconductor substrate is silicon having a crystal orientation of (100) with an offset less than 5 degrees.
Claim 9
Dependent Claim
18 words
An optical assembly according to claim 1, wherein a dielectric material of said optical waveguide includes silicon oxide.
Claim 10
Dependent Claim
54 words
An optical assembly according to claim 1, wherein said semiconductor light emitting element has an optical waveguide structure, and the height of the optical axis of said semiconductor light emitting element is adjusted to the height of the optical axis of said optical waveguide with an offset equal to or less than 3 microns.
Claim 11
Dependent Claim
32 words
An optical assembly according to claim 1, wherein said optical waveguide connected to said semiconductor light emitting element is optically coupled to said optical waveguide connected to said semiconductor light receiving element.
Claim 12
Dependent Claim
12 words
An optical transmission module using the optical assembly according to claim 1.
Claim 13
Dependent Claim
185 words
An optical assembly, comprising: a semiconductor substrate; a semiconductor light emitting element mounted on said semiconductor substrate; and a semiconductor light receiving element mounted on said semiconductor substrate; wherein said semiconductor light emitting element is mounted on said semiconductor substrate directly or through a thin film layer, said semiconductor light receiving element is mounted on said semiconductor substrate directly or through a thin film layer, said semiconductor light emitting element is mounted to be biased in a forward direction, and said semiconductor light receiving element is mounted to be biased in a reverse direction, said semiconductor light emitting element and said semiconductor light receiving element are mounted so that signal lines for said semiconductor light emitting element and said semiconductor light receiving element are arranged at a side a distance from said semiconductor substrate, an optical waveguide having a dielectric layer is formed on said semiconductor substrate, and said optical waveguide has its optical axis adjusted to the optical axis of said semiconductor light emitting element, and said optical waveguide has its optical axis adjusted to the optical axis of said semiconductor light receiving element.
Claim 14
Dependent Claim
185 words
An optical assembly, comprising: a semiconductor substrate; a semiconductor light emitting element mounted on said semiconductor substrate; and a semiconductor light receiving element mounted on said semiconductor substrate; wherein said semiconductor light emitting element is mounted on said semiconductor substrate directly or through a thin film layer, said semiconductor light receiving element is mounted on said semiconductor substrate directly or through a thin film layer, said semiconductor light emitting element is mounted to be biased in a forward direction, and said semiconductor light receiving element is mounted to be biased in a reverse direction, said semiconductor light emitting element and said semiconductor light receiving element are mounted so that signal lines for said semiconductor light emitting element and said semiconductor light receiving element are arranged at a side a distance from said semiconductor substrate, an optical waveguide having a dielectric layer is formed on said semiconductor substrate, and said optical waveguide has its optical axis adjusted to the optical axis of said semiconductor light emitting element, and said optical waveguide has its optical axis adjusted to the optical axis of said semiconductor light receiving element.
Claim 15
Dependent Claim
28 words
An optical assembly according to claim 12, wherein said semiconductor light emitting element and said semiconductor light receiving element are mounted on terraces formed on said semiconductor substrate.
Claim 16
Dependent Claim
18 words
An optical assembly according to claim 13, wherein an insulating film is formed on each of said terraces.
Claim 17
Dependent Claim
54 words
An optical assembly according to claim 12, wherein said semiconductor light receiving element has an optical waveguide structure, and the height of the optical axis of said semiconductor light receiving element is adjusted to the height of the optical axis of said optical waveguide with an offset equal to or less than 3 microns.
Claim 18
Dependent Claim
29 words
An optical assembly according to claim 12, wherein a material for said semiconductor substrate is silicon having a crystal orientation of (100) with an offset less than 5 degrees.
Claim 19
Dependent Claim
18 words
An optical assembly according to claim 12, wherein a dielectric material of said optical waveguide includes silicon oxide.
Claim 20
Dependent Claim
54 words
An optical assembly according to claim 12, wherein said semiconductor light emitting element has an optical waveguide structure, and the height of the optical axis of said semiconductor light emitting element is adjusted to the height of the optical axis of said optical waveguide with an offset equal to or less than 3 microns.
Claim 21
Dependent Claim
32 words
An optical assembly according to claim 12, wherein said optical waveguide connected to said semiconductor light emitting element is optically coupled to said optical waveguide connected to said semiconductor light receiving element.
Claim 22
Dependent Claim
30 words
An optical assembly according to claim 12, wherein said semiconductor light receiving element is mounted on a groove formed on said semiconductor substrate, said groove being covered by a lid.
Claim 23
Dependent Claim
38 words
An optical assembly according to claim 12, wherein said semiconductor light receiving element is mounted on a groove formed on said semiconductor substrate, and an interior of said groove and an optical path are filled with a resin.
Claim 24
Dependent Claim
12 words
An optical transmission module using the optical assembly according to claim 12.
Claim 25
Dependent Claim
110 words
An optical assembly comprising: a semiconductor substrate; a pre-amplifier element mounted on said semiconductor substrate; and a semiconductor light receiving element mounted on said semiconductor substrate, wherein said pre-amplifier element is mounted on said semiconductor substrate directly or through a thin film layer, said semiconductor light receiving element is mounted on said semiconductor substrate through a dielectric layer, wherein a material inserted between said semiconductor light receiving element and said semiconductor substrate has a thickness which is greater than the thickness of a material inserted between said pre-amplifier element and said semiconductor substrate, and said semiconductor substrate includes an optical waveguide formed thereon, said optical waveguide including said dielectric layer.
Claim 26
Dependent Claim
110 words
An optical assembly comprising: a semiconductor substrate; a pre-amplifier element mounted on said semiconductor substrate; and a semiconductor light receiving element mounted on said semiconductor substrate, wherein said pre-amplifier element is mounted on said semiconductor substrate directly or through a thin film layer, said semiconductor light receiving element is mounted on said semiconductor substrate through a dielectric layer, wherein a material inserted between said semiconductor light receiving element and said semiconductor substrate has a thickness which is greater than the thickness of a material inserted between said pre-amplifier element and said semiconductor substrate, and said semiconductor substrate includes an optical waveguide formed thereon, said optical waveguide including said dielectric layer.
Claim 27
Dependent Claim
165 words
An optical assembly, comprising: a semiconductor substrate; an element generating a large amount of heat mounted on said semiconductor substrate; and a high impedance optical element mounted on said semiconductor substrate, wherein said element generating a large amount of heat is mounted on said semiconductor substrate directly or through a thin film layer, said high impedance optical element is mounted on said semiconductor substrate through a dielectric layer, said semiconductor substrate includes an optical waveguide formed thereon, said optical waveguide including said dielectric layer, wherein a material inserted between said high impedance optical element and said semiconductor substrate has a thickness which is greater than the thickness of a material inserted between said element generating a large amount of heat and said semiconductor substrate, and said optical waveguide has its optical axis adjusted to the optical axis of said element generating a large amount of heat, and said optical waveguide has its optical axis adjusted to the optical axis of said high impedance optical element.
Claim 28
Dependent Claim
165 words
An optical assembly, comprising: a semiconductor substrate; an element generating a large amount of heat mounted on said semiconductor substrate; and a high impedance optical element mounted on said semiconductor substrate, wherein said element generating a large amount of heat is mounted on said semiconductor substrate directly or through a thin film layer, said high impedance optical element is mounted on said semiconductor substrate through a dielectric layer, said semiconductor substrate includes an optical waveguide formed thereon, said optical waveguide including said dielectric layer, wherein a material inserted between said high impedance optical element and said semiconductor substrate has a thickness which is greater than the thickness of a material inserted between said element generating a large amount of heat and said semiconductor substrate, and said optical waveguide has its optical axis adjusted to the optical axis of said element generating a large amount of heat, and said optical waveguide has its optical axis adjusted to the optical axis of said high impedance optical element.
Claim 29
Dependent Claim
191 words
An optical assembly, comprising: a semiconductor substrate; an element generating a large amount of heat mounted on said semiconductor substrate; and a high impedance optical element mounted on said semiconductor substrate, wherein said element generating a large amount of heat is mounted on said semiconductor substrate directly or through a thin film layer, said high impedance optical element is mounted on said semiconductor substrate directly or through a thin film layer, said element generating a large amount of heat is forward biased, and said high impedance optical element is reverse biased, said element generating a large amount of heat and said high impedance optical element are mounted so that signal lines for said element generating a large amount of heat and said high impedance optical element are arranged at a side a distance from said semiconductor substrate, an optical waveguide having a dielectric layer is formed on said semiconductor substrate, and said optical waveguide has its optical axis adjusted to the optical axis of said element generating a large amount of heat, and said optical waveguide has its optical axis adjusted to the optical axis of said high impedance optical element.
Claim 30
Dependent Claim
191 words
An optical assembly, comprising: a semiconductor substrate; an element generating a large amount of heat mounted on said semiconductor substrate; and a high impedance optical element mounted on said semiconductor substrate, wherein said element generating a large amount of heat is mounted on said semiconductor substrate directly or through a thin film layer, said high impedance optical element is mounted on said semiconductor substrate directly or through a thin film layer, said element generating a large amount of heat is forward biased, and said high impedance optical element is reverse biased, said element generating a large amount of heat and said high impedance optical element are mounted so that signal lines for said element generating a large amount of heat and said high impedance optical element are arranged at a side a distance from said semiconductor substrate, an optical waveguide having a dielectric layer is formed on said semiconductor substrate, and said optical waveguide has its optical axis adjusted to the optical axis of said element generating a large amount of heat, and said optical waveguide has its optical axis adjusted to the optical axis of said high impedance optical element.
Claim 31
Dependent Claim
125 words
An optical assembly, comprising: a semiconductor substrate; an element generating a large amount of heat mounted on said semiconductor substrate; and a high impedance optical element mounted on said semiconductor substrate, wherein said element generating a large amount of heat is mounted on said semiconductor substrate directly or through a thin film layer, said high impedance optical element is mounted on said semiconductor substrate through a dielectric layer, wherein a material inserted between said high impedance optical element and said semiconductor substrate has a thickness which is greater than the thickness of a material inserted between said element generating a large amount of heat and said semiconductor substrate, and said semiconductor substrate includes an optical waveguide formed thereon, said optical waveguide including said dielectric layer.
Claim 32
Dependent Claim
125 words
An optical assembly, comprising: a semiconductor substrate; an element generating a large amount of heat mounted on said semiconductor substrate; and a high impedance optical element mounted on said semiconductor substrate, wherein said element generating a large amount of heat is mounted on said semiconductor substrate directly or through a thin film layer, said high impedance optical element is mounted on said semiconductor substrate through a dielectric layer, wherein a material inserted between said high impedance optical element and said semiconductor substrate has a thickness which is greater than the thickness of a material inserted between said element generating a large amount of heat and said semiconductor substrate, and said semiconductor substrate includes an optical waveguide formed thereon, said optical waveguide including said dielectric layer.
References Cited (Backward Citations)
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| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 2001-07-13 | 2002-01-12 | 2002-07-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-07-13 | 2006-01-12 | 2006-07-14 | $3760.00 | Window Closed / Lapsed |
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